A two-component thermally conductive silica gel sheet and its preparation method and equipment

Abstract

The invention provides a double-component heat conduction silica gel sheet which comprises two components. The component A comprises two-alkenyl end-capped dimethyl polysiloxane, double-hydroxyalkyl end-capped polysiloxane, double-hydroxy end-capped dimethyl siloxane, methyl vinyl siloxane copolymers, methyl vinyl cyclosiloxane, heat conduction fillers and epoxy modified silane coupling agents. The component B comprises phenyl hydrogen-contained silicone oil or a mixture of phenyl hydrogen-contained silicone oil and hydrogen-contained silicone oil, methyl vinyl cyclosiloxane and platinum catalysts. The component A and the component B are mixed according to the weight ratio of 1 to (0.7-1). The double-component heat conduction silica gel sheet can meet the demand for heat conduction of small and integrated equipment and has a higher heat conductivity coefficient on the premise of maintaining good comprehensive performance.

Description

technical field [0001] The invention relates to the technical field of synthesis and preparation of thermal interface materials, in particular to a two-component organic silicon thermal conductive film and its preparation method and equipment, which are suitable for heat transfer and heat dissipation between heating elements and heat dissipation elements . Background technique [0002] With the development of miniaturization and diversified functions of electronic equipment products, more and more components and functions will be integrated in tiny components, and the temperature will rise rapidly during use, which will easily lead to the degradation of the performance of electronic components and the speed of equipment operation. There are many problems such as slowing down and malfunctioning lights in equipment operation. Therefore, how to quickly and effectively take away more heat generated in miniaturized and integrated devices has become one of the important contents ...

AI Technical Summary

Problems solved by technology

However, the silicone heat-conducting materials in the prior art have the following defects: (1) Since the mixture material is a single-component material, the amount of heat-conducting filler added is limited, and the limitation of the content of heat-conducting filler per unit volume makes the thermal conductivity of the heat-conducting silica gel sheet Restricted, it is difficult to adapt to the requirements of more heat discharge. The thickness limit of the existing thermally conductive silicone sheet is 0.3mm. Under this thickness, the thermal conductivity of the thermally conductive silicone sheet can only reach 1.5W / mK at the highest; (2) due to The mixture material is a single-component material, and the storage stability of the raw materials during the preparation of the thermally conductive silicone sheet also has certain limitations, and it is easy to cause uneven curing. It is often necessary to add inhibitors to the composition formula to prolong the storage of the composition formula Stability and avoid uneven curing, and the addition of inhibitors needs to be strictly controlled to avoid impact on performance; (3) As more and more heat-conducting elements adopt special-shaped structures (such as "convex" shapes), existing The heat-conducting silicone sheet obtained in the technology often needs to be cut to adapt to the shape and structure of the heat-conducting element. Cutting will cause a lot of material loss and waste. For heating elements with special-shaped structures, the loss caused by only cutting can be reduced. As high as 30% or more; (4) The curing process of thermal silica gel sheet often needs to be vulcanized and added vulcanizing agent, causing serious environmental pollution, which is not conducive to environmental protection and human health. Although infrared curing does not have too many environmental problems, it still exists The problem of uncontrollable curing process and time is not conducive to the adjustment of production

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