Method for preparing high-strength high-conductivity copper alloy plate and strip

A copper alloy plate, high conductivity technology, applied in the field of copper alloy, can solve the problems of poor fatigue resistance, poor plasticity, low strength, etc., and achieve the effects of eliminating work hardening, increasing strength, and improving casting quality

Active Publication Date: 2016-02-24
山西春雷铜材有限责任公司
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Problems solved by technology

[0004] The present invention provides a method for preparing high-strength and high-conductivity copper alloy (TKB) strips in order to solv...

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  • Method for preparing high-strength high-conductivity copper alloy plate and strip
  • Method for preparing high-strength high-conductivity copper alloy plate and strip

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Embodiment Construction

[0020] The preparation method of TKB copper alloy strip includes the following steps:

[0021] (1) According to the effective volume of the power frequency cored induction furnace, the mass ratio is copper: chromium: silver: iron: silicon: titanium = 99.23: 0.55: 0.08: 0.06: 0.03: 0.05 for batching; the copper and iron The copper master alloy and silver are put into the furnace body of the power frequency cored induction furnace, and the surface of the melt is covered with a 50-100mm thick mixture of borax and glass powder (the mass ratio of borax to glass powder is 2:1). Melt at 1280-1300°C (1280°C, 1290°C, 1300°C). After smelting, add silicon and chromium to the furnace and raise the temperature to 1350°C for smelting. After smelting, add the titanium-copper master alloy to the furnace and keep it warm for 30 minutes. , Then lower the temperature to 1260-1280℃ (1260℃, 1270℃, 1280℃);

[0022] (2) The temperature of the above copper water is 1260℃-1280℃ (1280℃, 1270℃, 1260℃), and ...

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Abstract

The invention relates to the field of copper alloy, in particular to a method for preparing a high-strength high-conductivity copper alloy plate and strip. The technical problem that an existing high-strength high-conductivity copper alloy is low in strength and poor in plasticity and fatigue and looseness resistance is solved. The method for preparing the high-strength high-conductivity copper alloy plate and strip is based on the theory of solution strengthening, precipitation strengthening and work hardening. Hot rolling solution treatment is adopted, solute atoms are high in solubility at high temperature and exist in base copper in the solid solution form, solute elements have no time to be separated out after rapid cooling, and a supersaturated solid solution is formed. The solubility of Cr atoms and Ti atoms in the precipitation strengthening process is rapidly lowered, the Cr atoms and the Ti atoms are separated out of a matrix, and the matrix is diluted. The copper alloy plate and strip generates plastic deformation in the cold rolling process, grains slide, dislocation entanglement occurs, and the grains are stretched, crushed and fibrosed. The requirement for high strength, high yield and high conductivity is met, and therefore the final tensile strength, yield strength and conductivity of the TKB copper alloy plate and strip are improved.

Description

Technical field [0001] The invention relates to the field of copper alloys, in particular to a method for preparing high-strength and high-conductivity copper alloy strips. Background technique [0002] With the rapid development of the electronic technology field, the requirements for the tensile strength and yield strength of microalloyed high-strength and high-conductivity copper alloys are getting higher and higher. At present, the ideal tensile strength Rm of high-strength and high-conductivity copper alloys is desired. It is 520-620MPa, yield strength Rp0.2≥500MPa, elongation after fracture A11.3≥7%, conductivity ≥75%IACS, Vickers hardness HV is 160-190 (Vickers hardness value, no unit). [0003] At present, the problems of high-strength and high-conductivity copper alloys used in the field of electronic technology at home and abroad are: some alloys have low strength, poor plasticity, and poor fatigue relaxation resistance. Summary of the invention [0004] In order to solve...

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Application Information

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IPC IPC(8): C22C9/00C22C1/03C22F1/08B21C37/02
CPCB21C37/02C22C1/03C22C9/00C22F1/08
Inventor 张晓敏李华东李辉卫煜堂李晓博朱海峰张峰李红峰宁笃功
Owner 山西春雷铜材有限责任公司
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