Polyimide resin containing cyano groups, and applications thereof in preparing copper-clad laminates
A technology of polyimide resin and copper-clad foil, applied in the field of copper-clad foil, can solve the problems of low heat resistance and mechanical properties of copper-clad foil, large difference in thermal expansion coefficient, insufficient flexibility, etc., and achieve good dimensional stability. performance and mechanical properties, extended service life, easy-to-control effects
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Embodiment 1
[0032] This example is to prepare a two-layer non-adhesive single-sided flexible copper clad foil. In the general formula of the PI layer structure, when Ar is a biphenyl structure, X is a biphenyl structure, Y is a diphenyl ether structure, and the ringed Ar' It is a polyamic acid (PAA) and a flexible copper-clad foil material with a 3,3',4,4'-biphtalic dianhydride structure, a=0.4, b=0.3, and c=0.3.
[0033] 1) Pre-treat the surface of the copper foil, first soak the copper foil in CH 2 Cl 2 medium, ultrasonic treatment for 0.5h to remove the grease on the surface of the copper foil, soak the soaked copper foil in 0.5mol / L dilute sulfuric acid for 4h to remove the oxides on the surface of the copper foil, wash with distilled water 3 times, anhydrous ethanol for 3 times, drying;
[0034] 2) Preparation of PAA solution
[0035]Weigh 0.8369 g (2 mmol) of 1,4-bis(4-amino-2 cyanophenoxy) biphenyl, 0.2764 g (1.5 mmol) of benzidine, and 0.3004 g (1.5 mmol) of diphenyl ether diam...
Embodiment 2
[0041] Referring to Example 1, weigh 8.369g (20mmol) of 1,4-bis(4-amino-2cyanophenoxy)biphenyl, 2.764g (15mmol) of benzidine, and 3.004g (15mmol) of diphenyl ether diamine. Dissolve in 174mL of N,N-dimethylacetamide solution at room temperature (DMAC put in at 15% of the solid content of the system), stir for 20min to be completely dissolved, add 3,3',4,4'- Biphthalic dianhydride 14.711g (50mmol), keep the system in an anhydrous, clean and nitrogen environment, stir at 0°C for 48h, at this time, the reaction bottle is a light yellow transparent viscous liquid, diluted with DMAC and stirred for 4h After that, the solution was kept clean, dry, and room temperature for 24 hours to obtain a PAA solution with a concentration of 0.074 g / ml.
[0042] The following steps are performed according to the operation of Example 1, to obtain two layers of adhesive-free single-sided flexible copper-clad foil, and the performance parameters of the obtained flexible copper-clad foil and PI laye...
Embodiment 3
[0044] Referring to Example 1, 2) in the step, N,N-dimethylacetamide (DMAC) solution was replaced with N-methylpyrrolidone, and the add-on was 15.9mL (the DMAC put in by 15% of the solid content of the system mass), The rest of the operations remain the same. When proceeding to step 3), transfer the copper foil coated with the PAA solution to a clean, dry and flat environment for drying according to the following procedures, drying at 60°C for 24h, 80°C for 24h, and 120°C for 2h , dried at 150 °C for 1 h, and the rest of the operations were kept the same, to obtain two layers of adhesive-free single-sided flexible copper-clad foil. Compared with Example 1, the linear expansion coefficient of the obtained flexible copper-clad foil PI resin layer slightly increased, The CTE value was 33.24ppm / K.
[0045] The two-layer non-adhesive single-sided flexible copper-clad resin surface obtained above and the flat rolled copper foil with a thickness of 20 μm (electrolytic copper foil, ob...
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