A micro-arc oxidation assisted low temperature glass brazing method
A technology of low-temperature glass and micro-arc oxidation, applied in welding equipment, soldering irons, manufacturing tools, etc., can solve the problems of high viscosity of molten glass solder, poor chemical compatibility of solder, insufficient spreading and wetting, etc., and achieve airtightness Good performance, good protection, cost reduction and effective effect
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specific Embodiment approach 1
[0021] Specific implementation mode 1: The low-temperature glass brazing method assisted by micro-arc oxidation in this implementation mode is carried out according to the following steps:
[0022] 1. Mix the low-temperature sealing glass powder with the adhesive and place it in a solder paste mixer, and stir at a speed of 100-130r / min for 1-2 hours to obtain a low-temperature glass solder paste;
[0023] 2. Use cutting equipment to cut the base metal to be welded into shape to obtain weldments;
[0024] 3. Use water sandpaper to mechanically polish the weldment obtained in step 2, then place it in pickling solution for pickling, and finally place the weldment after pickling in acetone, and ultrasonically clean it at room temperature to obtain the pretreated weldment. pieces;
[0025] 4. Connect the pretreated weldment to the anode of the DC power supply, connect the stainless steel plate to the cathode of the DC power supply, and immerse it in the alkaline electrolyte at the...
specific Embodiment approach 2
[0029] Specific embodiment two: the difference between this embodiment and specific embodiment one is that when the low-temperature sealing glass powder described in step one is composed of 60 parts of PbO, 25 parts of ZnO, 6 parts of B 2 o 3 , 0.3 copies of A1 2 o 3 , 0.2 parts of SiO 2 and 0.3 part of Li 2 O composition. Other steps and parameters are the same as those in Embodiment 1.
[0030] In this embodiment, the low-temperature sealing glass frit is PbO-ZnO-B 2 o 3 system, the sealing temperature is between 420-480°C, and the coefficient of thermal expansion is 75-90×10 -7 / °C, the viscosity at sealing temperature is 10 2 ~10 5 Pa·s
specific Embodiment approach 3
[0031] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the particle size of the low-temperature sealing glass frit described in step 1 is 25-80 μm. Other steps and parameters are the same as those in Embodiment 1 or Embodiment 2.
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