Ultrasonic-assisted low-temperature glass brazing method
A technology of low-temperature glass and brazing method, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve problems such as high viscosity of molten glass, insufficient wetting and spreading, residual pores, etc., achieve good wettability, overcome Insufficient fluidity, the effect of improving strength
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Example Embodiment
[0019] Embodiment 1: The ultrasonic-assisted low-temperature glass brazing method of this embodiment is carried out according to the following steps:
[0020] 1. Mix the low-temperature sealing glass powder with the adhesive and place it in a solder paste mixer, and stir at a speed of 100-150 r / min for 1-2 hours to obtain a low-temperature glass solder paste;
[0021] 2. Use cutting equipment to cut the raw materials to be welded into shapes to obtain weldments;
[0022] 3. Place the weldment obtained in step 2 in acetone, carry out ultrasonic cleaning at room temperature, use water sandpaper to mechanically grind the ultrasonically cleaned weldment, then place it in acetone for ultrasonic cleaning, and finally transfer it to a drying oven Dry in the middle to obtain dry weldments;
[0023] 4. The low-temperature glass solder paste is evenly coated on the pre-connected position on the surface of the dry solder piece by screen printing to obtain the solder piece coated with th...
Example Embodiment
[0026] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the low-temperature sealing glass brazing filler metal in step 1 is changed from 50 parts by mass to 50 parts by mass. 2 O 5 , 12 parts SnO, 18 parts ZnO, 6 parts B 2 O 3 , 1 copy of A1 2 O 3 , 1 part SiO 2 and 0.5 parts Li 2 O composition. Other steps and parameters are the same as in the first embodiment.
[0027] The sealing temperature of the low-temperature sealing glass solder in this embodiment is 480-600° C., and the thermal expansion coefficient is 75-125×10 -7 / °C, the viscosity at the sealing temperature is 10 3 ~10 5 Pa·s.
Example Embodiment
[0028] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the particle size of the low-temperature sealing glass frit described in Step 1 is 25-75 μm. Other steps and parameters are the same as in the first or second embodiment.
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