Method for preparing vertical orientation graphene sheet/high polymer thermal interface material

A thermal interface material and vertical orientation technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of improved thermal conductivity, carbon nanotubes can not be well coupled with the matrix, etc., to achieve improved thermal conduction, easy industrial production, The effect of easy flow

Inactive Publication Date: 2016-05-04
PEKING UNIV +1
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  • Claims
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Problems solved by technology

However, carbon nanotubes cannot be well coupled with the substrate, and their boundary thermal resistance reach

Method used

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  • Method for preparing vertical orientation graphene sheet/high polymer thermal interface material
  • Method for preparing vertical orientation graphene sheet/high polymer thermal interface material

Examples

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Example Embodiment

[0017] Here are related experiments conducted according to the existing conditions of the laboratory.

[0018] 1. Preparation of graphene oxide

[0019] Mainly use natural flake graphite as the basic raw material and use the modified Hummers method to prepare graphene oxide. The preparation steps are as follows:

[0020] (1) Place 200ml of concentrated sulfuric acid in an Erlenmeyer flask, add 4g of sodium nitrate, place the Erlenmeyer flask in a water bath (add room temperature water), and stir until the sodium nitrate is completely dissolved in the concentrated sulfuric acid;

[0021] (2) Slowly add 4g of graphite during the stirring process, during which the temperature of the water bath is controlled below 8°C;

[0022] (3) Slowly add 18g potassium permanganate during the stirring process, and control the temperature of the water bath below 8°C;

[0023] (4) Seal the conical flask with a sealing film, add an appropriate amount of ice cubes to the water bath to keep the temperature at...

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Abstract

The invention provides a method for preparing a vertical orientation graphene sheet/high polymer thermal interface material, and belongs to the field of preparation of heat radiation materials. The method comprises the steps that a graphene nanosheet with superhigh thermal conductivity is firstly prepared; then a hot press molding process is utilized for preparing the graphene nanosheet into a thin film with certain thickness; finally, a layer of polymer (such as PDMS) is infiltrated into the surface of the thin film, then the thin film is wound into a cylinder, and the graphene thin film is vertically arranged in the cylinder. The process is simple, the procedure is easy to control, industrial production is convenient, and the method is suitable for bath production. Due to the fact that the hot press process is adopted, graphene cannot be agglomerated, a continuous structure is formed in graphene, a thermal conduction network is formed, and heat can fast pass. The vertical orientation graphene sheet/high polymer thermal interface material has the superhigh thermal conductivity, and can be widely applied to the fields of LED illumination, electromagnetic shielding, electronic information, communication equipment, aerospace, automobiles, household appliances and the like.

Description

technical field [0001] The invention belongs to the field of preparation of thermal interface materials, in particular to a preparation method of vertically oriented graphene sheets / high polymer thermal interface materials with high thermal conductivity. Background technique [0002] Thermal interface materials (Thermal Interface Materials, TIMs) are widely used in the field of heat dissipation of electronic components. It can be filled between electronic components and heat sinks to expel the air in them, so that the heat generated by electronic components can be transferred to heat dissipation through thermal interface materials more quickly. device, which plays an important role in reducing the working temperature and prolonging the service life. With the continuous improvement of chip integration and power consumption density, more and more heat is generated when the chip is working. If the heat cannot be dissipated through the radiator in time, the temperature of the el...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 白树林张亚飞
Owner PEKING UNIV
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