Thermal dissipation apparatus used for high-calorific-value electronic parts and components and preparation method for thermal dissipation apparatus

A technology of electronic components and heat dissipation devices, which is applied in the field of heat dissipation of high-calorie electronic components in laser display, can solve problems such as difficult to meet heat dissipation requirements and decline in heat dissipation effects, and achieve improved accumulation, lower surface energy levels, and thermal conductivity. big effect

Active Publication Date: 2016-05-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the use time increases, the metal heat sink is oxidized by the air, and a large amount of dust gathers on the surface, resulting in a decline in heat dissipation, and it is becoming more and more difficult to meet the heat dissipation needs of existing products.

Method used

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  • Thermal dissipation apparatus used for high-calorific-value electronic parts and components and preparation method for thermal dissipation apparatus
  • Thermal dissipation apparatus used for high-calorific-value electronic parts and components and preparation method for thermal dissipation apparatus
  • Thermal dissipation apparatus used for high-calorific-value electronic parts and components and preparation method for thermal dissipation apparatus

Examples

Experimental program
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Effect test

Embodiment 1

[0024] A method for preparing a heat dissipation device for high-calorie electronic components, first using detergent, acetone solution, deionized water and isopropanol solution to thoroughly clean the copper base, and drying after cleaning; on the surface of the copper base, use The heat dissipation coating was prepared by spin coating, and the film thickness was 5 μm. The heat dissipation coating was composed of the following raw materials in weight percentage: 5% graphene oxide, 10% glycerol, 0.7% fluorine-containing additive, and 7% hydroquinone , tetrahydrofuran 21%, shellac 56.3%; heat-curing treatment was carried out on the prepared heat-dissipating coating, and the treatment time was 30s;

Embodiment 2

[0026] A method for preparing a heat sink for electronic components with high calorific value. First, the aluminum substrate is thoroughly cleaned with detergent, acetone solution, deionized water and isopropanol solution, and then dried after cleaning; the surface of the substrate is sprayed The heat-dissipating coating was prepared by the method, and the film thickness was 20 μm. The heat-dissipating coating was composed of the following raw materials in weight percentage: 7% graphene oxide, 5% glycerol, 1.5% fluorine-containing additive, 5% hydroquinone, tetrahydrofuran 22.5%, shellac 59%; heat-cure the prepared heat-dissipating coating, and the processing time is 30s;

Embodiment 3

[0028] A method for preparing a heat sink for high-calorific electronic components. Firstly, the copper-aluminum alloy substrate is thoroughly cleaned with detergent, acetone solution, deionized water and isopropanol solution, and dried after cleaning; A heat-dissipating coating was prepared by a roller coating method with a film thickness of 50 μm. The heat-dissipating coating was composed of the following raw materials in weight percent: 15% graphene oxide, 20% glycerol, 0.5% fluorine-containing additive, 6.5% hydroquinone %, tetrahydrofuran 23%, shellac 35%; heat-curing treatment was carried out to the heat-dissipating coating prepared, and the treatment time was 30s;

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Abstract

The invention discloses a thermal dissipation apparatus used for high-calorific-value electronic parts and components and a preparation method for the thermal dissipation apparatus. The thermal dissipation apparatus comprises a thermal dissipation coating layer (1) and a metal substrate (2), wherein the thermal dissipation coating layer (1) is compounded by graphene oxide, glycerine, a fluorine-containing additive, hydroquinone, tetrahydrofuran and shell-lac based on a creation proportion. The graphene oxide with high thermal conductivity, high radiation and high specific surface area is taken as the main thermal dissipation medium, and the graphene oxide is uniformly dispersed in solvent to prepare the coating; and the shell-lac and the fluorine-containing additive are introduced, so that the interface matching characteristic between the metal substrate and the thermal dissipation coating layer is effectively improved; erosion on the metal substrate by water and oxygen is isolated; meanwhile, dust accumulation on the surface of the thermal dissipation apparatus is weakened, so that the service life of the thermal dissipation apparatus is prolonged; problems existing in thermal dissipation of the high-calorific-value electronic parts and components can be solved by the thermal dissipation apparatus; and furthermore, the thermal dissipation apparatus has the features of high thermal dissipation efficiency, simple preparation process, long service life and green and environmental protection property.

Description

technical field [0001] The invention relates to a heat dissipation device for high calorific value electronic components and a preparation method thereof, in particular to a graphene oxide-based heat dissipation coating and a preparation method thereof, which are mainly applicable to the heat dissipation field of high calorific value electronic components in laser display . Background technique [0002] With the rapid development of microelectronics technology, the integration of electronic products in the field of microelectronics is getting higher and higher, and the power consumption is also increasing. Electronic components have a huge impact, which greatly restricts the performance and service life of electronic components, and has become an urgent problem to be solved. [0003] At present, in order to solve the heat dissipation requirements of various high-heat-generating electronic components, metal heat sinks with high thermal conductivity, such as copper and alumin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20C09D193/02C09D7/12
CPCC08L2201/08C09D7/61C09D7/63C09D7/65C09D193/02H05K7/2039C08L27/12C08K3/04C08K5/053C08K5/13
Inventor 于军胜范惠东吴非蒋一鸣
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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