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Preparation method of magnesium-nickel-copper ternary solder alloy based on vacuum diffusion reaction

A vacuum diffusion and reaction technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of difficult to control the composition ratio, poor microstructure uniformity, and low purity of the solder alloy, and achieve a dense and uniform structure. , Good spreading and wettability, easy control of process parameters

Active Publication Date: 2016-06-22
东营市东凯新材料技术研发有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, magnesium-aluminum, magnesium-zinc, magnesium-indium, magnesium-aluminum-zinc and other binary or ternary eutectic solder alloys have been prepared by smelting, but due to the strong chemical Due to its activity and high temperature, it is easy to evaporate and has a huge difference with other components in physical and chemical properties such as melting point, thermal conductivity, and density. The solder alloys prepared by smelting generally have low purity, difficult to control the composition ratio, and microscopic The problem of poor microstructure uniformity has become a bottleneck restricting the development of magnesium alloy brazing technology

Method used

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  • Preparation method of magnesium-nickel-copper ternary solder alloy based on vacuum diffusion reaction
  • Preparation method of magnesium-nickel-copper ternary solder alloy based on vacuum diffusion reaction
  • Preparation method of magnesium-nickel-copper ternary solder alloy based on vacuum diffusion reaction

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Experimental program
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Effect test

Embodiment 1

[0018] The method for preparing magnesium-nickel-copper ternary solder alloy in this embodiment comprises the following steps:

[0019] Step 1. Pretreat the magnesium plate, nickel plate and copper plate respectively to remove oil and impurities on the surface of the magnesium plate, nickel plate and copper plate. The geometric dimensions of the pretreated magnesium plate, nickel plate and copper plate are 200mm×200mm×64mm , 200mm × 200mm × 1mm and 200mm × 200mm × 6mm; the pretreatment method is: first use No. 400, No. 600, No. 800, No. 1000, No. 1500 and No. 2000 sandpaper to polish the magnesium plate and copper plate successively, and then use Clean the polished magnesium and copper plates with distilled water, and finally use anhydrous ethanol to ultrasonically remove the oil and impurities attached to the surface of the nickel plate, the cleaned magnesium plate and copper plate;

[0020] Step 2, placing the pretreated nickel sheet in step 1 between the pretreated magnesiu...

Embodiment 2

[0024] The method for preparing magnesium-nickel-copper ternary solder alloy in this embodiment comprises the following steps:

[0025] Step 1. Pretreat the magnesium plate, nickel plate and copper plate respectively to remove oil and impurities on the surface of the magnesium plate, nickel plate and copper plate. The geometric dimensions of the pretreated magnesium plate, nickel plate and copper plate are 500mm×500mm×128mm , 500mm × 500mm × 2mm and 500mm × 500mm × 12mm; the pretreatment method is: first use No. 400, No. 600, No. 800, No. 1000, No. 1500 and No. 2000 sandpaper to polish the magnesium plate and copper plate, and then use Clean the polished magnesium and copper plates with distilled water, and finally use anhydrous ethanol to ultrasonically remove the oil and impurities attached to the surface of the nickel plate, the cleaned magnesium plate and copper plate;

[0026] Step 2, placing the pretreated nickel sheet in step 1 between the pretreated magnesium plate and...

Embodiment 3

[0030] The method for preparing magnesium-nickel-copper ternary solder alloy in this embodiment comprises the following steps:

[0031] Step 1. Pretreat the magnesium plate, nickel plate and copper plate respectively to remove oil stains and impurities on the surface of the magnesium plate, nickel plate and copper plate. The geometric dimensions of the pretreated magnesium plate, nickel plate and copper plate are 1000mm×1000mm×192mm , 1000mm × 1000mm × 3mm and 1000mm × 1000mm × 18mm; the pretreatment method is: first use No. 400, No. 600, No. 800, No. 1000, No. 1500 and No. 2000 sandpaper to polish the magnesium plate and copper plate, and then use Clean the polished magnesium and copper plates with distilled water, and finally use anhydrous ethanol to ultrasonically remove the oil and impurities attached to the surface of the nickel plate, the cleaned magnesium plate and copper plate;

[0032] Step 2, placing the pretreated nickel sheet in step 1 between the pretreated magnesiu...

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Abstract

The invention discloses a preparation method of a magnesium-nickel-copper ternary solder alloy based on a vacuum diffusion reaction. The method comprises the following steps of (1) respectively pretreating a magnesium board, a nickel piece and a copper board, so as to remove oil stains and impurities from the surfaces of the magnesium board, the nickel piece and the copper board; (2) putting the pretreated nickel piece between the pretreated magnesium board and the pretreated copper board, so as to obtain an assembly, then arranging graphite paper on the upper and lower surfaces of the assembly as solder masks, and finally, putting the assembly of which the graphite paper is arranged on the upper and lower surfaces in a vacuum chamber of a diffusion furnace for the vacuum diffusion reaction, so as to obtain the magnesium-nickel-copper ternary solder alloy. According to the preparation method, the nickel piece is used as an interlayer, and the interdiffusion of magnesium, nickel and copper is utilized, so that a ternary eutectic reaction can occur at low temperature, the magnesium-nickel-copper ternary solder alloy which has the advantages of high purity, approach to eutectic composition and dense and uniform structure is prepared in situ in a vacuum environment, a melting point is about 500 DEG C, and the effect of good spreading wettability is achieved.

Description

technical field [0001] The invention belongs to the technical field of preparing magnesium-based solder alloys, and in particular relates to a method for preparing magnesium-nickel-copper ternary solder alloys based on vacuum diffusion reaction. Background technique [0002] Magnesium and its alloys are one of the lightest and cheapest metal structural materials that can be applied in industry, and have been applied and played an important role in the fields of aviation, aerospace, automobiles and electronic equipment. As a new type of high-performance structural material, magnesium alloy inevitably adopts a welded structure in practical applications, and brazing is one of the preferred welding methods. Magnesium resources are of great significance. In recent years, the research on magnesium alloy brazing has made some progress, but there is still a considerable distance from large-scale application. So far, magnesium-aluminum, magnesium-zinc, magnesium-indium, magnesium-a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28B23K35/40
CPCB23K35/284B23K35/40
Inventor 杜双明韩赟杜晨马天洋
Owner 东营市东凯新材料技术研发有限责任公司