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Curable composition, curing product, and method for using curable composition

A technology of curable composition and cured product, applied in the direction of adhesive additives, non-polymer adhesive additives, instruments, etc., to achieve the effect of excellent durability and excellent adhesion

Inactive Publication Date: 2016-07-06
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, even in the cured products of the optical element fixing material compositions mainly composed of polysilsesquioxane compounds described in Patent Documents 1 to 3, it may be difficult to obtain heat resistance while maintaining sufficient adhesive force. sex and transparency

Method used

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  • Curable composition, curing product, and method for using curable composition
  • Curable composition, curing product, and method for using curable composition
  • Curable composition, curing product, and method for using curable composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0073] The method for producing the silane compound polymer (A) is not particularly limited. For example, as described below, by making equation (1): R 1 Si(OR 2 ) u (X 1 ) 3-u The silane compound (1) shown above is condensed to prepare the silane compound polymer (A). Here, "condensation" is used as a broad concept including hydrolysis and polycondensation reactions.

[0074] In formula (1), R 1 Indicates the same meaning as above. R 2 Represents an alkyl group with 1 to 10 carbon atoms, X 1 represents a halogen atom, and u represents an integer of 0-3.

[0075] as R 2 The alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, tert-butyl and the like.

[0076] as X 1 The halogen atom includes chlorine atom, bromine atom and the like.

[0077] When u is 2 or more, OR 2 They may be the same or different from each other. In addition, when (3-u) is 2 or more, X 1 They may be the same or different from eac...

Embodiment

[0246] Next, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to the following examples.

[0247] (Weight average molecular weight measurement)

[0248] About the weight average molecular weight (Mw) of the silane compound polymer obtained by the following preparation example, it measured with the following apparatus and conditions using the standard polystyrene conversion value.

[0249] Device name: HLC-8220GPC, manufactured by TOSOH;

[0250] Column: TSKgelGMHXL, TSKgelGMHXL and TSKgel2000HXL are connected sequentially;

[0251] Solvent: tetrahydrofuran;

[0252] Injection volume: 80 mu l;

[0253] Measuring temperature: 40°C;

[0254] Flow rate: 1ml / min;

[0255] Detector: Differential refractometer.

[0256] (Measurement of IR spectrum)

[0257] The IR spectrum of the silane compound polymer obtained in the production example was measured using a Fourier transform infrared...

preparation example 1

[0259] After charging 71.37g (400mmol) of methyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd.) into a 300ml eggplant-shaped flask, 0.20g (2mmol) of phosphoric acid dissolved in 21.6 ml of distilled water to obtain an aqueous solution of phosphoric acid. After adding the phosphoric acid aqueous solution, stirring of the contents was continued at 30° C. for 2 hours, and then, stirring of the contents was continued at 70° C. for 5 hours.

[0260] Next, the organic layer was repeatedly washed with pure water until the pH value of the aqueous layer became 4, and then the organic layer was concentrated using an evaporator. Silane compound polymer 1 (53.5 g) was obtained by vacuum-drying the obtained concentrate. The weight average molecular weight of the silane compound polymer 1 was 8780, and the molecular weight distribution was 5.25.

[0261] The IR spectrum data of the silane compound polymer 1 are shown below.

[0262] Si-CH 3 : 1272cm -1 ,1409cm -1 , Si-O...

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Abstract

The present invention is: a curable composition characterized by containing component (A) and component (B) at a weight ratio that is the fraction [component (A): component (B)] = 100:0.1 to 100:50; a curing product resulting from curing the composition; and a method for using the composition as an optical element adhesive or an optical element sealing agent. Component (A) is a silane compound polymer indicated by formula (a-1) (where in the formula: R1 represents a group selected from an alkyl group having 1-20 carbon atoms, a cycloalkyl group having 3-10 carbon atoms, or a substituted or unsubstituted aryl group having 6-20 carbon atoms; Z represents a hydroxyl group, an alkoxy group having 1-10 carbon atoms, or a halogen atom; m represents a positive integer; n and o each independently represent 0 or a positive integer; and the instances of R1 and the instances of Z respectively may be the same or different), and compound (B) is a silane coupling agent having a sulfur-atom-containing functional group in the molecule.

Description

technical field [0001] The present invention relates to a curable composition capable of obtaining a cured product excellent in transparency, heat resistance, and adhesiveness, and also excellent in durability against temperature changes; a cured product formed by curing the composition; and a combination of the above A method in which a substance is used as an adhesive for an optical element or a sealant for an optical element. Background technique [0002] In recent years, curable compositions have begun to be used as compositions for optical element fixing materials such as adhesives for optical elements and sealing agents for optical elements when producing sealed optical elements. [0003] Optical elements include various lasers such as semiconductor lasers (LDs), light-emitting elements such as light-emitting diodes (LEDs), light-receiving elements, composite optical elements, and optical integrated circuits. In recent years, optical elements emitting blue light or wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/28C09J11/06C09J183/04
CPCC08G77/28C08G77/04C08G77/26C09J183/08C08K5/548C08K5/5435C09J183/04G02B6/4239G02B6/00C08K5/5477C08L83/04C08G77/392
Inventor 松井优美樫尾干广
Owner LINTEC CORP
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