A kind of diamond resin grinding wheel and preparation method thereof
A resin grinding wheel and diamond technology, used in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc., can solve the problems of poor grinding precision workpiece surface roughness, short service life, uneven mixing, etc. Low noise, long service life, and the effect of reducing oxygen concentration
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0060] The preparation method of the diamond resin emery wheel that is not provided with transition layer comprises the steps:
[0061] Step 1. Mold and matrix processing: Design and process the hot-pressed steel mold and matrix according to the shape and size of the pre-prepared grinding wheel.
[0062] Step 2. Powder reduction: reduce the required metal powder to obtain the reduced metal powder; the reducing agent used in the reduction treatment is hydrogen, and the temperature is 300-750°C. For example: Cu powder is 320°C, Ni powder , Co powder is used at 380°C, Fe powder is used at 720°C, and the reduction treatment time is not less than 30min.
[0063] This reduction treatment is to reduce the concentration of oxygen element that may exist in the metal powder, so as to ensure the high purity of the metal powder and better performance of the grinding wheel.
[0064]Step 3. Preparation of working layer powder: Weigh the resin powder, reduced metal powder, metal oxide powde...
Embodiment 1
[0078] This embodiment is a diamond resin grinding wheel without a transition layer and a preparation method thereof.
[0079] The diamond resin emery wheel of the present embodiment comprises the raw material of following weight ratio:
[0080] Working layer: phenolic resin powder 62, Cu powder 47, ZnO powder 17, Cr 2 o 3 Powder 13, graphite powder 6, BC powder 10;
[0081] Wetting agent: triethanolamine 3;
[0082] It also includes: diamond powder accounting for 15% by weight of the working layer, with a particle size of 180 mesh.
[0083] The base material of this embodiment is aluminum.
[0084] The preparation method of the diamond resin grinding wheel of the present embodiment may further comprise the steps:
[0085] (1) Mold and substrate processing: Design and process the hot-pressed steel mold and substrate according to the grinding wheel specification 1A1 350x25x127x10; wherein, the peripheral surface of the substrate is knurled.
[0086] (2) Powder reduction: ...
Embodiment 2
[0094] This embodiment is a diamond resin grinding wheel including a transition layer and a preparation method thereof.
[0095] The diamond resin emery wheel of the present embodiment comprises the raw material of following weight ratio:
[0096] Working layer: polyimide resin powder 48, CuSn10 powder 50, CaO powder 28, Fe 2 o 3 Powder 16, MoS 2 Powder 12, SiC powder 8;
[0097] Wetting agent for the working layer: phenolic resin solution 3;
[0098] It also includes: copper-coated diamond powder accounting for 25% by weight of the working layer, with a particle size of 120 mesh;
[0099] Transition layer: polyimide resin powder 40, Cu powder 74, CaO powder 25, Fe 2 o 3 powder 20;
[0100] Wetting agent for the transition layer: phenolic resin liquid 3.
[0101] The base material of this embodiment is steel.
[0102] The preparation method of the diamond resin grinding wheel of the present embodiment may further comprise the steps:
[0103] (1) Mold and substrate pr...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle size (mesh) | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com