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Semiconductor structure and method for preparing semiconductor structure

A technology of semiconductors and nitride semiconductors, which is applied in the directions of semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., and can solve the problems that are difficult to meet the requirements of high-performance solar cell light-emitting diodes, difficult to obtain crystal preferred orientation semiconductor films, and needs to be improved, etc. problem, to achieve the effect of reducing preparation cost, reducing requirements and improving performance

Active Publication Date: 2018-06-22
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, epitaxial growth or sputtering deposition methods can be used to obtain semiconductor thin films on the glass surface. The semiconductor thin films prepared by these methods are either amorphous materials or polycrystalline materials without crystal preferred orientation. It is difficult to obtain semiconductors with good crystal preferred orientation. Thin films, difficult to meet the requirements of high-performance solar cells or light-emitting diodes
[0003] Therefore, the current semiconductor technology for preparing nitride semiconductor materials based on glass or metal substrates still needs to be improved.

Method used

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  • Semiconductor structure and method for preparing semiconductor structure
  • Semiconductor structure and method for preparing semiconductor structure
  • Semiconductor structure and method for preparing semiconductor structure

Examples

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Embodiment 1

[0080] Embodiment 1: Graphene, the first nitride semiconductor (AlN) layer are grown on the nickel-based superalloy substrate

[0081] A nickel-based superalloy (GH3536) is used as a substrate, and a textured superalloy sheet is formed by rolling and annealing at 1000 degrees Celsius for 2 hours in a nitrogen atmosphere. The sheet is washed and then dried.

[0082] First prepare the graphene layer: put the high-temperature alloy sheet into a chemical vapor deposition system, heat it to 1000 degrees Celsius, the air pressure is 200 Torr, the flow rate of methane is 50ml / min, and the flow rate of argon gas is 500ml / min, and then quickly cool down to room temperature. The flow rate is 2000ml / min, the hydrogen flow rate is 500ml / min, and the cooling rate is 10 degrees / second. After cooling down, a graphene layer is obtained on the surface of the superalloy sheet.

[0083] Then magnetron sputtering is used to deposit the first nitride semiconductor layer AlN, Al is used as the sp...

Embodiment 2

[0086] Embodiment 2: Growing a first nitride semiconductor (AlN) layer and a second nitride semiconductor (GaN) layer on a metal substrate

[0087] The steps of growing the first nitride semiconductor layer of AlN are the same as in Embodiment 1, the difference is that after the first nitride semiconductor layer is obtained by sputtering, the pulsed magnetron sputtering process is continued, GaN is used as the sputtering target, Deposition was performed under nitrogen atmosphere. The sputtering power is 300W, the duty cycle of the pulse power supply is 0.05, and the vacuum degree is 1E -7torr, the sputtering argon pressure is 10mtorr, the substrate temperature is 600 degrees Celsius, and the growth rate is controlled to be about 30nm / h. The obtained nitride semiconductor layer has a thickness of 30 nm. Subsequently, the film obtained by sputtering was annealed under a nitrogen atmosphere, the annealing temperature was 1000 degrees Celsius, and the annealing time was 2 hours....

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Abstract

The invention discloses a semiconductor structure and a preparation method thereof. Specifically, the method comprises the following steps: (1) providing a substrate; (2) arranging a graphene layer on the upper surface of the substrate; and (3) forming a first nitride semiconductor layer on the upper surface of the graphene layer through sputtering deposition to get the semiconductor structure, wherein the first nitride semiconductor layer has crystal preferred orientation. Therefore, the preparation cost is reduced, the preparation technology is simplified, and a first nitride semiconductor layer with crystal preferred orientation is obtained.

Description

technical field [0001] The invention relates to the field of semiconductor technology and semiconductor manufacturing, in particular, the invention relates to a semiconductor structure and a method for preparing the semiconductor structure. Background technique [0002] In the field of semiconductor technology, the substrates of solar cells or light emitting diodes (LEDs) are mostly glass or metal. Using glass as the substrate can take advantage of the light transmittance of glass, and the cost is low, so it has good application prospects; using metal as the substrate, you can use the good electrical conductivity of metal to improve device performance, or use flexible metal film lining Fabrication of flexible semiconductor devices. However, for solar cells or LEDs with better performance, the semiconductor materials therein are generally required to be single crystals or polycrystals with good crystal orientation consistency, that is, the crystals therein have a preferred o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L33/00
CPCH01L31/1804H01L33/0054Y02P70/50
Inventor 肖磊王子巍王敬梁仁荣
Owner TSINGHUA UNIV