Semiconductor structure and method for preparing semiconductor structure
A technology of semiconductors and nitride semiconductors, which is applied in the directions of semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., and can solve the problems that are difficult to meet the requirements of high-performance solar cell light-emitting diodes, difficult to obtain crystal preferred orientation semiconductor films, and needs to be improved, etc. problem, to achieve the effect of reducing preparation cost, reducing requirements and improving performance
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Embodiment 1
[0080] Embodiment 1: Graphene, the first nitride semiconductor (AlN) layer are grown on the nickel-based superalloy substrate
[0081] A nickel-based superalloy (GH3536) is used as a substrate, and a textured superalloy sheet is formed by rolling and annealing at 1000 degrees Celsius for 2 hours in a nitrogen atmosphere. The sheet is washed and then dried.
[0082] First prepare the graphene layer: put the high-temperature alloy sheet into a chemical vapor deposition system, heat it to 1000 degrees Celsius, the air pressure is 200 Torr, the flow rate of methane is 50ml / min, and the flow rate of argon gas is 500ml / min, and then quickly cool down to room temperature. The flow rate is 2000ml / min, the hydrogen flow rate is 500ml / min, and the cooling rate is 10 degrees / second. After cooling down, a graphene layer is obtained on the surface of the superalloy sheet.
[0083] Then magnetron sputtering is used to deposit the first nitride semiconductor layer AlN, Al is used as the sp...
Embodiment 2
[0086] Embodiment 2: Growing a first nitride semiconductor (AlN) layer and a second nitride semiconductor (GaN) layer on a metal substrate
[0087] The steps of growing the first nitride semiconductor layer of AlN are the same as in Embodiment 1, the difference is that after the first nitride semiconductor layer is obtained by sputtering, the pulsed magnetron sputtering process is continued, GaN is used as the sputtering target, Deposition was performed under nitrogen atmosphere. The sputtering power is 300W, the duty cycle of the pulse power supply is 0.05, and the vacuum degree is 1E -7torr, the sputtering argon pressure is 10mtorr, the substrate temperature is 600 degrees Celsius, and the growth rate is controlled to be about 30nm / h. The obtained nitride semiconductor layer has a thickness of 30 nm. Subsequently, the film obtained by sputtering was annealed under a nitrogen atmosphere, the annealing temperature was 1000 degrees Celsius, and the annealing time was 2 hours....
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