Chemically amplified photosensitive resin composition and insulating film produced therefrom
A photosensitive resin, chemical amplification technology, used in chemical recycling, photosensitive materials for opto-mechanical equipment, optics, etc., can solve the problems that are not mentioned, and achieve the effect of improving fluidity, improving transmittance, and high sensitivity
Active Publication Date: 2020-10-09
DONGWOO FINE CHEM CO LTD
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Problems solved by technology
[0007] Furthermore, no residue remains on the above-mentioned insulating film, protective film, etc., and stability over time is the most important factor. However, it is actually difficult to ensure formability and stability over time while satisfying the above-mentioned characteristics.
[0008] Patent Document 1 discloses a positive-type photosensitive resin composition comprising a phenolic resin modified by a compound having an unsaturated hydrocarbon group, a compound utilizing photogenerated acid, a thermal crosslinking agent, and a solvent, and has thermal shock resistance and adhesion. Excellent performance, but there is no mention of solutions to the above-mentioned problems
Method used
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experiment example
[0190] The following evaluations were performed about the resin compositions produced in Examples and Comparative Examples, and the results are described in Table 2 below.
[0191] (1) Sensitivity measurement
[0192] On a 0.7 mm thick glass substrate (Corning 1737, manufactured by Corning Corporation), a spin coater was used to apply the photosensitive resin compositions of Examples and Comparative Examples, respectively, and to heat the solvent on a hot plate at 100° C. for 125 seconds. It was volatilized to form a photosensitive resin composition layer with a thickness of 4.0 μm.
[0193] Then, in order to obtain a contact hole pattern with a diameter of 10 μm, exposure was performed with an i-line stepper (NSR-205i11D, manufactured by Nikon Co., Ltd.) using a mask having an opening in a quadrangular pattern with sides of 10 μm in the exposure portion.
[0194] The exposed substrate was subjected to immersion development at 23° C. for 40 seconds using 2.38% aqueous tetrame...
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The invention provides a chemically amplified photosensitive resin composition and an insulation layer prepared from the same. The chemically amplified photosensitive resin composition comprises binder resin (A) including (a-1) acid decomposition radical protection resin including phenolic hydroxyl groups or at least part of carboxyl, (a-2) crylic acid resin including epoxy groups and (a-3) crylic acid resin including oxygen heterocyclic butyl alkyl, (B) a photoacidGenerator, and a (C) solvent, thereby obtaining an insulation layer which ensure excellent radiopacity, improved sensitivity, pattern permeability and inclination and ageing stability.
Description
technical field [0001] The present invention relates to a chemically amplified photosensitive resin composition and an insulating film produced therefrom. Background technique [0002] In display devices such as thin-film transistor (TFT) type liquid crystal display devices, inorganic protective films such as silicon nitride have been used as protective films for protecting and insulating TFT (thin-film transistor) circuits. Since the constant is high, there is a problem that the aperture ratio does not increase, and in order to solve this problem, the need for an organic insulating film with a low dielectric constant tends to increase. [0003] As such an organic insulating film, a photosensitive resin that is a polymer compound whose solubility to a specific solvent changes by chemical reaction with light and electron beams is generally used, and the polarity of the polymer caused by the photoreaction of the above-mentioned organic insulating film Microfabrication of circ...
Claims
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IPC IPC(8): G03F7/039G03F7/004
CPCG03F7/004G03F7/0392Y02P20/582G03F7/0382
Inventor 任玟柱崔硕均梁敦植
Owner DONGWOO FINE CHEM CO LTD