Polymer flexible interdigital electrode and processing method thereof
A technology of interdigitated electrodes and processing methods, applied in medical science, sensors, diagnostic recording/measurement, etc., can solve problems such as large noise and errors, changes in electrical characteristics of conductive gel, complex production processes, etc., and achieve stable electrical signal baselines , Improve wearing comfort and high detection sensitivity
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Embodiment 1
[0033] This embodiment provides a polymer flexible interdigital electrode, the interdigital electrode from bottom to top is: substrate 1, buffer layer 2 and conductive layer 3; wherein, the substrate material is composed of polydimethylsilane; The above-mentioned conductive layer is a metal layer formed of Ag.
[0034] The buffer layer is an alloy layer formed of Ti / W (mass ratio is 1:1); the thickness of the substrate is 0.1 mm, the thickness of the buffer layer is 25 μm; the thickness of the conductive layer is 20 μm.
[0035] The surface resistivity value of the polymer flexible interdigitated electrode at 25 ° C circuit is 1.80 × 10 -8 Ω·m.
Embodiment 2
[0037] This embodiment provides a polymer flexible interdigital electrode, the interdigital electrode from bottom to top is: substrate 1, buffer layer 2 and conductive layer 3; wherein, the substrate material is natural rubber; the conductive layer A metal layer formed for Pd.
[0038] The buffer layer is an alloy layer formed by Mo / W (the mass ratio of Mo and W is 1:1); the thickness of the substrate is 0.48 mm, and the thickness of the buffer layer is 25 µm; the thickness of the conductive layer is is 20µm.
[0039] The surface resistivity value of the polymer flexible interdigitated electrode at 25 ° C circuit is 1.92 × 10 -8 Ω·m.
Embodiment 3
[0041] This embodiment provides a polymer flexible interdigital electrode, the interdigital electrode from bottom to top is: substrate 1, buffer layer 2 and conductive layer 3; wherein, the substrate material is polyimide; the The conductive layer is a metal layer formed of Au.
[0042] The buffer layer is an alloy layer formed of Mo / W (the mass ratio of Mo and W is 1:1); the thickness of the substrate is 0.48 mm; the thickness of the buffer layer is 10 μm; the thickness of the conductive layer is 10 μm.
[0043] The surface resistivity value of the polymer flexible interdigitated electrode at 25 ° C circuit is 1.92 × 10 -8 Ω·m.
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