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Cyanide-free copper electro-plating solution, preparation method and using method thereof

A technology for electroplating copper and solution, applied in the field of material science, can solve the problems of poor adhesion between the coating and the substrate, narrow current density range, low current efficiency, etc., achieve potential application prospects and economic benefits, and improve current density range and cost. low cost effect

Active Publication Date: 2016-10-12
GUIZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a cyanide-free electroplating copper solution and its preparation method and use method, which not only realizes the clean production of the electroplating copper process, avoids the use of highly toxic substances, but also solves the problem of insufficient bonding between the coating and the substrate. Good and fine grain, narrow range of current density, low current efficiency, in order to overcome the shortcomings of the existing technology

Method used

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  • Cyanide-free copper electro-plating solution, preparation method and using method thereof
  • Cyanide-free copper electro-plating solution, preparation method and using method thereof
  • Cyanide-free copper electro-plating solution, preparation method and using method thereof

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Embodiment 1

[0018] Embodiment 1 of the present invention: a non-cyanide copper electroplating solution, wherein the concentration of copper sulfate is 45g / L, the concentration of succinimide is 100g / L, the concentration of potassium nitrate is 25g / L, and the concentration of citric acid is 20g / L, the concentration of triethanolamine is 30g / L, the concentration of potassium hydroxide is 40g / L, and the solvent is water.

Embodiment 2

[0019] Embodiment 2 of the present invention: a method for preparing a non-cyanide copper electroplating solution, including the following steps: selecting each component and the amount of solvent according to the above concentration;

[0020] 1) Dissolve potassium nitrate in the succinimide solution to obtain solution A

[0021] 2) Add citric acid and triethanolamine to solution A separately to obtain solution B;

[0022] 3) Add potassium hydroxide solution to adjust the pH of solution B to 9-10 to obtain solution C;

[0023] 4) Dissolve copper sulfate in distilled water, then slowly add the acid copper solution to solution C, and keep stirring to obtain solution D;

[0024] 5) Add potassium hydroxide solution again, adjust the pH of solution D to 9-10, and fix the volume to obtain the finished product.

Embodiment 3

[0025] Embodiment 3 of the present invention: The method of using the cyanide-free copper electroplating solution. The cyanide-free copper electroplating solution is used for cyanide-free copper plating on the surface of carbon steel. The process steps are as follows:

[0026] Mechanical polishing → deionized water washing → degreasing → deionized water washing → activation → deionized water washing → copper electroplating → deionized water washing → passivation (anti-tarnish treatment) → deionized water washing → drying

[0027] In the electroplating process, the electroplating temperature is 30~40℃, and the current density is 0.2~8A / dm 2 , The time is 20-40min, and the molar ratio of copper ion to succinimide is 1:6.

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Abstract

The invention discloses a cyanide-free copper electro-plating solution, the preparation method and the using method thereof. In the invention, succinimide is used as a lord complexing agent for electro-plating copper on a steel matrix surface; copper sulfate is used as the main salt; and nitrate of potash is added as a conducting salt, thereby enlarging the current density range effectively; at the same time, citric acid, triethanolamine and the nitrate of potash are added into the plating solution to solve the problems including the binding force between the plating layer and the matrix is poor, the crystalline grains are not fine and the current efficiency is not high. The solution and methods disclosed by the invention can be applied in the bright copper plating and bottom copper plating for carbon steel and brass surfaces, and can achieve excellent surface treatment effects. The invention has the advantages of simple method, stable plating solution property, convenient using, fine-enough plating layer crystallization, smooth appearance, good environmental Friendliness and low cost; and the purity of the plating layer is comparable to that of the cyanide electro-plating. The invention has potential application prospect and economic benefit.

Description

Technical field [0001] The invention relates to the field of material science and technology, in particular to a cyanide-free copper electroplating solution and its preparation method and use method. Background technique [0002] With the country’s increasing efforts to eliminate cyanide electroplating processes and people’s increasing awareness of environmental protection, research on cyanide-free copper plating technology has attracted much attention in recent years. Good adhesion between the coating and the substrate and a wide range of current density are key technical indicators for the application of the cyanide-free copper plating process. A large part of the existing cyanide-free copper plating process is due to the poor adhesion between the coating and the substrate. The density range is narrow, far inferior to cyanide copper plating. The complexing agents of the non-cyanide alkaline copper plating process that have been researched and developed mainly include pyrophosph...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 刘定富毕晨
Owner GUIZHOU UNIV
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