Epitaxial growth method capable of improving deep-ultraviolet LED luminous performance
A technology of epitaxial growth and luminous performance, which is applied in crystal growth, single crystal growth, single crystal growth, etc., can solve stress problems, epitaxial layer cracks and other problems, reduce lattice mismatch, improve luminous performance, improve Effects of crystal quality and surface topography
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Embodiment 1
[0054] A 10nm-thick AlN film was sputtered on a flat sapphire substrate by magnetron sputtering, and then a low-temperature AlN buffer layer with a thickness of 10nm was grown by controlling the growth temperature to 500°C, the reaction chamber pressure to 50mbar, and the V / III ratio to 100. . Next, the growth temperature is controlled to be 900° C., the reaction chamber pressure is 50 mbar, the V / III ratio is 100, and an AlN stress control layer with a thickness of 0.1 μm is grown. Finally, a high-temperature AlN layer, an N-type AlGaN contact layer, and an Al x Ga 1-x N / Al y Ga 1-y N multi-quantum well active layer, P-type AlGaN electron blocking layer, P-type AlGaN confinement layer and P-type GaN contact layer.
[0055] see figure 2 , using X-ray diffraction rocking curve half-maximum width to characterize the crystal quality of AlN epitaxial thin films. It was found that the FWHM of the XRD (102) planes of the samples grown by using the growth method of the present...
Embodiment 2
[0057] A 100nm-thick AlN film was sputtered on a flat sapphire substrate by magnetron sputtering, and then the growth temperature was controlled at 900°C, the reaction chamber pressure was 200mbar, the V / III ratio was 5000, and a low-temperature AlN buffer layer with a thickness of 50nm was grown. . Then control the growth temperature to 1200°C, the reaction chamber pressure to 200mbar, the V / III ratio to 5000, and grow an AlN stress control layer with a thickness of 1μm. Finally, a high-temperature AlN layer, an N-type AlGaN contact layer, and an Al x Ga 1-x N / Al y Ga 1-y N multi-quantum well active layer, P-type AlGaN electron blocking layer, P-type AlGaN confinement layer and P-type GaN contact layer.
Embodiment 3
[0059] A 30nm-thick AlN film was sputtered on a flat sapphire substrate by magnetron sputtering, and then a low-temperature AlN buffer layer with a thickness of 30nm was grown by controlling the growth temperature at 800°C, the reaction chamber pressure at 100mbar, and the Ⅴ / Ⅲ ratio of 1000. . Next, the growth temperature is controlled to be 1100° C., the reaction chamber pressure is 100 mbar, the V / III ratio is 1000, and an AlN stress control layer with a thickness of 0.5 μm is grown. Finally, a high-temperature AlN layer, an N-type AlGaN contact layer, and an Al x Ga 1-x N / Al y Ga 1-y N multi-quantum well active layer, P-type AlGaN electron blocking layer, P-type AlGaN confinement layer and P-type GaN contact layer.
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