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High temperature resisting material and application thereof for preparing capacitor film

A technology of high temperature resistance and raw materials, which is applied in the field of preparing capacitor films and high temperature resistant materials, can solve the problems of shortened life, reduced pressure resistance, increased self-healing point, etc., and achieves the effect of excellent high temperature resistance and excellent performance

Active Publication Date: 2016-11-16
玉环诚和工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the film capacitor is used under high-frequency or high-pulse conditions, the pulse current passing through the capacitor will cause the capacitor itself to heat up and the temperature will rise, resulting in problems such as increased self-healing points, reduced withstand voltage, and shortened life.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Embodiment 1: the preparation of high temperature resistant material

[0018] Raw material weight ratio:

[0019] Polycarbonate, 80 parts; Polyimide, 40 parts; Propylene glycol, 15 parts; Nano silica, 2 parts; Nano titanium dioxide, 2 parts; Silicon carbide, 1 part; Citrate, 1 part; Pentaerythritol ester, 3 parts; hydroquinone, 14 parts; 5 parts in total of zinc stearate and bismuth naphthenate, and the ratio by weight of zinc stearate and bismuth naphthenate is 4:1.

[0020] Preparation:

[0021] Step S1, adding nano-silica, nano-titanium dioxide, silicon carbide, zinc stearate and bismuth naphthenate into a high-pressure homogenizer, and stirring at 75°C for 20 minutes;

[0022] Step S2, add polycarbonate, polyimide, propylene glycol, citric acid ester, pentaerythritol ester and hydroquinone to the mixture in step S1 in sequence, stir well and put it into a twin-screw extruder to melt at 170°C Extrusion granulation.

Embodiment 2

[0023] Embodiment 2: the preparation of high temperature resistant material

[0024] Raw material weight ratio:

[0025] Polycarbonate, 75 parts; Polyimide, 35 parts; Propylene Glycol, 10 parts; Nano-Silicon Dioxide, 1 part; Nano-Titanium Dioxide, 1.5 parts; Silicon Carbide, 0.5 parts; 2 parts; hydroquinone, 12 parts; a total of 4 parts of zinc stearate and bismuth naphthenate, the ratio by weight of zinc stearate and bismuth naphthenate is 3:1.

[0026] Preparation:

[0027] Step S1, adding nano-silica, nano-titanium dioxide, silicon carbide, zinc stearate and bismuth naphthenate into a high-pressure homogenizer, and stirring at 75°C for 20 minutes;

[0028] Step S2, add polycarbonate, polyimide, propylene glycol, citric acid ester, pentaerythritol ester and hydroquinone to the mixture in step S1 in sequence, stir well and put it into a twin-screw extruder to melt at 170°C Extrusion granulation.

Embodiment 3

[0029] Embodiment 3: the preparation of high temperature resistant material

[0030] Raw material weight ratio:

[0031] Polycarbonate, 85 parts; Polyimide, 45 parts; Propylene glycol, 20 parts; Nano silica, 3 parts; Nano titanium dioxide, 2.5 parts; Silicon carbide, 1.5 parts; Citrate, 1.5 parts; Pentaerythritol ester, 4 parts; hydroquinone, 16 parts; a total of 6 parts of zinc stearate and bismuth naphthenate, the ratio by weight of zinc stearate and bismuth naphthenate is 5:1.

[0032] Preparation:

[0033] Step S1, adding nano-silica, nano-titanium dioxide, silicon carbide, zinc stearate and bismuth naphthenate into a high-pressure homogenizer, and stirring at 75°C for 20 minutes;

[0034] Step S2, add polycarbonate, polyimide, propylene glycol, citric acid ester, pentaerythritol ester and hydroquinone to the mixture in step S1 in sequence, stir well and put it into a twin-screw extruder to melt at 170°C Extrusion granulation.

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PUM

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Abstract

The invention discloses a high temperature resisting material and application thereof for preparing a capacitor film. The high temperature resisting material is prepared from, by weight, 75-85 parts of polycarbonate, 35-45 parts of polyimide, 10-20 parts of propylene glycol, 1-3 parts of nanometer silica, 1.5-2.5 parts of nanometer titania, 0.5-1.5 parts of silicon carbide, 0.5-1.5 parts of citrate, 2-4 parts of pentaerythritol ester, 12-16 parts of hydroquinone and 4-6 parts of zinc stearate and naphthenic acid bismuth. The ratio of the parts by weight of zinc stearate to naphthenic acid bismuth is 3-5:1. The high temperature resisting material is excellent in performance and applicable to preparing the capacitor film, the high temperature resisting performance is related to the ratio of the parts by weight of zinc stearate to naphthenic acid bismuth, and when the ratio of the parts by weight of zinc stearate to naphthenic acid bismuth is 3-5:1, the high temperature resisting performance is most excellent.

Description

technical field [0001] The invention belongs to the field of electronic components, and in particular relates to a high-temperature-resistant material and its application for preparing capacitor films. Background technique [0002] Film capacitors use metal foil as an electrode, which is overlapped with plastic films such as polyethylene, polypropylene, polystyrene or polycarbonate from both ends, and then wound into a cylindrical capacitor; in all Among the plastic film capacitors, the characteristics of polypropylene capacitors and polystyrene capacitors are the most significant. Capacitors made of polypropylene films have the advantages of low heat shrinkage, stable performance, high temperature resistance, high pressure resistance, and prevention of breakdown. Capacitors made of propylene film are used more and more widely. The capacitor core is the heart of the capacitor, so the capacitor manufacturing core material must have high frequency resistance, high temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L79/08C08K13/02C08K3/36C08K3/22C08K3/34C08K5/098H01G4/33H01G4/002
CPCC08K2201/011C08K2201/014C08L69/00C08L2201/08H01G4/002H01G4/33C08L79/08C08K13/02C08K3/36C08K2003/2237C08K3/34C08K5/098
Inventor 王国英
Owner 玉环诚和工业设计有限公司