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Thermosetting resin composition and prepreg and laminated board prepared from same
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A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, applications, household appliances, etc., and can solve problems such as insufficient rigidity, damage to the dielectric properties of the system, and poor heat resistance
Active Publication Date: 2016-12-21
SHENGYI TECH SUZHOU
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Problems solved by technology
A large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. However, there are still many problems to be solved in practical applications such as low transition temperature and poor adhesion.
For example, in the Chinese invention patent CN10544841B, a combination of hydrocarbon resin and allyl-modified phenolic resin is used to make printed circuit boards. Although the adhesive performance of the resin is improved, the peel strength of the board is improved, but it is still low. And the heat resistance of the system is low
Chinese patent CN104845363A uses hydrocarbon resin, allyl-modified benzoxazine resin and allyl-modified bismaleimide resin composition to make printed circuit boards, which improves heat resistance and peel strength , but because allyl-modified benzoxazine resin and allyl-modified bismaleimide resin will introduce a large number of hydroxyl groups, which will damage the dielectric properties of the system
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Synthetic example 1
[0066] Put N-(4-hydroxyphenyl)maleimide (500g, 2.66mol), phenol (50g, 0.532mol) and oxalic acid (20g) into a three-necked flask equipped with a thermometer, a condenser, and a stirrer, and mix After stirring evenly, place it in a constant temperature water bath at 70°C; then, under stirring, add formaldehyde solution (210mL, 37% formaldehydeaqueous solution, the ratio of phenol / aldehyde is 1 / 0.8) dropwise to the flask for 0.5 hours; After formaldehyde, maintain the temperature of 70°C and stir for 15 hours; then, dissolve and dilute the reaction product with 1000mL acetone, and then precipitate the reaction product with 40% methanolaqueous solution; repeat the above dissolution-precipitation operation 3~5 times, It was filtered, separated, and dried to obtain a pure nitrogen-containing polyfunctional phenolic compound; Add 10-phosphophenanthrene-10-oxa (287g, 0.270mol) into a three-necked flask equipped with a thermometer, condenser, and stirrer, add 2000mL of toluene-tetrah...
Synthetic example 2
[0072] With reference to the method for synthetic example 1, the phosphorus-containing maleimide ester (B-2) of following structure is obtained:
[0073]
[0074] Among them, Ar is , R is: phenyl;
[0075] Among them, n is 1~10, x is 1~20, y is 1~10, z is 1~20, the ratio of (x+z) to y is 5:1, and the ratio of x to z is 0.5:1. Among them, the N content is 2.77%, and the phosphorus content is 4.09%.
Synthetic example 3
[0077] With reference to the method for synthetic example 1, the phosphorus-containing maleimide ester (B-3) of following structure is obtained:
[0078]
[0079] Among them, Ar is , R is: phenyl;
[0080] Among them, n is 1~10, x is 1~20, y is 1~10, z is 1~20, the ratio of (x+z) to y is 5:1, and the ratio of x to z is 0.2:1.
[0081] Among them, the N content is 2.62%, and the phosphorus content is 4.64%.
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Abstract
The invention discloses a thermosetting resin composition. The thermosetting resin composition is prepared from, by solid weight, 10-100 parts of hydrocarbon resin, 20-100 parts of phosphorus-containing maleimide ester and 0.1-8 parts of an initiating agent. According to the thermosetting resin composition, the maleimide ester with multifunctional long-strain structures and rigid imide rings is adopted to cooperate with the flexible hydrocarbon resin to form the thermosetting resin composition, the maleimide ester and the hydrocarbon resin achieve interaction, and finally the thermosetting resin composition and prepreg and a laminated board which are used for a printed circuit and prepared from the thermosetting resin composition have the advantages of being excellent in dielectric property, heat resistance, adhesive property, flame resistance, bending strength and toughness, high in peel strength, low in water absorption, excellent in processing technology property and the like.
Description
technical field [0001] The invention relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition, and belongs to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signaldelay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric constant in...
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