Ionic palladium activation solution for manufacturing conductor lines on ceramics and preparation method thereof

Abstract

The invention discloses an ionic palladium activation solution for manufacturing conductor lines on ceramics and a preparation method thereof. The method comprises the following steps: (1) dissolving a preset mass of palladium salt in 100 parts by volume of pH buffer solution, stirring for 1 hour, and adding deionized water to 800 parts by volume; (2) adding 10-100 parts by volume of high-polymer carrier solution, and stirring for 30 minutes; and (3) adding 1-100 parts by volume of surfactant solution, adding deionized water to 1000 parts by volume, stirring for 2-4 hours, and standing for 48 hours to obtain the ionic palladium activation solution. The ionic palladium activation solution has the characteristics of high selectivity and no special requirements for the ceramic matrix, can be directly used for activating the laser-irradiated ceramics to finally prepare the conductor line, has the advantages of stable tested electric properties and favorable adhesive force, and can not have the problem of coating spillover, plating leakage, bubbles, shedding or the like.

Description

technical field [0001] The invention relates to the technical field of electronic appliance production, in particular to an ionic palladium activation solution for making conductor circuits on ceramics and a preparation method thereof. Background technique [0002] Ceramics not only have good heat resistance and high thermal conductivity, but most importantly, the coefficient of thermal expansion is close to that of Si and SiC. However, when making electronic appliances, ceramics have the problem of no selectivity or poor selectivity. Mask technology is required, and the process is complicated. And the circuit made is generally wider, which is not conducive to the integration of more electronic and electrical components. In the later stage, a method of mixing metal oxides on the basis of ceramics was developed to make special ceramics. However, ceramics mixed with metal oxides cannot be cast and molded well, and post-processing requires lasers with specific wavelengths and ...

AI Technical Summary

Problems solved by technology

However, ceramics mixed with metal oxides cannot be casted well, and post-processing requires lasers with specific wavelengths and high energy, which makes the process unable to be popularized.

There are also technologies such as directly impacting copper-nickel or colloidal palladium on ceramics, but during the production process, there will be adverse conditions such as non-plating, full plating, missing plating, overflow plating, uneven wiring, and wiring bonding, which will lead to the failure of the conductor produced. The circuit has poor electrical performance, poor adhesion, breakage after heating, or even falling off; and when this technology is used, it is difficult to control the potion, so this method cannot be widely used

[0003] For example: the patent CN104561955A mentions the direct impact copper process on the ceramic substrate, which puts forward requirements on the material of the ceramic substrate. For example, ceramics such as zirconia titanate cannot meet the metallization requirements. Plating, and all non-plating, missing plating, overflow plating, resulting in uneven thickness and unevenness of conductor lines and poor bonding

[0004] For example: Patent CN 102776492 B mentions that ceramics contain functional powders, and the physical structure and electrical properties of the ceramics are changed due to the mixing of multiple components of metal oxides or other metal compounds, resulting in poor circuit integrity and affecting the electrical performance and reliability of the circuit.

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