The invention relates to a
wafer level
chip scale
package (WLCSP) multiple
chip stackable packaging piece and a packaging method thereof and belongs to the technical field of
integrated circuit (IC) packaging. A plastic
package body surrounds pins inside a frame, an upper layer IC
chip, a lower layer IC chip, dice bonding glue, a
metal protruded point, a
tin layer, solder and a bonding wire to form
circuit integrity. The plastic
package body which plays the roles of supporting and protecting the upper layer IC chip, the lower layer IC chip and the bonding wire surrounds the pins inside the frame, the
tin layer, the solder, the
metal protruded point and the upper layer IC chip to form the
circuit integrity. The upper layer IC chip, the lower layer IC chip, the bonding wire, the
metal protruded point, the solder, the
tin layer and the substrate form power and
signal paths of a circuit. By adopting the
metallic coating protruded point different from the past and the solder to weld every protruded point of the chip with frame pins, in the process of bonding, routing is not needed, and therefore breakover and mutual connection between the chip and the pins can be achieved directly. Thus, the WLCSP multiple chip stackable packaging piece and the packaging method thereof have the advantages of being low in cost and high in efficiency.