43 results about "Circuit integrity" patented technology

Blood component processing systems and methods are coupled to a blood component processing device. The systems and methods include a fluid circuit that comprises at least one fluid pressure actuated pump station, at least one fluid flow path communicating with the pump station, and at least one valve in the fluid flow path. A control module is sized and configured to interact with the fluid circuit. The control module includes an actuator to selectively apply fluid pressure to the pump station in concert with operation of the valve to pump fluid through the fluid flow path in response to a control program. A controller coupled to the control module includes the control program and a fluid circuit integrity test function. The fluid circuit integrity test function commands the control module to selectively apply fluid pressure to the pump station in concert with operation of the valve to introduce a fluid within a region of the fluid circuit and to confine the fluid within the region while applying fluid pressure to the pump chamber. The fluid circuit integrity test function generates an integrity output in response to sensing leakage of fluid from the region.

A fire and thermal insulative wrap for protecting building wires and cables is provided comprising a layered construction of a support substrate and a coating, thereon, of an intumescent material. Optionally, a third ceramic layer is provided for added fire protection and electrical properties. Wires and cables constructed to include the wraps are cost effective because construction can include the substitution of low cost polyolefin resins and compounds for fluorocarbon resins and smoke suppressed PVC compounds. The new constructions based on polyolefin components advantageously produce lower levels of smoke and toxic and corrosive gases during a fire event when compared with the halogen based PVC and fluorocarbon systems. Moreover, the superior fire and thermal protection provided adds safety gained from increased circuit integrity. Finally, the wrap thickness being slight does not add significantly to cable size and therefore promotes an installation advantage.

The invention discloses an automatic detection system for circuit boards, comprising an automatic detection device, a first jet coding device, a second jet coding device and a defective product blanking device which are successively connected. The device also comprises a feeding transmission belt device and an intermediate transmission belt device, wherein the feeding transmission belt device is used for conveying products to be detected to the automatic detection device, and the intermediate transmission belt device is used for conveying products from the automatic detection device to the first jet coding device; the feeding transmission belt device is used for material uploading, the automatic detection device is used for detecting integral circuit performance of a product; if the product is detected to be qualified, a first jet coding is performed to the product by the first jet coding device, and then a second jet coding is performed to the product by the second jet coding device; blanking and recycling are performed to defective products by the defective product blanking device; by use of the system, automatic detection for circuit boards, jet coding, and defective product blanking are realized.

A status monitoring circuit for monitoring the status of an external device coupled to an electrical system of a vehicle, the status monitoring device including a sensing unit coupled to the external device and configured to sense an input voltage and an input current at the external device, a monitoring unit coupled to the sensing unit and configured to determine a normal operation of the external device based on the sensed input voltage, and, in response, to detect an undercurrent condition of the external device based on the sensed input current, and a status indicator coupled to the monitoring unit and configured to display a fault indication in response to the monitoring unit detecting the undercurrent condition.

A cable providing circuit integrity in case of fire is configured as a flat cable with plural high power current strands extending parallel adjacent to one another in a plane. Fire resistant insulating material is arranged between the high power current strands. An insulating jacket envelopes the high power current strands and the fire resistant insulating material.

The invention discloses a mineral insulated metal sheath fireproof cable and a preparation method thereof. The cable comprises a cable core, a mineral matter oxygen barrier layer, an inner flame retardation layer, a mineral matter fireproof expansion layer, a metal reinforcing layer, an outer flame retardation layer and an oversheath; the cable core comprises insulating cores, and each insulating core is wrapped in an aluminum metal sheathe and an anticorrosion plastic layers successively; a mineral matter insulation layer services as an external layer of each insulating core, and internally provided with metal conductors; and the cable core is wrapped in the mineral matter oxygen barrier layer, the inner flame retardation layer, the mineral matter fireproof expansion layer, the metal reinforcing layer, the outer flame retardation layer and the oversheath successively. The cable of the invention can reach the CWZ grade of BS6387 standard, and satisfy 2h of fireproof bump test prescribed by the BS8491 standard, the production speed is high, the whole cable can be produced in a continuous and long manner, onsite installation technology is simple, and the cable can be applied to power distribution, illumination, control and alarm systems requiring for circuit completeness.

A connection device with circuit integrity in case of fire where the connection device is configured for tapping into a flat cable without stripping an insulation where the flat cable is configured with plural high power current strands extending parallel and offset from one another in a plane, wherein the connecting device reaches about the flat cable and includes contact screws that are configured to be screwed into the flat cable, where a respective pair of contact screws is provided for the respective high power current strands, wherein the two contact screws of a pair are arranged so that one contact screw contacts one side of a conductor of the high power current strand and another contact screw contacts another side of the conductor of the high power current strand when the flat cable is connected, wherein the contact screws respectively include threads so that the conductor is laterally clamped by the two contact screws with the threads.

The invention relates to a wafer level chip scale package (WLCSP) multiple chip stackable packaging piece based on a substrate and a solder paste layer and a packaging method thereof and belongs to the technical field of integrated circuit (IC) packaging. A plastic package body surrounds the substrate, an upper layer IC chip, a lower layer IC chip, dice bonding glue, a metal protruded point, the solder paste layer, solder and a bonding wire to form circuit integrity. The plastic package body which plays the roles of supporting and protecting the upper layer IC chip, the lower layer IC chip and the bonding wire surrounds the substrate, the solder paste layer, the solder, the metal protruded point and the upper layer IC chip to from the circuit integrity. The upper layer IC chip, the lower layer IC chip, the bonding wire, the metal protruded point, the solder, the solder paste layer and the substrate form power and signal paths of a circuit. By adopting the metallic coating protruded point different from the past and the solder to weld every protruded point of the chip with frame pins, in the process of bonding, routing is not needed, and therefore breakover and mutual connection between the chip and the pins can be achieved directly. Thus, the WLCSP multiple chip stackable packaging piece based on the substrate and the solder paste layer and the packaging method thereof have the advantages of being low in cost and high in efficiency.

A system and method is disclosed that assures component circuits transported in aggregated circuits restore correctly after an aggregated circuit fault. The system and method implements component circuit tail segment integrity checks whenever an aggregated circuit is restored in a higher level of a network hierarchy. Switches at both ends of an aggregated circuit perform circuit integrity checks of the tail segments of every component circuit. A failure of the component circuit integrity check on any component circuit causes that component circuit to be released and restored end-to-end.

The invention relates to a wafer level chip scale package (WLCSP) multiple chip stackable packaging piece and a packaging method thereof and belongs to the technical field of integrated circuit (IC) packaging. A plastic package body surrounds pins inside a frame, an upper layer IC chip, a lower layer IC chip, dice bonding glue, a metal protruded point, a tin layer, solder and a bonding wire to form circuit integrity. The plastic package body which plays the roles of supporting and protecting the upper layer IC chip, the lower layer IC chip and the bonding wire surrounds the pins inside the frame, the tin layer, the solder, the metal protruded point and the upper layer IC chip to form the circuit integrity. The upper layer IC chip, the lower layer IC chip, the bonding wire, the metal protruded point, the solder, the tin layer and the substrate form power and signal paths of a circuit. By adopting the metallic coating protruded point different from the past and the solder to weld every protruded point of the chip with frame pins, in the process of bonding, routing is not needed, and therefore breakover and mutual connection between the chip and the pins can be achieved directly. Thus, the WLCSP multiple chip stackable packaging piece and the packaging method thereof have the advantages of being low in cost and high in efficiency.

The invention discloses a relay protection circuit integrity tester comprising a microprocessing chip and a relay detection module; the relay detection module is electrically connected with a relay protector; the relay detection module contact/breakpoint motions are combined with a relay protection loop indication lamp, input and output, thus detecting the relay protection loop integrity; the relay detection module is electrically connected with the microprocessing chip. The tester is applied in the following steps: 1, the relay detection module is electrically connected with the relay protector; 2, the microprocessing chip controls the relay detection module to make contact/breakpoint motions, and controls the contact/breakpoint motion duration times; 3, the relay protection loop indication lamp, input and output are considered, thus observing the relay protection loop integrity. The tester can singly control the relay contact/breakpoint motions of a random phase, and can keep the time duration of the corresponding motions; the relay protection circuit integrity tester can control the relay motions, thus mitigating working personnel workloads, and improving the working efficiency.

The invention discloses a low temperature co-fired ceramic (LTCC) tube casing integrated with coupling electrical bridge. The LTCC tube casing comprises a casing body for placing a microwave circuit, a tube cap for closing the casing body, a metal substrate installed at the bottom of the casing body and an active circuit welded above the metal substrate. Two broad-brimmed coupling electrical bridges manufactured by means of an LTCC process are integrated on two side walls of the casing body, ports of the broad-brimmed coupling electrical bridges are respectively connected with tube casing ports and the active circuit in the tube casing to form a balanced type circuit structure. The active circuit is electrically connected with coupling electrical bridge leading-out ends in the tube casing in a gold wire bonding mode. A user can install the tube casing with the encapsulated active circuit in a system in a surface-adhering mode. The LTCC tube casing integrated with the coupling electrical bridge aims at improving the circuit integrity, and can remarkably reduce the circuit volume and device cost and improve the circuit reliability.

A fire resistant cable (1.002) having a polymeric layer (1.004) which forms a cohesive shell on exposure to elevated temperatures, and a conductor (1.006) substantially composed of a metal, alloy or combination of metals and alloys having a melting point suitable for use in a circuit integrity or fire resistant cable application. The cable can include aluminium wires, with or without wires of other material.

A device for testing the circuitry of a ceramic sheet-type, multi-cell solid oxide fuel cell is provided. The testing device includes a support plate having a substantially flat face, and a plurality of resilient contacts mounted on the flat face of the support plate. The contacts are spaced-apart so that each contact is individually registrable with one of the plurality of spaced-apart cells when the support plate of the device is positioned over fuel cell, allowing the circuit integrity of all of the cells to be tested simultaneously. The support plate includes a light conducting portion that visually facilitates alignment and engagement between said resilient contact members and the cells when the device is positioned over the solid oxide fuel cell. The light conducting portion of the support plate may be a transparent material that forms all or part of the plate. The resilient contacts each engage a sufficiently broad area of the cells to avoid localized stresses in the ceramic sheet that may otherwise provide sites for unwanted cracking or other types of damage.

The invention discloses an improved flexible fireproof cable. The improved flexible fireproof cable comprises a cable core formed by twisting a plurality of thread cores. A filling layer is arranged in the gap of the cable core. The cable core is wound with a fireproof inflaming retarding layer, a second fireproof separation layer and a low smoke zero halogen sheath layer. Each thread core is composed of a copper conductor, a fireproof insulation layer, a first fireproof separation layer and a color separation insulation layer, wherein the copper conductor is wound with the fireproof insulation layer, the first fireproof separation layer and the color separation insulation layer in sequence. As the thread cores and the cable core are provided with the fireproof separation layers respectively, the fireproof level and fire resistance quality of the cable in a fire disaster are improved. By means of the structure, dual protection on every insulation thread core and the whole cable core can be achieved, short circuit caused by disengagement of the insulation layers in the burning process is avoided, and the capacity of maintaining circuit integrity in the burning state is achieved more perfectly.

The invention provides a self-detection circuit for implementing a digital input circuit based on a pulse injection method. A peak self-detection pulse is controlled and generated through an IO pin of a CPU and is injected into the digital input circuit through a high voltage capacitor. After optical coupling, the peak self-detection pulse is collected by an ADC pin of the CPU and judged. A pulse injection circuit is mainly formed by a high speed optical coupler, an optical MOS tube, a resistor, and a high voltage safety capacitor. The IO pin of the CPU is connected to an input end of the high speed optical coupler. An output end of the high speed optical coupler is connected to the input end of the optical MOS tube. A source electrode of the optical MOS tube is connected to a common anode of a power supply. A drain electrode of the optical MOS tube is connected to one end of the high voltage safety capacitor. The other end of the high voltage safety capacitor is connected to the digital input circuit. After the IO pin of the CPU drives and generates a peak self-detection pulse signal and injects the signal into the digital input circuit, the ADC pin of the CPU collects optical coupler secondary waveform, and carries out processing, analysis and comparison. Thus the self-detection judgment of the digital input circuit integrity is achieved. The self-detection mode can be applied when a digital input signal is in any state, and the self-detection circuit has the super-high isolation capacity and reliability.

A carbon dioxide sensor for use in a respiratory therapy system. The carbon dioxide sensor determines whether a patient interface is fluidly coupled to a patient.

The invention discloses a low-power fire-resistant alarm cable and a processing method thereof. The low-power fire-resistant alarm cable comprises a plurality of concentrically stranded wire cores, afirst flame-retardant layer coating the wire cores, a second flame-retardant layer coating the first flame-retardant layer, a conductive shielding layer coating the second flame-retardant layer, a halogen-free oxygen barrier layer coating the conductive shielding layer, a steel belt coating the halogen-free oxygen barrier layer, and a halogen-free insulating sheath coating the steel belt. Each wire core comprises a copper conductor and a ceramic thermosetting halogen-free insulating layer coating the copper conductor. At least one grounding wire is arranged between the second flame-retardant layer and the conductive shielding layer. By adopting the low-power fire-resistant alarm cable, the insulation effect of the wire cores and the circuit integrity can be ensured in a fire environment, and the grounding wire can feed back a leakage current to a power supply system of a building. When the alarm cable is burnt, generated gas is non-toxic and harmless to human bodies, no black smoke isgenerated, and the sight of escape personnel or disaster relief personnel is not affected.

The invention relates to a wafer level chip scale package (WLCSP) single chip packaging piece and a plastic packaging method thereof and belongs to the technical field of integrated circuit (IC) packaging. Tin layers are plated on pins inside a frame and a metal protruded point area, metal protruded points are plated on a pressure area surface of an IC chip, and the metal protruded points and the tin layer on the pins inside the frame are soldered by solder in a flip-chip method. The pins inside the frame are sequentially the tin layers, the solder, the metal protruded points and the IC chip. A plastic package body surrounds the pins inside the frame, the tin layers, the solder, the metal protruded points and the IC chip to form circuit integrity. The IC chip, the metal protruded points, the solder, the tin layers and the pins inside the frame form power and signal paths of a circuit. By adopting the metallic coating protruded point different from the past and the solder to weld the chip with frame pins, in the process of bonding, routing is not needed, and therefore breakover and mutual connection between the chip and the pins can be achieved directly. Thus, the WLCSP single chip packaging piece and the plastic packaging method thereof have the advantages of being low in cost and high in efficiency.