The invention discloses an insulating multi-layer Clip applied to a
power module and a preparation method of the insulating multi-layer Clip, aging and layering risks of a traditional
adhesive are eliminated through an
adhesive-free laminated structure of the insulating multi-layer Clip,
heat resistance,
chemical resistance and long-term reliability of a product are improved, and meanwhile, an
adhesive layer is omitted, so that the overall thickness of the product is thinner and more flexible; through the connection of
deep drawing forming and the surface silver /
nickel plating process, the three-dimensional
assembly requirement of the insulation multi-layer Clip is met, and the conductive performance and the contact reliability of the circuit are improved. Multiple alignment errors are avoided through a one-time pressing process, the interlayer alignment precision is extremely high, the thickness of the
dielectric layer is uniform, and the
electrical performance consistency is good; the size precision and the
circuit integrity of the product are guaranteed through the working procedures of drilling,
etching,
laser cutting and the like in combination with the precise
temperature control and
positioning technology. The method can be applied to the technical field of
chip packaging.