Resin mixture, transparent conducting film and graphical preparation method thereof
A technology of transparent conductive film and resin mixture, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of inability to meet the large-scale production in factories, high cost, complex process flow, etc., and the processing efficiency is not affected. , the process is simple, combined with a firm effect
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experiment example 1
[0063] The conductive material used in this experimental example is silver nanowires with a diameter of 25-30 nm and a length of 20-30 μm, and the transparent substrate is polymethyl methacrylate (purchased from DuPont Teijin Melinix, thickness 100 μm). The formula of the polymer resin mixture in the middle layer is: 10 parts of polyvinyl butyral, 0.5 parts of trishydroxymethylaminomethane, 0.1 parts of triarylsulfonium salt, 78.4 parts of methanol, 10 parts of N-methylpyrrolidone, BYK 1 part of -163 dispersant.
[0064](1) Fully mix the components in the resin mixture, use a wire bar to coat on the polymethyl methacrylate film that has been cleaned with a plasma cleaner, the coating temperature is 30 ° C, and the humidity is less than 40%. After coating, dry at 50°C for 20 minutes to form a resin layer.
[0065] (2) The nano-silver wire dispersion liquid is uniformly coated on the surface of the resin layer by spraying.
[0066] (3) Bake at 100° C. for 25 minutes to make th...
experiment example 2
[0073] The conductive material used in this experiment example is a nano-copper wire with a diameter of 90-100 nm and a length of 10-20 μm, and the transparent substrate is polycarbonate (purchased from DuPont Teijin Melinix, with a thickness of 90 μm). The formula of the polymer resin mixture in the middle layer is: 5 parts of polyvinyl butyral, 0.25 parts of dimethylol dihydroxy ethylene urea, 0.05 parts of diazosulfate, 73.7 parts of ethanol, 20 parts of diphenyl ether, BYK- 1 part of 354 dispersant.
[0074] (1) Fully mix the components in the resin mixture, use a wire bar to coat on the polycarbonate film that has been cleaned with a plasma cleaner, the coating temperature is 25 ° C, and the humidity is less than 50%. After coating, dry at 45°C for 15 minutes to form a resin layer.
[0075] (2) Coating the nano-copper wire dispersion evenly on the surface of the resin layer by scraping.
[0076] (3) Baking at 80° C. for 20 minutes, so that the copper nanowires on the su...
experiment example 3
[0083] The conductive material used in this experimental example is a nano-copper wire with a diameter of 10-20 nm and a length of 20-30 μm, and the transparent substrate is polyamide. The formula of the polymer resin mixture in the middle layer is: 15 parts of polyacrylic acid, 0.3 part of dimethylol propionic acid, 0.05 part of sulfonyl chloride ester, 73.65 parts of ether, 10 parts of diphenyl ether, 1 part of LK-233 additive
[0084] (1) Fully mix the components in the resin mixture, use a wire bar to coat on the polyamide film that has been cleaned with a plasma cleaner, the coating temperature is 35 ° C, and the humidity is less than 50%. After coating, dry at 50°C for 25 minutes to form a resin layer.
[0085] (2) Coating the nano-copper wire dispersion evenly on the surface of the resin layer by spraying.
[0086] (3) Bake at 90° C. for 15 minutes to make the carbon nanotubes on the surface sink into the resin layer. The transparent conductive film obtained at this s...
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