Laser marking method for microelectronic packaging outer shell

Abstract

The invention discloses a laser marking method for a microelectronic packaging outer shell. The laser marking method comprises the following steps: (1) editing and storing a laser marking content by adopting Auto CAD or self software of equipment; (2) according to the type of a base material, selecting a proper laser to carry out starting up, equipment calibration and preparation of tool clamp and consumable items; (3) setting technological parameters; (4) adopting laser sent by a laser device to cut the content edited in the step (1) on the base material; (5) plating to form a middle clad layer; (6) assembling the base material to form an outer shell; (7) plating an outer shell clad layer on the outer shell to form a finished product; and (8) carrying out performance index detection on the finished product. The laser marking method has the following beneficial effects: (1) laser marked graphs, characters and bar codes are clear and do not fall off permanently to meet the index assessment requirements including airtightness and salt spray resistance property of the outer shell; and (2) non-contact type automatic processing is carried out and has the advantages of flexible operation, high speed and zero abrasion.

Description

technical field [0001] The invention relates to a laser marking method for a microelectronic packaging shell, belonging to the technical field of microelectronic manufacturing. Background technique [0002] With the development of communication, aerospace, automobile and consumer electronics industries and the improvement of automation level, the requirements for the size, function and stability of electronic circuits and devices used are getting higher and higher; partial circuit disconnection of finished products, unique identification, etc. It is an important method to realize local functions, information collection, tracking and management; traditional methods such as screen printing and printing are suitable for products with good consistency and the same template, low process flexibility, continuous numbering, and subsequent processing and use. Easy to fall off; laser cutting is a processing method that uses high-energy-density laser beams to act on the target to cause...

AI Technical Summary

Problems solved by technology

[0002] With the development of communication, aerospace, automobile and consumer electronics industries and the improvement of automation level, the requirements for the size, function and stability of electronic circuits and devices used are getting higher and higher; partial circuit disconnection of finished products, unique identification, etc. It is an important method to realize local functions, information collection, tracking and management; traditional methods such as screen printing and printing are suitable for products with good consistency and the same template, low process flexibility, continuous numbering, and subsequent processing and use. Easy to fall off; laser cutting is a processing method that uses high-energy-density laser beams to act on the target to cause physical or chemical changes on the target surface to obtain design patterns. It has clear graphics, characters and barcodes, and will never fall off; Processing, flexible operation, fast speed, no wear and other characteristics, but due to the characteristics of the substrate itself, the absorption of the substrate to the laser, and the conditions of subsequent processing, the depth of the cut marks formed by the laser on the material is different, resulting in product appearance, Reduced air tightness, insulation resistance, salt spray, mechanical shock, etc.