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A kind of LED low temperature sealing glass containing sio2

A sealing glass, low temperature technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as difficulty in meeting low temperature sealing and rapid sintering, unsolved environmental problems, poor thermal stability, etc. Process stability effect

Inactive Publication Date: 2019-02-22
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Patent application 201310259302.6 discloses a low-temperature lead-free glass powder and its preparation method, but another toxic substance Sb is introduced into the system, which does not solve the environmental protection problem
And patent application 201210366375.0 also discloses lead-free glass material and preparation method thereof, through P 2 o 5 、K 2 O, Na 2 O, ZrO 2 、TiO 2 The composition design of the raw materials and other materials avoids environmental pollution, but the softening temperature range of the glass is 500~600°C, which is difficult to meet the requirements of low temperature sealing, especially the low temperature and rapid sintering of electronic components
Some low-temperature glass used for phosphor sealing also has poor thermal stability and is prone to water absorption, which leads to device aging.

Method used

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  • A kind of LED low temperature sealing glass containing sio2
  • A kind of LED low temperature sealing glass containing sio2
  • A kind of LED low temperature sealing glass containing sio2

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: Preparation and sealing of materials

[0032] According to the proportioning of each component of embodiment 1 in table 1, take a certain amount of analytically pure raw material (B 2 o 3 、 Bi 2 o 3 , ZnO, SiO 2 ), use a planetary ball mill for 24 hours to mix evenly; then put the powder into a platinum crucible, place it in the air atmosphere of a box-type resistance furnace, heat it to 900°C at 3°C / min, and keep it warm for 1 hour; then, take out the crucible, Pour the melt into deionized water for rapid cooling, and dry to obtain fragments of glass melt; grind and pass through a 100-mesh sieve to obtain glass powder. Mix glass powder with polyvinyl alcohol, fish oil, ethanol and toluene (80%, 2%, 1%, 10%, 7% by weight) to form a slurry, and disperse evenly in a ball mill; tape casting, natural Dry, then cut into the embryo body of the desired shape; place the embryo body on the part to be sealed, heat up at a rate of 2°C / min in an electric furnace,...

Embodiment 2

[0033] Embodiment 2: Preparation and sealing of materials

[0034] According to the proportioning of each component of embodiment 2 in table 1, take a certain amount of analytically pure raw material (B 2 o 3 、 Bi 2 o 3 , ZnO, SiO 2), use a planetary ball mill for 24 hours to mix evenly; then put the powder into a platinum crucible, place it in the air atmosphere of a box-type resistance furnace, heat it to 900°C at 3°C / min, and keep it warm for 1 hour; then, take out the crucible, Pour the melt into deionized water for rapid cooling, and dry to obtain fragments of glass melt; grind and pass through a 100-mesh sieve to obtain glass powder. Mix glass powder with methylcellulose, polyvinyl alcohol, n-butanol and acetone (82%, 2%, 2%, 8%, 6% by weight) to form a slurry, and disperse evenly in a ball mill; Stretching, drying naturally, and then cutting the embryo body into the desired shape; placing the embryo body on the part to be sealed, raising the temperature in an elect...

Embodiment 3

[0035] Embodiment 3: Preparation and sealing of materials

[0036] According to the proportioning of each component of embodiment 3 in table 1, take a certain amount of analytically pure raw material (B 2 o 3 、 Bi 2 o 3 , ZnO, SiO 2 ), use a planetary ball mill for 24 hours to mix evenly; then put the powder into a platinum crucible, place it in the air atmosphere of a box-type resistance furnace, heat it to 900°C at 3°C / min, and keep it warm for 1 hour; then, take out the crucible, Pour the melt into deionized water for rapid cooling, and dry to obtain fragments of glass melt; grind and pass through a 100-mesh sieve to obtain glass powder. Mix glass powder with epoxy resin, polyacrylamide, isopropanol and toluene (84%, 1.5%, 0.5%, 9%, 5% by weight) to form a slurry, and disperse evenly in a ball mill; casting Forming, drying naturally, and then cutting into the embryo body of the desired shape; place the embryo body on the part to be sealed, heat up at a rate of 2°C / min ...

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Abstract

The invention discloses SiO2-containing LED (light emitting diode) low-temperature sealing glass, and a preparation method and application method thereof. The SiO2-containing LED low-temperature sealing glass is prepared from raw materials: B2O3, Bi2O3, ZnO and SiO2 in a molar ratio of (30 to 50) to (30 to 50) to (5 to 25) to (5 to 30). The SiO2 is introduced into a SiO4 tetrahedron, and a BO4 tetrahedron is stabilized by using the structural similarity, the glass network stability is improved, so that the heat stability of the glass is improved, and when disposed in hot water of 80 DEG C for 1000 hours, the material can keep good stability. By introducing the high-concentration B2O3 and Bi2O3 and keeping the molar ratio of the B2O3 to the Bi2O3 at 1 to 1, the synergistic effect of the B2O3 and the Bi2O3 can be played, so that a softening temperature scope of the glass is reduced to 380 to 425 DEG C; and the ZnO can adjust the heat expansion coefficient of the glass, and can further improve the sealing performance of the glass. The glass is suitable for sealing of LED fluorescent powder, electronic materials and other low-temperature sealing fields. The SiO2-containing LED low-temperature sealing glass is simple in the raw materials, easy in obtaining the raw materials, stable in process, low in cost, simple and feasible in process, and capable of meeting the practical and industrial conditions.

Description

technical field [0001] The invention belongs to the field of sealing glass, in particular to a glass containing SiO 2 LED low-temperature sealing glass and its preparation and use method. Background technique [0002] Low-temperature sealing glass (sealing temperature <600°C), due to its good heat resistance, chemical stability, and high mechanical strength, is widely used in electronic paste, electric vacuum and microelectronics technology, energy, aerospace, automobiles, etc. Fields, such as phosphor sealing in light-emitting diodes (LEDs), the performance of the sealing material directly leads to the actual performance of the battery. Sealing glass can also be used for mutual sealing between glass, ceramics, metals, and semiconductors. However, currently domestic and foreign research generally uses sealing materials containing Pb, which will pollute the environment. Since Bi and Pb are adjacent in the periodic table of elements and have similar physical and chemical...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C8/24C03C3/066C03C6/04H01L33/52H01L33/56
CPCC03C1/00C03C3/066C03C8/24H01L33/52H01L33/56
Inventor 张腾苏鸿斌
Owner FUZHOU UNIV
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