Metal etching solution and etching method for copper/molybdenum film

A technology of metal etching and film layer, which is applied in the field of metal etching solution, can solve the problems of high cost, complex composition, high cost of raw materials, etc., and achieve the effect of wide application range, simple composition and good uniformity

Inactive Publication Date: 2017-03-15
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many types of reagents, and the ingredients are relatively complex. Correspondingly, the cost of raw materials is higher, and the preparation process is more cumbersome
[0005] A

Method used

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  • Metal etching solution and etching method for copper/molybdenum film
  • Metal etching solution and etching method for copper/molybdenum film

Examples

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Example Embodiment

[0033] Example 3

[0034] This embodiment provides an etching method for the copper / molybdenum film layer in the metal etching solution described in the foregoing embodiments 1 and 2, that is, the copper / molybdenum film layer is in liquid contact with the metal etching solution.

[0035] Specifically, the device with the copper / molybdenum film layer is brought into contact with the metal etching solution, for example, the device with the copper / molybdenum film layer can be immersed in the metal etching solution.

[0036] The above-mentioned etching process is preferably performed at 30°C to 35°C.

[0037] Reference figure 1 The device includes a substrate 1, and a barrier film 21, a copper wiring 22, and a resist layer 3 are sequentially stacked on the substrate 1. The combination of the barrier film 21 and the wiring 22 is the copper described in the embodiment of the present invention. / Molybdenum film layer.

[0038] It is worth noting that a good metal etching solution should make...

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Abstract

The invention especially discloses a metal etching solution for a copper/molybdenum film, belonging to the technical field of processing of liquid crystal panels. The metal etching solution comprises organic acid, phosphate and hydrogen peroxide and has a pH value of no more than 6. In the metal etching solution provided by the invention, each component can exert multiple effects, so the metal etching solution has the advantages of simpler composition and a wider application scope compared with the prior art; meanwhile, the metal etching solution is free of fluorine and friendly to environment, and poses no damage to the substrates of materials like glass and to special materials like IGZO; and since the metal etching solution has good homogeneity, the critical sizes of a cone angle and the like formed in the process of etching can be perfectly controlled. The invention also provides an etching method for treating the copper/molybdenum film based on the metal etching solution.

Description

technical field [0001] The invention belongs to the technical field of liquid crystal panel processing, and in particular relates to a metal etchant for copper / molybdenum film layers in a liquid crystal panel and an etching method thereof. Background technique [0002] The production process of liquid crystal panels generally includes a series of processes such as cleaning-film formation (generally physical vapor deposition / chemical vapor deposition)-exposure-development-etching (generally wet etching / dry etching)-stripping-inspection. Among them, the effect of wet etching has a great influence on the fineness of the wiring and the quality of the final liquid crystal panel. [0003] The material of the metal wiring in the traditional liquid crystal display device is mostly aluminum or aluminum alloy, and the corresponding metal etchant is generally a mixture of inorganic acids. With the development of display technology, especially toward the development of large-scale and ...

Claims

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Application Information

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IPC IPC(8): C23F1/18C23F1/26
CPCC23F1/18C23F1/26
Inventor 武岳雍玮娜
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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