HQDA type bisphenol A tetramine branched polyimide resin film and preparation method thereof

Abstract

The invention relates to an HQDA type bisphenol A tetramine branched polyimide resin film and a preparation method thereof. A mass ratio of BDAPP type linear polyimide resin to HQDA type linear polyimide resin in raw materials of the film is 1 to (100-800). The preparation method comprises the following steps: mixing aromatic binary primary amine with a strong-polarity aprotic organic solvent to obtain a mixture, stirring the mixture at the room temperature, cooling the mixture to a temperature lower than 5 DEG C, adding HQDA into the mixture, stirring, and reacting for 1-6 hours at a temperature ranging from 5 DEG C to 10 DEG C to obtain an HQDA type polyimide resin solution; and mixing the resin solution with BDAPP at the room temperature to obtain a mixed solution, stirring the mixed solution, enabling the mixed solution to form a film, heating the film, carrying out dehydration thermal imidization reaction on the film, cooling the film, and de-molding the film to obtain the HQDA type bisphenol A tetramine branched polyimide resin film. The preparation method is gentle in reaction condition, is simple to operate, is low in cost, is environmentally friendly, is beneficial for realizing industrial large-scale production, and can be applied to the high-tech fields such as flexible solar cells, space telescopes, large generator main insulation, electromagnetic wire wrapping electrical insulating materials, flexible copper-coated foil plates and the like.

Description

technical field [0001] The invention belongs to the field of polyimide film and its preparation, in particular to an HQDA type bisphenol A tetramine branched polyimide resin film and its preparation method. Background technique [0002] Polyimide film is a kind of polymer material with excellent comprehensive properties. It has particularly excellent heat resistance, low temperature resistance, flame retardancy, electrical properties and mechanical properties. It is widely used in electronic microelectronics, printing High-tech fields such as circuit boards, wires and cables, motor main insulation, shipping, aerospace, lasers, and optoelectronics. [0003] However, traditional polyimide films, such as the KAPTON film produced by the American DUPONT company and the domestic H film, have a molecular structure of pyromellitic dianhydride, that is, the main monomer raw material is pyromellitic acid di anhydride and 4,4'-diaminodiphenyl ether. [0004] NASA (NASA) plans to laun...

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Problems solved by technology

[0006] Its disadvantages are: (1) the raw material 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer is extremely expensive, resulting in very high cost of film products, which seriously hinders its further application; ( 2) Due to the low reactivity of 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride monomer and aromatic dibasic primary amine, it is difficult to prepare high molecular weight polyimide resin, Therefore, the overall performance of its film products is greatly reduced, especially its mechanical properties.

At present, there are no published literature or patent reports about the HQDA type bisphenol A tetraamine branched polyimide resin film and its preparation method.

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