Preparation method of microchannel heat sink for high-heat flux heat dissipation

Abstract

The invention relates to a preparation method of a microchannel heat sink for high-heat flux heat dissipation. The method includes the following steps that: a) materials are selected; b) a microchannel is made inside a plate; c) three-dimensional microchannel deformation-free modeling is performed; d ) and a metal frame, a ceramic frame, an outer lead, an IC device, a sensor and a heater are integrated on an active microchannel heat sink, so that system miniaturization can be realized, mechanical support and environmental protection are provided for a chip and an internal circuit, and an input and output function is realized for the chip and the internal circuit. The thermal expansion coefficient of the product is adjustable; and heat generated by devices or a system can be taken away from the heat sink through a high-thermal conductivity medium, the temperature of the surface of the heat sink can be decreased as much as possible and remain constant. The microchannel heat sink has the advantages of small size, large heat dissipation area, good solderability and high stability, and can meet the requirement of high-power density heat dissipation, and can be in sealed connection with other components or parts.

Description

technical field [0001] The invention relates to a method for preparing a microchannel heat sink for heat dissipation with high heat flux, and belongs to the technical field of microelectronic manufacturing. Background technique [0002] With the rapid development of highly integrated electronic devices, micro-electro-mechanical systems, and high-power lasers, the power of the circuit has increased significantly, and the heat flux generated during the working process has inevitably increased sharply, KW / m 2 , MW / m 2 The heat dissipation problem of magnitude high heat flux has attracted widespread attention, which requires the heat sink to take away a large amount of heat from the limited contact area with the chip. Traditional heat sink materials, such as LTCC, A1 2 0 3 , BeO, AlN, Al, Cu, Mo, W, steel, Kovar, Cu / W and Cu / Mo, etc. are difficult to meet the heat dissipation needs of this high heat flux. The active microchannel heat sink based on microsystem technology and f...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of highly integrated electronic devices, micro-electro-mechanical systems, and high-power lasers, the power of the circuit has increased significantly, and the heat flux generated during the working process has inevitably increased sharply, KW / m 2 , MW / m 2 The heat dissipation problem of magnitude high heat flux has attracted widespread attention, which requires the heat sink to take away a large amount of heat from the limited contact area with the chip. Traditional heat sink materials, such as LTCC, A1 2 0 3 , BeO, AlN, Al, Cu, Mo, W, steel, Kovar alloy, Cu / W and Cu / Mo, etc. are difficult to meet the heat dissipation needs of this high heat flux

The active microchannel heat sink based on microsystem technology and fluid mechanics theory takes the heat generated by the device or system away from the heat sink in time through high thermal conductivity media, such as water and liquid nitrogen, so that the temperature on the surface of the heat sink can be kept as high as possible. It may be reduced and kept constant, and has the advantages of small volume, large heat dissipation area, batch production, and low cost. However, traditional microfluidic channels are mainly used on oriented silicon wafers or on substrates using micromachining and anisotropic etching. Technology production, the cross-section of the micro-channel is small, and the liquid single-phase flow through the micro-channel will be accompanied by a large temperature rise, causing serious problems such as excessive thermal stress or chip thermoelectric mismatch