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Tin-zinc lead-free solder and preparation method thereof

A lead-free solder, tin-zinc technology, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of poor reliability of joint strength solder joints, oxides without protective melt, and limited application of solder alloys, etc. , to achieve the effect of improving oxidation resistance, reducing contact resistance and improving performance

Inactive Publication Date: 2017-05-10
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding strength of Sn-Zn based solder to the substrate and the reliability of solder joints are poor
In addition, Zn is an element that is easily oxidized, and oxides are more likely to form on the surface of the melt containing more Zn, and the oxides formed have no effect on protecting the melt, resulting in poor oxidation resistance of the solder, which limits the solder alloy. Applications

Method used

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  • Tin-zinc lead-free solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A tin-zinc lead-free solder, calculated by weight percentage, is made of the following raw materials:

[0024] 7% of zinc, 0.16% of nickel and 1.6% of graphene, and the balance is tin.

[0025] The preparation method comprises the following steps:

[0026] 1) Encapsulate pure zinc ingots, pure nickel ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then fill high-purity nitrogen protective gas to 1.2×10 5 Pa;

[0027] 2) Put the packaged raw materials in step 1) into the reaction furnace to melt the melt after heat treatment at 600°C and completely melt;

[0028] 3) Put the graphene in a stirring ball mill, fill it with liquid nitrogen until the balls are completely submerged, and then perform ball milling. The mass ratio of the ball to material is 6:1. Take out the powder after ball milling and add it to the melt in step 2) Perform stirring and heat preservation treatment, the heat preservation treatment temperature is 650 ° C...

Embodiment 2

[0031] A tin-zinc lead-free solder, calculated by weight percentage, is made of the following raw materials:

[0032] 5% zinc, 0.2% nickel and 2.4% graphene, and the balance is tin.

[0033] The preparation method comprises the following steps:

[0034] 1) Encapsulate pure zinc ingots, pure nickel ingots and pure tin ingots in vacuum quartz tubes, the vacuum degree is below 2.5Pa, and then filled with high-purity nitrogen protective gas to 1.1×10 5 Pa;

[0035] 2) Put the packaged raw materials in step 1) into the reaction furnace to melt the melt after heat treatment at 650°C and completely melt;

[0036] 3) Put the graphene in a stirring ball mill, fill it with liquid nitrogen until the balls are completely submerged, and then perform ball milling. The mass ratio of the ball to material is 7:1. Take out the powder after ball milling and add it to the melt in step 2) Perform stirring and heat preservation treatment, the heat preservation treatment temperature is 650 ° C, a...

Embodiment 3

[0039] A tin-zinc lead-free solder, calculated by weight percentage, is made of the following raw materials:

[0040] 10% of zinc, 0.1% of nickel and 0.6% of graphene, and the balance is tin.

[0041] The preparation method comprises the following steps:

[0042] 1) Encapsulate pure zinc ingots, pure nickel ingots and pure tin ingots in vacuum quartz tubes, and the vacuum degree is below 2.5Pa, and then filled with high-purity nitrogen protective gas to 1.3×10 5 Pa;

[0043] 2) Put the packaged raw materials in step 1) into the reaction furnace to melt the molten liquid after heat treatment at 700°C;

[0044] 3) Place the graphene in a stirring ball mill, fill it with liquid nitrogen until the balls are completely submerged, and then perform ball milling. The mass ratio of the ball to material is 8:1. Take out the powder after ball milling and add it to the melt in step 2) Stirring and heat preservation treatment, the temperature of heat preservation treatment is 680°C, and...

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Abstract

The invention provides a tin-zinc lead-free solder and a preparation method thereof. The tin-zinc lead-free solder comprises, by weight, 5%-10% of zinc, 0.1%-0.2% of nickel, 0.6%-2.4% of graphene and the balance tin. The preparation method comprises the steps that (1) a pure zinc ingot, a pure nickel ingot and a pure tin ingot are sealed in a vacuum quartz tube, and then the vacuum quartz tube is filled with high-purity nitrogen protective gas; (2) the raw materials sealed in the step (1) are put into a reaction furnace to be subjected to smelting heat treatment, and the raw materials are completely melted into molten liquid; (3) the graphene is placed in a stirring type ball mill, the stirring type ball mill is filled with liquid nitrogen till a milling ball is completely submerged, then ball milling is conducted, powder obtained through ball milling is taken out and added into the molten liquid in the step (2), and stirring and heat preservation treatment are conducted; and (4) after the graphene in the step (3) and the molten liquid are uniformly smelted, slagging off is conduced, the molten raw materials are subjected to casting forming, and thus the tin-zinc lead-free solder is obtained. The tin-zinc lead-free solder has good welding spot bonding strength and meanwhile can have good oxidation resistance.

Description

technical field [0001] The invention belongs to the technical field of soldering materials, and in particular relates to a tin-zinc lead-free solder and a preparation method thereof. Background technique [0002] Sn-Pb solder has been used in the electronics industry for quite a long time. Due to its low melting point, high cost performance and easy availability, it has become the most important low-temperature solder system and is widely used in non-ferrous metals, Welding of food containers, construction, machinery and piping installations, etc. However, with the advent of the information age, electronic products emerge in an endless stream. While these electronic products benefit mankind, the lead contained in them is also increasingly polluting the ecological environment and human health. According to the requirements of WEEE Directive and RoHS Directive, starting from July 1, 2006, the use of lead and other six toxic and harmful substances in electronic and electrical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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