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Silicon-based micro pulse heat pipe with micro/nano composite structures

A composite structure and pulsating heat pipe technology, which is applied in cooling/ventilation/heating transformation, indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of uneven micro pulsating heat pipe start-up state, dry-out temperature, etc., and achieve load-bearing improvement The ability of heat load and cooling temperature control performance, the effect of improving cooling efficiency and enhancing heat transfer capacity

Inactive Publication Date: 2017-05-10
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the technical defects such as "burning dry" and uneven temperature in the internal working fluid evaporation section of the silicon-based micro pulsating heat pipe with ordinary channels, and the poor start-up state of the existing micro pulsating heat pipes. A silicon-based micro-pulsating heat pipe with a micro / nano composite carbon nanotube array structure that has the characteristics of both a liquid-absorbing wick heat pipe and an ordinary pulsating heat pipe, which can significantly improve the start-up state of the heat pipe, improve its cooling temperature control performance and heat load carrying capacity

Method used

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  • Silicon-based micro pulse heat pipe with micro/nano composite structures
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  • Silicon-based micro pulse heat pipe with micro/nano composite structures

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Embodiment 1

[0027] Embodiment 1: as Figure 1~Figure 6 As shown, the silicon-based micro pulsating heat pipe with a micro / nano composite structure is formed by bonding a pair of semiconductor silicon wafers 1 and heat-resistant borosilicate glass wafers 4 . The surface of the silicon wafer 1 in contact with the borosilicate glass wafer 4 is etched with a microchannel 2 with a rectangular cross-section by plasma dry etching technology; the surface of the microchannel 2 is covered with a layer of carbon nanotubes by the silicon-based surface carbon nanotube array growth technology. tube 7, thereby forming a micro / nano composite structure surface 5 with a micro-rib 6 composite structure; the borosilicate glass sheet 4 is processed with a vacuum / liquid injection hole 8; the vacuum / liquid injection hole 8 and the vacuum / liquid injection The top positions of the microchannels 3 are corresponding. Fill 50% volume fraction of FC-72 from the vacuum / injection hole 8.

[0028] Figure 1~Figure 4 ...

Embodiment 2

[0030] Embodiment 2: as Figure 1~Figure 4 , Figure 5 and Figure 7 As shown, with embodiment 1, the difference is that the micro-rib composite structure and Figure 6 There are certain differences in . The cross-sectional shape and depth of the microchannel are the same as in Example 1, Figure 7 The micro-rib height, diameter and longitudinal / transverse spacing of the carbon nanotube array in the micro-rib composite structure are all the same as Figure 6 Same, but the carbon nanotube bundles are arranged in a forked row.

[0031] Similarly, if Figure 7 The silicon-based micro-pulsating heat pipe with micro-nano composite structure inherits the liquid-absorbing core function of the traditional heat pipe, and enhances the wetting and re-wetting effect of the working fluid in the tube, effectively enhancing the heat transfer and temperature control ability.

Embodiment 3

[0032]Embodiment 3: Same as embodiment 1 and embodiment 2, the cross-sectional shape and depth of the micro-channel of the micro-nano composite structure silicon-based micro-pulsation heat pipe are the same as in embodiment 1, except that the surface of the micro-channel is as follows: Figure 8 . Figure 8 The medium-micro-nano composite structure is a microcavity 9 of a carbon nanotube array, wherein the shape, height, arrangement and density of the microcavity 9 are the same as those in Example 1.

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Abstract

The invention relates to a pulse heat pipe, in particular to a silicon-based micro pulse heat pipe with micro / nano composite structures. The micro pulse heat pipe is formed by bonding a semiconductor silicon wafer and a heat-resisting borosilicate glass piece which are in a pair. Vacuum pumping / liquid injecting holes are machined in the borosilicate glass piece. The vacuum pumping / liquid injecting holes correspond to the positions of the top ends of vacuum pumping / liquid injecting micro slots in the semiconductor silicon wafer. Multiple micro slots are etched in the semiconductor silicon wafer, and the surfaces of the micro slots are the micro / nano composite structures formed by carbon nano pipe bundles. According to the silicon-based micro pulse heat pipe with the micro / nano composite structures, the defects that an evaporation section of a common micro pulse heat pipe is likely to be burnt out, the starting temperature is too high, and the starting time is too long are overcome; and the purposes of improving the heat pipe cooling temperature control performance and improving the heat load bearing capability can be achieved by changing the channel section size of the pulse heat pipe, changing the shape of the micro slot surface carbon nano pipe bundles and the like.

Description

technical field [0001] The invention relates to a silicon-based micro-pulsation heat pipe cooler with a micro / nano composite carbon nanotube array structure, which is applied to the technical field of high-efficiency temperature-controlled cooling of integrated IC electronic components. Background technique [0002] With the rapid development of microelectronics technology and large-scale integrated circuits, the heating intensity of microelectronic chips is increasing. If the generated heat cannot be removed in time, it will seriously affect the working performance and service life of microelectronic components and even the entire system. Therefore, it is an urgent task for the development of this field to develop efficient and compact microelectronic temperature control technology to solve the problems of narrow chip cooling space and difficult heat dissipation. [0003] Among various heat dissipation and cooling technologies for microelectronic devices, pulsating heat pip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/02F28D15/04F28D15/046F28D2015/0225H05K7/20336
Inventor 屈健孙芹袁建平张若梅杨学贵
Owner JIANGSU UNIV
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