Preparation method for polyester amide hot melt adhesive

A polyester amide, hot melt adhesive technology, applied in the direction of adhesives, etc., can solve the problems of high temperature viscosity, unfavorable molding, low softening point, poor low temperature resistance, etc., and achieve good high and low temperature resistance and mechanical properties, high temperature viscosity. , easy to produce effect

Inactive Publication Date: 2017-05-31
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary polyamide hot melt adhesives have poor low temperature resistance, low softening point, high temperature viscosity is not conducive to molding, and cannot meet the special requirements of industries such as ideas and automobiles.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Add 87.0g of sebacic acid, 45.0g of hexamethylenediamine, 1.8g of tetrakis[β-(3,5-di-tert-butyl-4 -Hydroxyphenyl) propionic acid] pentaerythritol ester, 0.5g hypophosphorous acid, under the protection of nitrogen, heat while stirring, then slowly heat up, the temperature rises to 260 ° C, and continuously steam out the reaction generated while heating Water, react for 2 hours to form a polyamide prepolymer, then add 129.0g polyether diol 3000 (molecular weight 3000) and react for 3 hours, dehydrate in vacuum for 2 hours, the vacuum pressure is -0.09MPa, and finally re- Discharge under protection to obtain the polyester amide hot melt adhesive.

Embodiment 2

[0022] Add 100.0g sebacic acid, 20.8g ethylenediamine, 3.0g tris(2,4-di-tert-butylphenyl)phosphite Ester, 1.5g boric acid, under the protection of nitrogen, heat while stirring, then slowly increase the temperature, the temperature rises to 260 ° C, continuously distill the water generated by the reaction while heating, and react for 2 hours to form a polyamide prepolymer , then add 148.0g polyether diol (molecular weight: 1000) and react for 3 hours, dehydrate in vacuum for 2h, vacuum pressure is -0.09MPa, and finally discharge under nitrogen protection to obtain the polyester amide Hot melt glue.

Embodiment 3

[0024] In a 500mL four-necked flask equipped with a thermometer, stirrer, reflux and nitrogen tube, add 100.0g of sebacic acid, 81.2g of decanediamine, 2.8g of 1,2-bis(3,5-di-tert-butyl-4 -Hydroxy-phenylpropionic acid) hydrazine, 2.5g of phosphoric acid, under the protection of nitrogen, heat while stirring, then slowly heat up, the temperature rises to 260 ° C, and continuously distill out the water generated by the reaction while the temperature is rising, the reaction Generate polyamide prepolymer in 2 hours, then add 97.0g polyether diol (molecular weight: 4000) and react for 3 hours, dehydrate in vacuum for 2 hours, vacuum pressure is -0.09MPa, and finally discharge under nitrogen protection , to obtain the polyester amide hot melt adhesive.

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PUM

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Abstract

The invention relates to a preparation method for a polyester amide hot melt adhesive. The preparation method includes the steps of: 1) adding a binary acid, a binary amine, a catalyst, and an antioxidant into a reactor, and stirring and heating the mixture under protection of nitrogen gas; 2) slowly increasing the temperature to 220-280 DEG C, and meanwhile continuously evaporating water generated in a reaction during the temperature increase, and performing the reaction for 1-3 h to obtain a polyamide prepolymer; and 3) adding polyether glycol or polyester glycol and performing a reaction for 1-5 h, vacuum-dehydrating the products for 1-3 h, and discharging the products under protection of nitrogen gas to prepare the polyester amide hot melt adhesive. The polyester amide hot melt adhesive has excellent high- and low-temperature resistance and mechanical performance, has high adhesion force on various substrates, is environment-friendly and solvent-free, and can be widely applied in the fields of automobiles and electronics.

Description

technical field [0001] The invention relates to a preparation method of a polyester amide hot-melt adhesive, which belongs to the field of hot-melt adhesives. Background technique [0002] Polyester amide hot melt adhesive is a modified polyamide containing both amide bonds and ester bonds. It has good adhesion to various polar substrates, has good flexibility, has a wide range of applications, and is environmentally friendly. Solvent, better chemical resistance and excellent molding performance, can be widely used in electronic appliances, automobiles, packaging, machinery and other industries. However, ordinary polyamide hot melt adhesives have poor low temperature resistance, low softening point, high temperature viscosity is not conducive to molding, and cannot meet the special requirements of industries such as ideas and automobiles. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the present invention provides a polyether-modified pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G81/00C08G69/26C09J187/00C08K5/134C08K3/32C08K5/526C08K3/38C08K5/25
CPCC08G81/00C08G69/26C08K3/32C08K3/38C08K5/1345C08K5/25C08K5/526C09J187/00
Inventor 陈加立白战争王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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