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Micro drill provided with transition metal boride coating and used for PCB and preparation method of micro drill

A transition metal, boride technology, applied in metal material coating process, coating, twist drill and other directions, can solve the problems of high residual stress of PCB hard coating, easy peeling of film layer, low bonding strength of film base, etc. To achieve the effect of improving the bonding strength of the film base, not easy to peel off, and strong bonding force

Active Publication Date: 2017-05-31
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a low-stress transition metal boride coating micro-drill for PCB and its preparation method, to solve the problem of high residual stress of PCB hard coating, easy peeling of film layer and combination of film and base in the prior art. low intensity problem

Method used

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  • Micro drill provided with transition metal boride coating and used for PCB and preparation method of micro drill
  • Micro drill provided with transition metal boride coating and used for PCB and preparation method of micro drill
  • Micro drill provided with transition metal boride coating and used for PCB and preparation method of micro drill

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A preparation method for a PCB micro-drill with a transition metal boride coating, comprising the following steps:

[0057] (1) Pretreatment: Use the YG6 (WC-6% Co) cemented carbide micro-drill sold in the domestic market as the substrate, first put the micro-drill into the acetone solution for ultrasonic cleaning for 10-20 minutes, and then put it into the alcohol solution Ultrasonic cleaning for 10 to 20 minutes, then dry the surface with dry nitrogen, and then put the blade in a vacuum drying oven to dry;

[0058] (2) Furnace loading: open the vacuum chamber door of the sputter coating equipment, and clamp the micro drill on the fixture;

[0059] (3) Vacuuming: close the door of the vacuum chamber, open the water cooler to connect the magnetron target, molecular pump, and the water circuit of the vacuum chamber, turn on the main power supply of the air compressor and coating machine, and then turn on the mechanical pump and the fore-stage valve for molecular Pump va...

Embodiment 2

[0072] A preparation method for a PCB micro-drill with a transition metal boride coating, comprising the following steps:

[0073] (1) Pre-treatment: Use the YG8 (WC-8% Co) cemented carbide micro-drill sold in the domestic market as the substrate, first put the micro-drill into the acetone solution for ultrasonic cleaning for 10 minutes, and then put it into the alcohol solution for further cleaning. Ultrasonic cleaning for 15 minutes, then dry the surface with dry nitrogen, and then put the blade in a vacuum drying oven to dry;

[0074] (2) Furnace loading: open the vacuum chamber door of the sputter coating equipment, and clamp the micro drill on the fixture;

[0075] (3) Vacuuming: close the door of the vacuum chamber, open the water cooler to connect the magnetron target, molecular pump, and the water circuit of the vacuum chamber, turn on the main power supply of the air compressor and coating machine, and then turn on the mechanical pump and the fore-stage valve for molecu...

Embodiment 3

[0082] Using YT15 carbide micro drill, using CrB 2 Depositing CrB on micro-drills as a sputtering target 2 coating. Ion source working current 30A, working voltage 75V, sputtering target power 8W / cm 2 , the negative bias voltage is 255V, the deposition temperature is 550°C, and the coating thickness is 2.5μm.

[0083] Example 3

[0084] A preparation method for a PCB micro-drill with a transition metal boride coating, comprising the following steps:

[0085] (1) Pretreatment: Using the YT15 cemented carbide micro-drill bit sold in the domestic market as the substrate, first put the micro-drill into acetone solution for ultrasonic cleaning for 10 minutes, then put it into alcohol solution for ultrasonic cleaning for 15 minutes, and then dry it with Nitrogen blows the surface dry, and then puts the blade in a vacuum drying oven to dry;

[0086] (2) Furnace loading: open the vacuum chamber door of the sputter coating equipment, and clamp the micro drill on the fixture;

[0...

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Abstract

The invention provides a preparation method of a micro drill provided with a transition metal boride coating and used for a PCB. The preparation method includes the steps that a micro drill base body is subjected to cleaning treatment, the cleaned micro drill is installed in a sputtering coating device, vacuumizing is performed, a heating device is started to heat the micro drill base body, and then ion bombardment cleaning is performed on the surface of the micro drill base body; and under the situation that it is kept that an ion source still works, the transition metal boride coating is deposited in a sputtering manner, in the deposition process, the heat stress and the growing stress are regulated by adjusting and controlling the deposition temperature and the negative bias pressure set on the base body, and therefore the transition metal boride coating with the stress being low and even being zero is obtained. The coating is smooth and compact, low in friction coefficient, high in binding force with the base body, not prone to stripping and suitable for preparation of a hard abrasion-resistant coating on the micro drill used for the PCB. The invention further provides the micro drill provided with the transition metal boride coating and used for the PCB.

Description

technical field [0001] The invention relates to the technical field of printed circuit board (PCB) micro-drill coating, in particular to a micro-drill for PCB with a transition metal boride coating and a preparation method thereof. Background technique [0002] Printed Circuit Board (PCB) is the core component of the electronics industry. The quality of micro-drills for PCB conduction, which consumes billions of pieces each year, has become the core issue of PCB manufacturing technology innovation. With the development of downstream electronic products in the direction of lightness, thinness and smallness, high precision, high integration and thinness have become important development trends of PCB boards, especially with the application and application of difficult-to-process materials such as halogen-free PCB boards and flexible PCB boards Due to the high-speed technical requirements, ordinary carbide micro-drills are difficult to meet the processing requirements of PCB bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/06B23B51/02
CPCB23B51/02C23C14/067C23C14/345C23C14/35
Inventor 唐永炳蒋春磊朱海莉
Owner SHENZHEN INST OF ADVANCED TECH
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