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Plating solution for the process of plating stainless steel surface with palladium and application thereof

A stainless steel and liquid-passing technology, which is applied in the field of palladium-plating on the surface of stainless steel, can solve the problems of difficult to obtain thick palladium coating, high internal stress of palladium coating, poor ductility, etc., and achieve easy expansion of production, good adhesion, palladium layers of detailed effects

Inactive Publication Date: 2017-05-31
JIANGSU AOGUANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is practically found that the internal stress of the palladium coating obtained from the traditional palladium electroplating solution is high, the ductility is poor, and it is difficult to obtain a bright thick palladium coating

Method used

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  • Plating solution for the process of plating stainless steel surface with palladium and application thereof
  • Plating solution for the process of plating stainless steel surface with palladium and application thereof
  • Plating solution for the process of plating stainless steel surface with palladium and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The composition of the electroplating solution is as follows:

[0021] Dichlorotetraammine palladium 0.3mol / L, diammonium hydrogen phosphate 0.001mol / L, potassium pyrophosphate 0.001mol / L, sodium sulfate 0.003mol / L, arginine 0.002mol / L, sodium hydroxide 0.003mol / L , aspartic acid 0.004mol / L, glutamic acid 0.004mol / L, dihydroxyacetone phosphate 0.0002mol / L, hydroxyethyldiaminetetraacetic acid 0.02~0.03mol / L, ethylenediamine 0.01~0.02mol / L , Hydroxyethylaminoacetic acid 0.03~0.05mol / L, pH 7.8~8.2, solvent is water.

[0022] Plating method:

[0023] Put the cleaned stainless steel into the palladium ferry solution, the current density is 0.1~0.5.A / dm 2 , the temperature of the liquid is 28°C, and the tank pressure is 4V.

[0024] Plating effect:

[0025] The palladium-coated layer was observed under a microscope, and the palladium layer was fine, without cracks, and uniform in color; after baking for 5 minutes at a temperature of 200°C, the coating had no peeling or bu...

Embodiment 2

[0029] The composition of the electroplating solution is as follows:

[0030] Dichlorotetraammine palladium 0.5mol / L, diammonium hydrogen phosphate 0.002mol / L, potassium pyrophosphate 0.0015mol / L, sodium sulfate 0.004mol / L, arginine 0.001mol / L, sodium hydroxide 0.0035mol / L , aspartic acid 0.003mol / L, glutamic acid 0.004mol / L, dihydroxyacetone phosphate 0.00025mol / L, hydroxyethyldiaminetetraacetic acid 0.02~0.03mol / L, ethylenediamine 0.01~0.02mol / L , Hydroxyethylaminoacetic acid 0.03~0.05mol / L, pH 7.8~8.2, solvent is water.

[0031] Plating method:

[0032] Put the cleaned stainless steel into the palladium ferry solution, the current density is 0.1~0.5.A / dm 2 , The temperature of the liquid is 35°C, and the tank pressure is 4V.

[0033] Plating effect:

[0034] The palladium-coated layer was observed under a microscope, and the palladium layer was fine, without cracks, and uniform in color; after baking for 5 minutes at a temperature of 200°C, the coating had no peeling or...

Embodiment 3

[0038] The composition of the electroplating solution is as follows:

[0039] Dichlorotetraammine palladium 0.4mol / L, diammonium hydrogen phosphate 0.002mol / L, potassium pyrophosphate 0.002mol / L, sodium sulfate 0.0035mol / L, arginine 0.0025mol / L, sodium hydroxide 0.003mol / L , aspartic acid 0.004mol / L, glutamic acid 0.0035mol / L, dihydroxyacetone phosphate 0.00025mol / L, hydroxyethyldiaminetetraacetic acid 0.025mol / L, ethylenediamine 0.02mol / L, hydroxyethyl Glycine 0.035mol / L, pH 7.8~8.2, solvent is water.

[0040] Plating method:

[0041] Put the cleaned stainless steel into the palladium ferry solution, the current density is 0.1~0.5.A / dm 2 , The temperature of the liquid is 35°C, and the tank pressure is 4V.

[0042] Plating effect:

[0043] The palladium-coated layer was observed under a microscope, and the palladium layer was fine, without cracks, and uniform in color; after baking for 5 minutes at a temperature of 200°C, the coating had no peeling or bubbling phenomenon,...

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PUM

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Abstract

The invention discloses a plating solution for the process of plating a stainless steel surface with palladium. The plating solution comprises the following components of 0.3-0.5 mol / L of Palladium tetrammine chloride, 0.001-0.003 mol / L of diammonium phosphate, 0.001-0.003 mol / L of potassium pyrophosphate, 0.003-0.004 mol / L of sodium sulfate, 0.002-0.003 mol / L of arginine, 0.003-0.004 mol / L of sodium hydroxide, 0.001-0.005 mol / L of aspartic acid, 0.003-0.005 mol / L of glutamic acid, 0.0002-0.0003 mol / L of dihydroxyacetone phosphate and complexing agents. The potential of hydrogen is 7.8-8.2. Water serves as a solvent. When observed under a microscope, a palladium plating layer is compact, no crack exists, and the color is uniform; and after baked at the temperature of 200 DEG C for 5 min, the plating layer is free from peeling and bubbling phenomena, and adhesive force is quite good.

Description

technical field [0001] The invention belongs to the technical field of metal plating solution, in particular to a solution for plating palladium on the surface of stainless steel and its application. Background technique [0002] Because palladium coating has excellent properties such as corrosion resistance, light resistance, wear resistance and electrical properties, and is cheaper than gold coating, it can reduce manufacturing costs, so palladium coating is widely used in decorative materials, electrical contacts, connectors And printed boards and other parts. It is practically found that the internal stress of the palladium coating obtained from the traditional palladium electroplating solution is relatively high, the ductility is poor, and it is difficult to obtain a bright thick palladium coating. [0003] In recent years, the shape of various palladium-plated decorative materials has become increasingly complex, and the palladium coating is required to be sufficientl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/52
CPCC25D3/52
Inventor 何爱芝彭红军袁小菊丁荣军丁会梅
Owner JIANGSU AOGUANG ELECTRONICS
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