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New energy organosilicone pouring sealant with high thermal conductivity and low specific gravity

A silicone potting, high thermal conductivity technology, applied in adhesives, heat exchange materials, non-polymer adhesive additives, etc., can solve the problems of low adhesion, high hardness, low mechanical properties, etc., and achieve high Effects of thermal conductivity, low specific gravity, good handleability and flow

Pending Publication Date: 2017-06-13
宁波聚力新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since silicone rubber itself does not have such thermal conductivity, it is generally necessary to add fillers with high thermal conductivity, and a large amount of fillers are required to be filled to achieve high thermal conductivity (patent US8796190, EP 0745643, JP 107003), such filling will damage silicon The operability of rubber makes rubber become low mechanical properties, low adhesion, high hardness

Method used

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  • New energy organosilicone pouring sealant with high thermal conductivity and low specific gravity
  • New energy organosilicone pouring sealant with high thermal conductivity and low specific gravity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 100 parts of dimethylvinylsiloxy-terminated dimethyl polysiloxane, 20 parts of modified spherical boron nitride, 10 parts of modified spherical magnesium oxide, 100 parts of modified silicon Micro powder, 50 parts of modified aluminum hydroxide, 3 parts of graphene, stirred and dispersed for 60 minutes at 120°C, -0.06Mpa. Add 10ppm platinum catalyst and stir to disperse evenly to make component A.

[0029] Add 100 parts of dimethylvinylsiloxy-terminated dimethyl polysiloxane, 20 parts of modified spherical boron nitride, 10 parts of modified spherical magnesium oxide, 100 parts of modified silicon Micropowder, 50 parts of modified aluminum hydroxide, 3 parts of graphene, stirred at 120°C and -0.06MPa for 60 minutes. Add 5 parts of hydrogen-containing polysiloxane to synthesize 2, 30ppm of benzotriazole, stir and disperse evenly, and make B component.

[0030] Mix components A and B according to the mass ratio of 1:1, and the test results are shown in Table 1.

Embodiment 2

[0032] Add 85 parts of dimethylvinylsiloxy-terminated dimethylpolysiloxane, 10 parts of dimethylvinylsiloxy-terminated methylvinylsiloxane and two Copolymer of methyl siloxane, 5 parts of modified spherical boron nitride, 20 parts of modified spherical magnesium oxide, 100 parts of modified silicon micropowder, 60 parts of modified aluminum hydroxide, 1 part of graphene, at 120 ° C, Stir for 40 minutes under the condition of -0.08Mpa. Cool to room temperature, stir and disperse the 10ppm platinum catalyst evenly to make component A.

[0033] Add 85 parts of dimethylvinylsiloxy-terminated dimethylpolysiloxane, 10 parts of dimethylvinylsiloxy-terminated methylvinylsiloxane and two Copolymer of methyl siloxane, 5 parts of modified spherical boron nitride, 20 parts of modified spherical magnesium oxide, 100 parts of modified silicon micropowder, 60 parts of modified aluminum hydroxide, 1 part of graphene, at 120 ° C, Stir for 40 minutes under the condition of -0.08Mpa. Add 2 pa...

Embodiment 3

[0036] Add 95 parts of dimethylvinylsiloxy terminated dimethylpolysiloxane, 15 parts of terminated trimethylvinylmethyl-dimethylsiloxane, 15 parts of 5 10 parts of modified graphene, 10 parts of modified spherical magnesium oxide, 10 parts of modified boron nitride, 100 parts of modified silicon micropowder, 60 parts of modified aluminum hydroxide, stirred for 40 minutes at 120 ° C, -0.08Mpa . Cool to room temperature, stir and disperse the 10ppm platinum catalyst evenly to make component A.

[0037] Add 100 parts of dimethylvinylsiloxy-terminated dimethyl polysiloxane, 10 parts of 15 parts of terminated trimethylvinylmethyl-dimethylsiloxane, 5 parts in a planetary mixer 10 parts of modified graphene, 10 parts of modified spherical magnesium oxide, 10 parts of modified boron nitride, 100 parts of modified silicon micropowder, 60 parts of modified aluminum hydroxide, stirred for 40 minutes at 120 ° C, -0.08Mpa . Add 2 parts of hydrogen-containing polysiloxane to synthesize 1...

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Abstract

The invention discloses a new energy organosilicone pouring sealant with high thermal conductivity and low specific gravity. The new energy organosilicone pouring sealant comprises (A) linear or branched chain polysiloxane of at least two vinyl bonded silicon atoms or mixture thereof; (B) at least two silicon-hydrogen bonded polysiloxane, at least one epoxy group and at least one alkoxy; (C) an addition reaction catalyst; and (D) a thermal-conducting filler treated through a special process, specifically, a compound filler of graphene, a short carbon fiber, silica powder, aluminium hydroxide, a spherical magnesium oxide and spherical boron nitride. The thermal conductivity is greater than or equal to 0.95W / m.K and the specific gravity is smaller than or equal to 1.6g / ml.

Description

technical field [0001] The invention relates to the field of silicone potting glue, in particular to a new energy high thermal conductivity low specific gravity silicone potting glue. Background technique [0002] Silicone rubber is widely used in various fields due to its excellent electrical insulation properties, high and low temperature resistance, weather resistance, and flame retardancy. With the increase in the density and integration of electronic components, and the rapid rise of the new energy field, the heat conduction potting compound characterized by heat radiation also requires higher heat conduction and lower specific gravity. Since silicone rubber itself does not have such thermal conductivity, it is generally necessary to add fillers with high thermal conductivity, and a large amount of fillers are required to be filled to achieve high thermal conductivity (patent US8796190, EP 0745643, JP 107003), such filling will damage silicon The operability of rubber ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09K5/14
CPCC09J183/04C08K2201/003C08K2201/014C08L2203/206C08L2205/025C08L2205/03C08L2205/035C09J11/04C09K5/14C08L83/04C08K13/06C08K9/06C08K7/18C08K2003/2227C08K3/36C08K3/04C08K7/06
Inventor 胡肖波刘锐胡杰陈深然
Owner 宁波聚力新材料科技有限公司
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