Composition for packaging photoelectric device

A technology for optoelectronic devices and compositions, applied in the direction of electrical solid devices, electrical components, semiconductor devices, etc., can solve the problems that the application of optoelectronic device packaging materials with optical properties has never been reported, and achieves improved moisture and heat resistance, high crack resistance, The effect of improving light resistance

Active Publication Date: 2017-06-23
汇涌进光电(浙江)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, until now, the curing system of esterified phenolic resin and arylphenol-based resin with esterified structure and a

Method used

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  • Composition for packaging photoelectric device
  • Composition for packaging photoelectric device
  • Composition for packaging photoelectric device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] (1) Preparation of ethyl esterified phenolic resin:

[0041] Weigh 200g of H-4 phenolic resin in a three-necked bottle, add 750mL of acetic anhydride to dissolve, and then add 25mL of pyridine as a catalyst. Stir continuously under the protection of nitrogen, and place it in an oil bath and heat it to 100°C. After continuing the reaction for 24 hours, heat to evaporate most of the remaining acetic anhydride and pyridine; add 1000mL of chloroform to dissolve it, and transfer it to a separatory funnel , with a mass fraction of 3% NaHCO 3 Wash the solution several times until no bubbles are released; then add pure water to wash several times, take out the organic layer of chloroform, dry it with anhydrous magnesium sulfate overnight, distill off the chloroform, and place it in a vacuum oven for further drying.

[0042] (2) Preparation of butyl esterified copolymerized phenolic resin:

[0043] Weigh 200g of MEH-7800 type resin in a three-necked bottle, add 800mL of butyri...

experiment example 1

[0047] Heat and stir 100g of epoxy resin ERL-4221 and 108g of ethyl esterified phenolic H-4 at 80°C, add 0.5g of coupling agent, 0.5g of antioxidant and 0.3g of catalyst, stir until transparent and clear, defoam and cool .

experiment example 2～7

[0049] According to the ratio in Table 1, heat and mix at 80°C, stir until transparent and clear, then defoam and cool.

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PUM

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Abstract

The invention discloses a composition for packaging a photoelectric device. The composition comprises the following components in percentage by mass: 90 to 100 percent of a mixture of esterified aromatic phenol and epoxy resin, 0.1 to 2 percent of a catalyst, 0.2 to 2 percent of a coupling agent, 0.1 to 0.5 percent of an anti-aging agent, 0.1 to 0.5 percent of a colorant and 10 to 90 percent of a filler, wherein the equivalence ratio of the esterified aromatic phenol and the epoxy resin in the mixture of the esterified aromatic phenol and epoxy resin is 0.8 to 1.2. According to the composition for packaging the photoelectric device, the aromatic phenol resin with an esterified structure is combined with the epoxy resin and the other components, so that a cured material with undamaged heat resistance and light fastness can be formed, and the toughness, damp-heat resistance stability (particularly reliability of reflow soldering, damp-heat and salt-fog resistance), sealing performance and crack resistance of the cured material are relatively high.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a composition for encapsulating optoelectronic devices. Background technique [0002] With the continuous development of miniaturization, portability, and high output of optical-electronic equipment, the application range of packaging materials has also expanded, and the reliability requirements for materials have also become higher and higher. For common LEDs, optical devices, and related electronic devices, the packaging materials usually use epoxy / anhydride systems to ensure the optical stability of the packaging materials. However, due to the hygroscopicity of the anhydride in the epoxy / anhydride system, moisture during storage and processing will lead to a significant deterioration in performance. In addition, due to the high moisture absorption rate of the cured material, interfacial peeling often occurs due to the "popcorn" phenomenon when the device passes...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/14C08K5/3445H01L33/56H01L23/29
CPCC08L63/00C08L2201/08C08L2203/206C08L2205/025C08L2205/03H01L23/295H01L33/56C08L61/14C08K5/3445
Inventor 余英丰金峥祝运芝
Owner 汇涌进光电(浙江)有限公司
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