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A kind of manufacturing method of high-performance composite carbon fiber insulation board

A technology for compounding carbon fibers and a manufacturing method, which is applied in textiles and papermaking, etc., can solve the problems of low strength, poor oxidation resistance and high binder content of carbon fiber hard felts, and achieve energy saving, high stability and low production costs. Effect

Active Publication Date: 2022-07-26
辽宁奥亿达新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The carbon fiber hard felt produced by the dipping molding process has the disadvantages of high energy consumption, low strength between layers of carbon fiber hard felt, easy cracking, low service life, high binder content, and poor oxidation resistance.

Method used

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  • A kind of manufacturing method of high-performance composite carbon fiber insulation board
  • A kind of manufacturing method of high-performance composite carbon fiber insulation board
  • A kind of manufacturing method of high-performance composite carbon fiber insulation board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] In this embodiment, the manufacturing method of the high-performance composite carbon fiber thermal insulation board is as follows:

[0071] 1) Preparation of chopped carbon fibers; chopped pitch-based carbon fibers to obtain chopped carbon fibers with an average length of 40mm;

[0072] 2) preparing ground carbon fibers; grinding the pitch-based carbon fibers to obtain ground carbon fibers with an average length of 100 μm;

[0073] 3) fully mixing the chopped carbon fiber and the ground carbon fiber according to the weight ratio of 60:40 using a cyclone to obtain the mixed carbon fiber;

[0074] 4) Mix the mixed carbon fiber with organic binder phenolic resin and solvent ethanol in a weight ratio of 100:30:70 to obtain a carbon fiber mixed solution; put the carbon fiber mixed solution into a mesh bag, and pass through a mesh with a mesh aperture of 30 μm. After the initial filtration of the bag, hot air at 50°C was used to blow directly into the mesh bag for 30 minute...

Embodiment 2

[0082] In order to increase the anti-airflow erosion and anti-oxidation performance of the composite carbon fiber thermal insulation board 9, and further improve its service life; the composite carbon fiber thermal insulation board 9 obtained in [Example 1] is subjected to surface treatment, and the specific steps of the surface treatment are as follows:

[0083] 1) The composite carbon fiber insulation board 9 is subjected to surface polishing treatment by machining to make the surface smooth;

[0084]2) The upper and lower surfaces of the composite carbon fiber thermal insulation board 9 after the surface polishing treatment are respectively painted with binder 3 to 6 times to form the binder layer 10, and the binder can be conventionally used binder;

[0085] 3) Put the composite carbon fiber insulation board 9 coated with the adhesive layer 10 into the heating furnace, heat up to 240°C at a heating rate of 5°C / min, keep the temperature at this temperature for 1 hour, and cu...

Embodiment 3

[0088] In this embodiment, the manufacturing method of the high-performance composite carbon fiber thermal insulation board is as follows:

[0089] 1) Preparation of chopped carbon fiber; chopped pitch-based carbon fiber to obtain chopped carbon fiber with an average length of 80mm;

[0090] 2) preparing ground carbon fibers; grinding the pitch-based carbon fibers to obtain ground carbon fibers with an average length of 180 μm;

[0091] 3) fully mixing the chopped carbon fiber and the ground carbon fiber according to the weight ratio of 50:50 using a cyclone to obtain the mixed carbon fiber;

[0092] 4) Mix the mixed carbon fiber with organic binder phenolic resin and solvent ethanol in a weight ratio of 100:55:75 to obtain a carbon fiber mixed solution; put the carbon fiber mixed solution into a mesh bag, and pass through a mesh with a mesh aperture of 30 μm. After the initial filtration of the bag, hot air at 60°C was used to blow directly into the mesh bag for 30 minutes, ...

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Abstract

The invention relates to a manufacturing method of a high-performance composite carbon fiber insulation board. After mixing carbon fibers composed of chopped carbon fibers and ground carbon fibers, organic binders and solvents, the solvent is removed, and the surface is coated with the organic binders. The composite carbon fiber is mixed with water and dispersant to form a carbon fiber mixed slurry, which is formed into a composite carbon fiber thermal insulation board pre-product by vacuum suction; dehydrate it by heating with hot steam or hot air, and complete the insolubilization and insolubilization treatment; then After carbonization or graphitization treatment, the finished composite carbon fiber thermal insulation board is obtained. The composite carbon fiber thermal insulation board prepared by the invention has the characteristics of good heat insulation performance, good oxidation resistance, low heat capacity and high strength, and the production process is simple, the cost is low, the shape and size of the finished product are controllable, and the density is adjustable; the finished product is not easy to Cracking, good self-support, long service life; after surface treatment, it can also have excellent anti-oxidation performance, and further improve the service life.

Description

technical field [0001] The invention relates to the technical field of manufacturing thermal insulation boards for high-temperature furnaces, in particular to a manufacturing method of a high-performance composite carbon fiber thermal insulation board. Background technique [0002] With the advancement of science and technology, military, national defense, solar energy, semiconductor, heat treatment and other fields are developing rapidly, and the development of these fields all involve the use of thermal insulation materials; especially in recent years, the rapid development of solar energy and semiconductors has created a demand for thermal insulation materials. It is more prominent, and the requirements for thermal insulation materials are getting higher and higher, which not only requires energy saving and consumption reduction, but also requires high anti-oxidation performance. These requirements also continue to promote the rapid development of thermal insulation materi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/83C04B35/528C04B35/52C04B35/622C04B35/634C04B41/85D21J3/00
CPCD21J3/00C04B35/522C04B35/528C04B35/622C04B35/63476C04B35/83C04B41/5001C04B41/85C04B2235/9607C04B2235/77
Inventor 陈惠龙郑淑云王红伟张作桢
Owner 辽宁奥亿达新材料股份有限公司
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