Thermally conductive composite material and preparation method thereof

A heat-conducting composite material and thermoplastic technology, which is applied in the field of composite materials, can solve the problems of poor thermal conductivity of composite materials, achieve the effects of improving heat transfer capacity, reducing interface thermal resistance and phonon scattering, and improving thermal conductivity

Active Publication Date: 2017-07-25
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the technical problem of poor thermal conductivity of existing composite materials, the present invention provides a thermally conductive composite m

Method used

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  • Thermally conductive composite material and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0025] Example 1

[0026] (1) Disperse 0.1g of reduced graphene in acetone at room temperature, add 1g of polyamide (PA) powder after uniform dispersion, adjust the pH value of the solution (PH=6) with phosphate buffer, and stir to promote graphene and thermoplasticity The particles are electrostatically adsorbed to obtain a stable suspension of self-assembled mixed filler; (2) Add the above suspension to 15.3g of bisphenol A epoxy resin and stir evenly, then add 4.6g of modified aromatic amine curing agent, and vacuum After the solvent is removed, it is heated according to the curing system to prepare a thermally conductive resin-based composite material. The thermal conductivity of the composite material was tested, and the thermal conductivity was 0.245w / m.k.

Example Embodiment

[0027] Example 2

[0028] (1) Disperse 1g of graphene in dichloromethane at room temperature, add 2g of polyether ether ketone (PEEK) powder after uniform dispersion, adjust the pH value of the solution (PH=9) with a weak base buffer, and stir to promote graphene and The electrostatic adsorption of thermoplastic particles obtains a stable suspension of self-assembled mixed filler; (2) The above suspension is added to 18.7g of phenolic epoxy resin and stirred evenly, then 1.3g of dicyandiamide curing agent is added, and the solvent is removed in vacuo , Heat according to the curing system to prepare thermally conductive resin-based composite materials. The thermal conductivity of the composite material was tested, and the thermal conductivity was 1.052w / m.k.

Example Embodiment

[0029] Example 3

[0030] (1) Disperse 0.3g of graphene in ethanol at room temperature, add 1.8g of polyetherimide (PEI) micropowder to it after uniform dispersion, adjust the pH value of the solution (PH=7) with borate buffer, and stir Promote the electrostatic adsorption of graphene and thermoplastic particles to obtain a stable suspension of self-assembled mixed filler; (2) Add the above suspension to 16.3g of bisphenol F epoxy resin and stir evenly, then add 3.7g of alicyclic amine curing agent After the solvent is removed in vacuum, it is heated according to the curing system to prepare a thermally conductive resin-based composite material. The thermal conductivity of the composite material was tested, and the thermal conductivity was 0.451w / m.k.

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Abstract

The invention relates to a thermally conductive composite material and a preparation method thereof. The technical problem that the existing composite material has poor thermal conductive performance is solved. The thermally conductive composite material comprises graphene and a resin matrix and further comprises thermoplastic micro-particles, wherein the graphene is enriched in the surfaces of the thermoplastic micro-particles, and the thermoplastic micro-particles are dispersed in the resin matrix. The invention also discloses a preparation method of the thermally conductive composite material. The thermally conductive composite material and the preparation method thereof provided by the invention can be used in the field of preparation of the thermally conductive composite material.

Description

technical field [0001] The invention belongs to the field of composite materials, in particular to a heat-conducting composite material and a preparation method thereof. Background technique [0002] Graphene has ultra-high thermal conductivity (5300w / m.k), making it the preferred filler for the preparation of high thermal conductivity resin-based composites. However, graphene is easy to agglomerate and has poor interfacial compatibility with resins, which prevents the formation of phonon transport channels and effective thermal conduction networks. Therefore, solving the dispersion and interfacial compatibility of graphene is the key to improving the thermal conductivity of graphene composites. [0003] The Chinese patent application with the application number 201410419095.0 discloses adding alkylamine-modified graphene and silane coupling agent-modified carbon nanotubes to cyanate resin, and modifying the chemical reaction between alkylamine-modified graphene and resin. ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L77/00C08L61/16C08L79/08C08K3/04C08G59/50
CPCC08G59/5026C08G59/5033C08G59/504C08L63/00C08L77/00C08K3/04C08L61/16C08L79/08
Inventor 李刚吴笛杨小平李波
Owner BEIJING UNIV OF CHEM TECH
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