Thermally conductive composite material and preparation method thereof
A heat-conducting composite material and thermoplastic technology, which is applied in the field of composite materials, can solve the problems of poor thermal conductivity of composite materials, achieve the effects of improving heat transfer capacity, reducing interface thermal resistance and phonon scattering, and improving thermal conductivity
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[0025] Example 1
[0026] (1) Disperse 0.1g of reduced graphene in acetone at room temperature, add 1g of polyamide (PA) powder after uniform dispersion, adjust the pH value of the solution (PH=6) with phosphate buffer, and stir to promote graphene and thermoplasticity The particles are electrostatically adsorbed to obtain a stable suspension of self-assembled mixed filler; (2) Add the above suspension to 15.3g of bisphenol A epoxy resin and stir evenly, then add 4.6g of modified aromatic amine curing agent, and vacuum After the solvent is removed, it is heated according to the curing system to prepare a thermally conductive resin-based composite material. The thermal conductivity of the composite material was tested, and the thermal conductivity was 0.245w / m.k.
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[0027] Example 2
[0028] (1) Disperse 1g of graphene in dichloromethane at room temperature, add 2g of polyether ether ketone (PEEK) powder after uniform dispersion, adjust the pH value of the solution (PH=9) with a weak base buffer, and stir to promote graphene and The electrostatic adsorption of thermoplastic particles obtains a stable suspension of self-assembled mixed filler; (2) The above suspension is added to 18.7g of phenolic epoxy resin and stirred evenly, then 1.3g of dicyandiamide curing agent is added, and the solvent is removed in vacuo , Heat according to the curing system to prepare thermally conductive resin-based composite materials. The thermal conductivity of the composite material was tested, and the thermal conductivity was 1.052w / m.k.
Example Embodiment
[0029] Example 3
[0030] (1) Disperse 0.3g of graphene in ethanol at room temperature, add 1.8g of polyetherimide (PEI) micropowder to it after uniform dispersion, adjust the pH value of the solution (PH=7) with borate buffer, and stir Promote the electrostatic adsorption of graphene and thermoplastic particles to obtain a stable suspension of self-assembled mixed filler; (2) Add the above suspension to 16.3g of bisphenol F epoxy resin and stir evenly, then add 3.7g of alicyclic amine curing agent After the solvent is removed in vacuum, it is heated according to the curing system to prepare a thermally conductive resin-based composite material. The thermal conductivity of the composite material was tested, and the thermal conductivity was 0.451w / m.k.
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