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High-temperature-resistant photo-curing material and preparation method thereof

A light-curing material and high-temperature-resistant technology, used in additive processing, manufacturing tools, additive manufacturing, etc., can solve the problems of poor high temperature resistance and easy cracking, and achieve the effect of strong high temperature resistance, not easy to crack, and fast curing speed

Inactive Publication Date: 2017-07-28
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a high-temperature-resistant light-curable material and its preparation method, aiming to solve the problems of existing ordinary light-curable materials that are easy to crack after molding and have poor high-temperature resistance.

Method used

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  • High-temperature-resistant photo-curing material and preparation method thereof
  • High-temperature-resistant photo-curing material and preparation method thereof
  • High-temperature-resistant photo-curing material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0042]In parts by weight, 2 parts of nano-montmorillonite and 2 parts of rectorite were added to 16 parts of 3,3,5-trimethylcyclohexyl acrylate, 15 parts of 1,6-hexanediol diacrylate Ultrasonic vibration in the mixed reactive diluent formed was 20~30min, then add the composition of 33 parts of bisphenol A type epoxy acrylates and 27 parts of bisphenol A type epoxy resins, then add 2 parts of benzoin diethyl ether, 1 Part 1-hydroxycyclohexyl phenyl ketone photoinitiator, 1.3 parts of dyeing agent, 0.4 part of leveling agent and 0.3 part of ultraviolet light absorber; The selected dyeing agent is iron oxide red, and the selected ultraviolet light absorber is Phenyl o-hydroxybenzoate, the selected leveling agent is BYK-056 from BYK Company; every time a material is added, it is ultrasonically oscillated for 15 minutes, and after the last material is added and oscillated for 15 minutes, the whole body continues to oscillate for 30 minutes until the liquid is uniform, and then the p...

Embodiment 2

[0047] In parts by weight, add 0.5 parts of nano-montmorillonite to a mixed reactive diluent consisting of 10 parts of tripropylene glycol diacrylate and 5 parts of isobornyl methacrylate and ultrasonically vibrate for 20 to 30 minutes, and then add 40 parts of Diacrylate (viscosity=12000~15000cps, 25°C) oligomer resin with ester ring, then add 1 part of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide photoinitiator, 0.1 part of malachite green, 0.1 part of leveling agent and 0.1 part of UV absorber; the selected leveling agent is BYK-056 from BYK, and the selected UV absorber is phenyl o-hydroxybenzoate; One material is ultrasonically oscillated for 15 minutes. After the last material is added and oscillated for 15 minutes, the whole body continues to oscillate for 30 minutes until the liquid is uniform, and then the prepared resin is printed out by the 3D printing equipment according to the predetermined process. The resin sample is tested according to the high temperature t...

Embodiment 3

[0050] In parts by weight, 5 parts of nano-titanium dioxide and 5 parts of montmorillonite were added to 20 parts of tripropylene glycol diacrylate, 20 parts of isobornyl methacrylate, 10 parts of 3,3,5-trimethylcyclohexane Ultrasonic vibration in the mixed active diluent composed of base acrylate for 20-30 minutes, then add 50 parts of diacrylate oligomer resin with ester ring, 30 parts of bisphenol A type epoxy acrylate composition, and then sequentially add 10 parts of 2-phenylbenzyl-2-dimethylamine-1-(4-morpholine benzylphenyl) butanone photoinitiator, 5 parts of malachite green, 5 parts of leveling agent and 5 parts of ultraviolet light absorber Phenyl o-hydroxybenzoate; the selected leveling agent is BYK-056 from BYK; every time a material is added, it is ultrasonically oscillated for 15 minutes, and after the last material is added and oscillated for 15 minutes, the whole body continues to oscillate for 30 minutes until the liquid is uniform, and then the prepared The r...

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Abstract

The invention discloses a high-temperature-resistant photo-curing material and a preparation method thereof. The high-temperature-resistant photo-curing material comprises, by weight, 40-80 parts of resin oligomer, 15-50 parts of reactive diluent, 0.5-10 parts of inorganic nano material, 1-10 parts of photoinitiator, 0.1-5 parts of dyeing agent, 0.1-5 parts of flatting agent and 0.1-5 parts of ultraviolet absorber. The high-temperature-resistant photo-curing material has the advantages that the material is low in viscosity, fast in curing, small in curing shrinkage, low in heat sensitivity and the like, and high device high temperature resistance is achieved after laser rapid prototyping.

Description

technical field [0001] The invention relates to the field of photocurable materials, in particular to a high temperature resistant photocurable material and a preparation method thereof. Background technique [0002] Laser rapid prototyping technology originated in the 1980s and is currently widely used in medical, jewelry, machinery and industrial design and other fields. The development of light-curing materials directly affects the progress of laser rapid prototyping technology. For ordinary light-curing molding materials, there are usually disadvantages such as easy cracking and deformation under high temperature. Therefore, the development of light-curable materials with low shrinkage and high temperature resistance is of great significance to expand the application of laser rapid prototyping technology under special high temperature conditions. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of ...

Claims

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Application Information

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IPC IPC(8): C08F283/10C08F220/18C08F222/14C08F222/20C08F291/08C08F2/48C08F2/44C08K3/34C08K3/36C08K3/22B33Y70/00B29C64/135
CPCB33Y70/00C08F2/44C08F2/48C08F267/06C08F283/10C08F283/105C08K3/22C08K3/34C08K3/346C08K3/36C08K2003/2241C08K2201/011C08F220/18C08F222/102
Inventor 刘武袁剑李喜露南威高云峰
Owner HANS LASER TECH IND GRP CO LTD
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