Flame-retarding electronic composite material base plate

A composite material and substrate technology, applied in electronic equipment, lamination, application, etc., can solve the problem of large signal loss, and achieve the effect of excellent performance

Inactive Publication Date: 2019-03-22
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally, as the frequency increases, the signal loss of epoxy polymers increases, especially when the frequency is above 5GHz, and as the temperature increases, the signal loss also increases, and the

Method used

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  • Flame-retarding electronic composite material base plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Dissolve 100 parts by weight of styrene-butadiene block copolymer (D1101) in toluene, add 85 parts by weight of silicon dioxide (525), 6.5 parts by weight of curing agent DCP, 22 parts by weight of The fuel SAYTEX8010 was stirred to obtain a resin solution (80% solid content), and 80 parts by weight of 1080 fiberglass cloth was used to impregnate the above resin solution to obtain a prepreg. Then dry the prepreg to remove the solvent. Laminate 8 prepregs, laminate copper foil on both sides, and heat and press in a press to make a flame-retardant electronic composite substrate.

[0033] In this embodiment, the particle size of the filler is 30-40 microns; the copper foil is 1 ounce copper foil, and the copper nodule height of the copper foil is 9-10 microns; the rough surface of the copper foil is passed through the vinyl coupling agent vinyl trimethyl Silane treatment; copper nodules are prepared on one side of the rolled copper foil or electrolytic copper foil to form...

Embodiment 2

[0036] Dissolve 100 parts by weight of styrene-butadiene block copolymer (D1101) in toluene, add 240 parts by weight of silicon dioxide (525), 7.5 parts by weight of curing agent DCP, 28 parts by weight of Combustion agent SAYTEX8010, stir to obtain resin liquid (solid content is 80%), use 125 parts by weight of 1080 fiber glass cloth to impregnate the above resin liquid and then dry to remove solvent to make prepreg, then stack 8 prepregs, place on both sides Laminated copper foil, after high-temperature hot-press curing in a press, is made into a flame-retardant electronic composite substrate; the drying temperature is 100°C, and the time is 3 minutes; the hot-pressing temperature is 250°C, and the time is 50 minutes. The pressure is 70kg / cm 2 ; Its physical data are shown in Table 1.

[0037] In this embodiment, the particle size of the filler is 40-50 microns; the copper foil is 1 ounce copper foil, and the height of the copper nodules is 10-11 microns; the rough surface ...

Embodiment 3

[0039] 90 parts by weight of styrene-butadiene block copolymer (D1101) was dissolved in toluene, and 45 parts by weight of silicon dioxide (525), 5.6 parts by weight of curing agent (mass ratio of 1:0.2 Lithium thiocyanate, neopentyl glycol diborate), flame retardant 2 of 12 weight parts, 6-dimethylphenylphosphoryl benzene, stir to obtain resin liquid (solid content is 80%), use 78 weight 1080 pieces of fiberglass cloth impregnated with the above resin solution and then dried to remove the solvent to make a prepreg, and then laminated 8 prepregs, laminated copper foil on both sides, and cured by high temperature and hot pressing in a press to make a flame retardant Electronic composite material substrate; the drying temperature is 130°C, the time is 2 minutes, the temperature of hot pressing is 290°C, the time is 42 minutes, and the pressure is 60kg / cm 2 ; Its physical data are shown in Table 1.

[0040] In this embodiment, the particle size of the filler is 30-35 microns; the ...

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Abstract

The invention relates to a flame-retarding electronic composite material base plate. The material has a base body with a low dielectric constant and a low loss factor, and is used for manufacturing alaminated board and a prepreg in the field of high-frequency and high-speed application. The thermosetting electronic composite material comprises butadiene, styrene, a butadiene-styrene copolymer ora styrene-butadiene-styrene copolymer. One important property of the laminated board prepared from a thermosetting polymer is that the laminated board has relatively low content of glass textiles andhas good comprehensive performance relative to a high particle filler range; the laminated board has excellent thermal stability (a CTE (Coefficient of Thermal Expansion) reduced in a Z axis or thickness direction), improved electric performance (loss factor) and extremely low water absorbability and is applied to the base plate for the high-frequency and high-speed application.

Description

technical field [0001] The invention relates to a flame-retardant thermosetting electronic composite substrate, which can be used for the preparation of materials in the high-frequency and high-speed communication field. Background technique [0002] In recent years, due to antennas, base stations and satellite communications requiring fast and undistorted signal transmission at high frequencies, especially in high frequency and high temperature and high humidity conditions, the signal transmission performance is consistent with normal conditions, so for high frequency applications Substrates pose new requirements. [0003] Generally, as the frequency increases, the signal loss of epoxy polymers increases, especially when the frequency is above 5GHz, and as the temperature increases, the signal loss also increases, and the frequency of the antenna and base station increases When the temperature rises higher, ordinary epoxy polymers can no longer meet the requirements, so ne...

Claims

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Application Information

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IPC IPC(8): C08L53/02C08K3/36C08K5/14C08K7/14B32B15/14B32B17/02B32B37/06B32B37/10B32B15/20
CPCB32B15/14B32B15/20B32B37/06B32B37/10B32B2260/021B32B2260/046B32B2262/101B32B2307/306B32B2307/3065B32B2457/08C08K3/36C08K5/14C08K7/14C08L53/02
Inventor 彭代信
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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