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Tin-silver alloy solder and preparation process thereof

A silver alloy soldering and preparation process technology, applied in the field of tin alloy solder, can solve the problems of short circuit, shortened service life of diodes, easy to damage chip structure, etc. Effect

Inactive Publication Date: 2017-08-29
廊坊邦壮电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Among the currently used tin-silver alloys, the thermal expansion coefficients of tin-lead alloys and tin-silver alloys are 25 and 30, respectively, while the thermal expansion coefficients of copper are 17. The difference between the thermal expansion coefficients of tin-silver alloys and copper is greater than that of tin-lead alloys and copper. Thermal expansion coefficient, when tin-silver alloy is used to replace tin-lead alloy, the product undergoes long-term thermal expansion and contraction, and metal silver is easy to damage the structure of the chip, causing a short circuit and shortening the service life of the diode

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038]a. Use an angle grinder to polish and grind the surfaces of the silver ingot and the tin ingot respectively to remove the oxides on the surface;

[0039] b. Then weigh 98 parts of tin ingots and 2 parts of silver ingots, first add 25 parts of tin ingots and 2 parts of silver ingots into the vacuum melting furnace, control the temperature between 350°C and 440°C, and the pressure of the air compressor Not less than 0.6MPa, and under the condition of electromagnetic stirring, the tin-silver liquid is mixed evenly, and then the remaining tin ingot is added and mixed evenly.

[0040] c. Using a rapid cooling device to rapidly cool down the molten tin-silver alloy liquid obtained in step b to 120° C. within two minutes to form tin-silver alloy solder.

Embodiment 2

[0042] a. Use an angle grinder to polish and grind the surfaces of the silver ingot and the tin ingot respectively to remove the oxides on the surface;

[0043] b. Then weigh 97.5 parts of tin ingots and 2.5 parts of silver ingots, first add 25 parts of tin ingots and 2.5 parts of silver ingots into the vacuum melting furnace, heat and melt, control the temperature between 350°C and 440°C, and press air The pressure of the machine is not less than 0.6MPa, and the tin-silver liquid is mixed evenly under the condition of electromagnetic stirring, and then the remaining tin ingot is added and mixed evenly;

[0044] c. Using a rapid cooling device to rapidly cool down the molten tin-silver alloy liquid obtained in step b to 120° C. within two minutes to form tin-silver alloy solder.

Embodiment 3

[0046] a. Use an angle grinder to polish and grind the surfaces of the silver ingot and the tin ingot respectively to remove the oxides on the surface;

[0047] b. Then weigh 97.5 parts of tin ingots, 2.44 parts of silver ingots, and 0.06 parts of gadolinium metal, first add 25 parts of tin ingots, 2.44 parts of silver ingots, and 0.06 parts of gadolinium metal into a vacuum melting furnace for heating and melting, and control the temperature at 350 Between ℃ and 440℃, the pressure of the air compressor is not less than 0.6MPa, and the tin-silver liquid is mixed evenly under the condition of electromagnetic stirring, and then the remaining tin ingot is added to mix evenly;

[0048] c. Use a rapid cooling device to rapidly cool down the tin-silver alloy liquid obtained in step b to 120° C. within two minutes to form tin-silver alloy solder.

[0049] d. Preparation of inorganic passivation solution: potassium dichromate, 10g / L; sodium carbonate: 20g / L; mix well, and then soak th...

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Abstract

The invention discloses tin-silver alloy solder and a preparation process thereof. The tin-silver alloy solder comprises 97-99 parts of tin metal and 1-3 parts of silver metal. In the prepared tin-silver alloy solder, the average particle size of the silver metal is smaller than 50 micrometers, and the silver metal is distributed in the tin metal evenly. Through the tin-silver alloy solder prepared with the preparation process, the thermal expansion coefficient of tin-silver alloy can be lowered, the difference value between the thermal expansion coefficients of the tin-silver alloy and a diode welded assembly is reduced, the condition that a short circuit occurs to a product is improved, and service life of a diode is prolonged.

Description

technical field [0001] The invention relates to a tin alloy solder, in particular to a tin-silver alloy solder and a preparation process thereof. Background technique [0002] Solder alloy is an alloy material composed of two or more metal elements with general metal characteristics. At present, the commonly used solder alloys are mostly binary alloys or multi-element alloys formed by adding tin as the main body and adding other metal elements. Because of their excellent corrosion resistance and solderability, they can be used as electronic devices, wires, and printed circuit boards. It is widely used in the electronics industry as a protective layer and solderability coating for integrated circuit boards. [0003] Traditional solder alloys mostly use tin-lead alloys. The cost of lead metal is low and the wettability is good. Moreover, the melting point of tin-lead alloys containing 37% lead is relatively low. It can be melted at 183°C, and the soldering temperature is lowe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 徐振五
Owner 廊坊邦壮电子材料有限公司
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