Halogen-free thermosetting resin composition and prepreg and printed circuit laminate employing halogen-free thermosetting resin composition

Abstract

The invention relates to a halogen-free thermosetting resin composition and a prepreg and a printed circuit laminate employing the halogen-free thermosetting resin composition. An organic condensate of the halogen-free thermosetting resin composition comprises the ingredients in parts by weight (based on 100 parts): (A) 5-50 parts of cyanate resin; (B) 5-40 parts of polyphenylether resin; (C) 5-30 parts of phosphoric bisphenol polymer; (D) 30-60 parts of halogen-free epoxy resin. The prepreg and the printed circuit laminate made from the halogen-free thermosetting resin composition, provided by the invention, have high glass transition temperature, excellent dielectric properties, low water absorption rate, high heat resistance, high peel strength, excellent humidity resistance and good process processability, can achieve no halogen and flame retardance and reaches UL94 V-0.

Description

technical field [0001] The invention relates to a halogen-free thermosetting resin composition, and also relates to a prepreg and a printed circuit laminate made of the halogen-free thermosetting resin composition. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Ele...

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Problems solved by technology

[0005] CN101796132A discloses the use of cyanate ester, epoxy resin, polyphenylene ether resin and bromine-containing flame retardant to blend to obtain a copper-clad laminate with heat resistance, good dielectric properties, and low CTE, but it is a bromine-containing flame-retardant; patent Disclosed in CN103694642A adopts epoxy resin, cyanate compound or / and cyanate prepolymer, polyphosphonate or / and phosphonate-carbonate copolymer to prepare the non-conductive material with good dielectric performance and heat and humidity resistance. Halogen UL94V-0 is flame retardant, but its peel strength, interlayer adhesion and bending strength are low

Although the above resins have good dielectric properties, they all have defects such as difficult processing, poor heat resistance, and poor peel strength, which cannot meet the requirements of high-frequency and high-speed copper clad substrates.

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