Formaldehyde-removing coating and preparation method thereof
A coating and formaldehyde technology, applied in the field of formaldehyde removal coating and preparation, to achieve the effect of solving coating adhesion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0015] The present invention includes the following materials in parts by weight: 35 parts of film-forming substances, 8 parts of pigments and fillers, 10 parts of TiO2, and 10 parts of solvent. 10 μm coating.
[0016] The film-forming material is acrylic resin, epoxy resin or polyurethane resin; pigments and fillers include 3 parts of Ni powder and 5 parts of silver-coated copper powder, which contain 3% silver by weight; additives include adhesion promoter Silok535, the content It accounts for 0.2% of the film-forming substance, and the dispersant Efka3550, the content accounts for 0.2% of the pigment; the diluent corresponding to the acrylic resin includes the following volume ratio materials: butyl acetate 10: xylene 44: cyclohexanone 10; epoxy resin corresponding The diluent includes materials in the following volume ratio: butyl acetate 35: methyl ethyl ketone 35: cyclohexanone 10; the diluent corresponding to the polyurethane resin includes materials in the following vo...
Embodiment 2
[0018] The present invention includes the following materials in parts by weight: 38 parts of film-forming substances, 12 parts of pigments and fillers, 8 parts of TiO2, and 11 parts of solvents. 20 μm coating.
[0019] The film-forming material is acrylic resin, epoxy resin or polyurethane resin; pigments and fillers include 5 parts of Ni powder and 6 parts of silver-coated copper powder, which contain 5% silver by weight; additives include adhesion promoter Silok535, the content It accounts for 0.4% of the film-forming substance, and the dispersant Efka3550, the content accounts for 0.4% of the pigment; the diluent corresponding to the acrylic resin includes the following volume ratio materials: butyl acetate 10: xylene 44: cyclohexanone 10; epoxy resin corresponding The diluent includes materials in the following volume ratio: butyl acetate 35: methyl ethyl ketone 35: cyclohexanone 10; the diluent corresponding to the polyurethane resin includes materials in the following v...
Embodiment 3
[0021] The present invention includes the following materials in parts by weight: 40 parts of film-forming substances, 15 parts of pigments and fillers, 5 parts of TiO2, and 12 parts of solvents. 25 μm coating.
[0022] The film-forming material is acrylic resin, epoxy resin or polyurethane resin; pigments and fillers include 10 parts of Ni powder and 8 parts of silver-coated copper powder, which contain 9% silver by weight; additives include adhesion promoter Silok535, the content It accounts for 0.6% of the film-forming substance, and the content of dispersant Efka3550 accounts for 0.6% of the pigment; the diluent corresponding to the acrylic resin includes the following volume ratio materials: butyl acetate 10: xylene 44: cyclohexanone 10; the corresponding diluent of epoxy resin The solvent includes materials in the following volume ratio: butyl acetate 35: methyl ethyl ketone 35: cyclohexanone 10; the diluent corresponding to the polyurethane resin includes materials in t...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com