A kind of interconnection material and preparation method thereof

An interconnection material, nano-copper technology, applied in nanotechnology for materials and surface science, metal processing equipment, transportation and packaging, etc., can solve the problems of easy oxidation, easy agglomeration, affecting the use of electronic materials interconnection Achieve the effect of good oxidation resistance, good dispersion, and lowering the sintering temperature of the package

Active Publication Date: 2019-07-26
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, commercially available micro-nano copper powder is generally used to apply to interconnection materials, which is easy to oxidize and agglomerate, which greatly affects the interconnection and use of electronic materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0037] The present invention also provides a method for preparing an interconnect material, comprising the following steps:

[0038] a) mixing a slightly soluble copper source, a protective agent, a complexing agent, a reducing agent and a solvent, and reacting at 50-150° C. to form an imidazole compound-coated nano-copper particle powder;

[0039] The slightly soluble copper source is selected from one or more of copper hydroxide, copper acetylacetonate, basic copper carbonate, copper oleate and copper oxalate;

[0040] The complexing agent is selected from one or more of benzotriazole, alkylimidazole, benzimidazole, alkylbenzimidazole and alkylphenylimidazole;

[0041] b) mixing the imidazole compound-coated nano-copper particle powder with a dispersion liquid, ultrasonically dispersing and vacuum defoaming treatment, to obtain a nano-copper paste interconnection material.

[0042]According to the present invention, a slightly soluble copper source, a protective agent, a co...

Embodiment 1

[0062] Add slightly soluble copper source copper hydroxide, protective agent polyvinyl alcohol, complexing agent alkylimidazole, reducing agent citric acid in ethanol solvent, wherein, the concentration of copper source in the solvent is 0.005mol / L, protective agent and copper The molar ratio of the source is 1:3, the molar ratio of the complexing agent to the copper source is 1:2, and the molar ratio of the reducing agent to the copper source is 1:6; after the above-mentioned raw material solution is stirred evenly, it is slowly heated to 120°C, and at the same time After keeping stirring at a constant speed for 30 minutes, a reaction solution was formed; cooled to room temperature, centrifuged and washed 5 times with deionized water at 6000r / min, and the precipitate was vacuum-dried to obtain nano-copper particle powder coated with alkylimidazole in situ, wherein , the particle size of nano-copper particles is 20nm. After grinding and dispersing the obtained alkylimidazole-c...

Embodiment 2

[0065] Add slightly soluble copper source basic copper carbonate, protective agent sodium lauryl sulfate, complexing agent alkylbenzimidazole, reducing agent L-ascorbic acid in ethylene glycol solvent, wherein, the concentration of copper source in the solvent is 0.016mol / L, the mol ratio of protective agent and copper source is 1: 5, the mol ratio of complexing agent and copper source is 1: 2.5, the mol ratio of reducing agent and copper source is 1: 2; The above-mentioned raw material liquid is stirred After uniformity, slowly heat to 80°C and keep stirring at a constant speed for 120 minutes to form a reaction solution; cool to room temperature, wash with absolute ethanol for 5 times at 8000r / min, take the precipitate and dry it in vacuum to obtain the original alkylbenzimidazole Copper nano particles powder coated with bits, wherein the particle size of the copper nanoparticles is 35nm. After grinding and dispersing the obtained alkylbenzimidazole-coated nano-copper partic...

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Abstract

The invention provides an interconnect material, comprising imidazole compound-coated nano-copper particle powder and a dispersion liquid; in the imidazole compound-coated nano-copper particle powder, the imidazole compound coated on the surface of the nano-copper particle One or more selected from benzotriazole, alkylimidazole, benzimidazole, alkylbenzimidazole and alkylphenylimidazole. The interconnection material provided by the invention has good oxidation resistance and good dispersibility, and can be better applied to the manufacture of high-end electronic devices and the field of semiconductor packaging; in addition, the use of the interconnection material can also reduce the packaging and sintering temperature of interconnected electronic components , to achieve low-temperature interconnection. The present invention also provides a preparation method for the above-mentioned interconnection material. The interconnection material prepared according to the preparation method of the present invention is a nano-copper paste interconnection material, which has good oxidation resistance, and the imidazole-coated copper in the interconnection material paste The particle powder is uniformly dispersed, and the copper particles in it are nano-scale particles with good monodispersity.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an interconnect material and a preparation method thereof. Background technique [0002] High-power power electronic devices or semiconductor devices need to have good conversion characteristics and working capabilities at high temperatures. In addition to the performance of each component in the device, the packaging of the components also affects the performance and long-term reliability of power electronic devices or semiconductor devices. Power electronic devices or semiconductor devices are electronic interconnects / electronic assembly products, which include substrates-interconnection materials-chips in sequential contact, and the chip and substrate are connected and packaged through interconnection materials; in electronic interconnections or electronic assembly products , The interconnection material not only realizes the connection and packaging of the chip a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02B22F9/24B82Y40/00B82Y30/00
CPCB82Y30/00B82Y40/00B22F9/24B22F1/16
Inventor 张昱崔成强张凯陈云高健贺云波陈新
Owner GUANGDONG UNIV OF TECH
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