Double-component epoxy resin pouring sealant

A technology of epoxy resin and potting glue, which is applied in the field of electronic information, can solve the problems that it is difficult to meet the packaging requirements of high-power electronic modules, cannot meet the packaging requirements of high-power electronic modules, and the tensile strength is reduced, so as to avoid the decline of thermal conductivity , Improve the interface contact state, improve the effect of thermal conductivity

Inactive Publication Date: 2017-10-10
常州水精灵环保设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the presence of phenyl and hydroxyl groups, the material has high crosslink density, poor mechanical properties and low thermal conductivity after curing, making it difficult to meet the packaging requirements of high-power electronic modules.
Filling epoxy resin with inorganic mineral fillers such as active silica powder, active calcium carbonate and active aluminum hydroxide to prepare epoxy resin potting compound can improve the thermal conductivity of epoxy potting compound, but it cannot meet the requirements of high-power electronic module packaging. Requirements, and there are the following problems: the filler is easy to form local agglomeration, and when the potting compound is subjected to external force, it is easy to form cracks due to excessive local stress, resulting in a decrease in tensile strength

Method used

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  • Double-component epoxy resin pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0027] First, take 20 parts of silicon carbide with a particle size of 8 μm, 30 parts of aluminum oxide with a particle size of 30 μm, and 20 parts of aluminum nitride with a particle size of 80 μm in the order of parts by weight, and stir and mix at a speed of 400 r / min in a mixer 2h, get particle filler; then take 80 parts of epoxy resin, 20 parts of thinner, 10 parts of fibrous filler, 10 parts of sheet filler, 8 parts of particle filler, 1 part of dispersant, 1 part of Degassing agent, stir and mix epoxy resin, diluent, dispersant and defoaming agent for 30 minutes, then add fibrous filler, sheet filler and granular filler in turn, and disperse for 1 hour with a high-speed disperser, and then undergo vacuum degassing to obtain A component; again by weight, take 80 parts of curing agent, 8 parts of dibutyl phthalate, 0.6 part of DMP-30 epoxy accelerator, 10 parts of hydrotalcite, 1 part of dispersant, 1 part of Degassing agent, stir and mix curing agent, dibutyl phthalate, ...

example 2

[0029]First, mix magnesium aluminum hydrotalcite with deionized water at a mass ratio of 1:50, then ultrasonically disperse for 38 minutes at an ultrasonic frequency of 43kHz, and then add 0.4 times the mass of magnesium aluminum hydrotalcite to the deionized water Sodium dodecylbenzene sulfonate, followed by stirring and reacting at a constant temperature for 4 hours at a temperature of 60°C and a rotating speed of 500r / min, and then filtered, washed and dried to obtain a modified hydrotalcite; in parts by weight, Take 30 parts of silicon carbide with a particle size of 9 μm, 35 parts of alumina with a particle size of 40 μm, and 25 parts of aluminum nitride with a particle size of 90 μm in a mixer, and stir and mix at a speed of 500 r / min for 3 hours to obtain a granular filler; then In parts by weight, take 90 parts of epoxy resin, 25 parts of diluent, 9 parts of particle filler, 2 parts of dispersant, 2 parts of defoamer, and stir epoxy resin, diluent, dispersant and defoam...

example 3

[0031] First, mix magnesium aluminum hydrotalcite with deionized water at a mass ratio of 1:45, then ultrasonically disperse for 36 minutes at an ultrasonic frequency of 41kHz, and then add 0.3 times the mass of magnesium aluminum hydrotalcite to the deionized water Sodium dodecylbenzene sulfonate, followed by stirring and reacting at a constant temperature for 3 hours at a temperature of 58°C and a rotational speed of 450r / min, and then filtered, washed and dried to obtain a modified hydrotalcite; then calculated in parts by weight , take 85 parts of epoxy resin, 22 parts of diluent, 11 parts of fibrous filler, 1 part of dispersant, 2 parts of defoamer, stir and mix epoxy resin, diluent, dispersant and defoamer for 33 minutes, and then Add fibrous filler, disperse with a high-speed disperser for 1 hour, and then undergo vacuum defoaming to obtain component A; then take 85 parts of curing agent, 9 parts of dibutyl phthalate, and 0.6 part of DMP in order by weight. -30 epoxy ac...

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Abstract

The invention discloses a double-component epoxy resin pouring sealant and belongs to the technical field of electronic information. According to the double-component epoxy resin pouring sealant, firstly, epoxy resin, a diluent, a dispersant and a defoaming agent are mixed, fibrous filler, flaky filler and granular filler are sequentially added, high-speed dispersion and vacuum defoaming are performed, a component A is obtained, a curing agent, dibutyl phthalate, a DMP-30 epoxy accelerator, a dispersant and a defoaming agent are mixed, hydrotalcite is added, high-speed dispersion and vacuum defoaming are performed, a component B is obtained, and the component B and the component A are subjected to separate filling and mixed and blended uniformly in proportion during usage. The double-component epoxy resin pouring sealant has the benefits as follows: the double-component epoxy resin pouring sealant has higher thermal conductivity, meets the packaging requirement of high-power electronic modules and is worth popularization and use.

Description

technical field [0001] The invention relates to a two-component epoxy resin potting glue, which belongs to the technical field of electronic information. Background technique [0002] Epoxy resin has many excellent properties, but it is brittle, easy to crack, low thermal conductivity, and poor adhesion, which cannot meet the requirements of some occasions, which limits its application in the field of electronic information where circuit components are highly concentrated. Potting glue, also known as electronic glue, is a broad term used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. [0003] Epoxy resin potting glue is divided into one-component epoxy resin potting glue and two-component epoxy resin potting glue. Among them, the main resin of the two-component epoxy re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
CPCC08K3/26C08K3/34C08K5/12C08K7/06C08K7/14C08K9/04C08K13/06C08K2003/2227C08K2003/282C09J11/04C09J11/06C09J163/00
Inventor 周文斌方晓俊许蘅
Owner 常州水精灵环保设备有限公司
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