Chip fixed resistor and manufacturing method therefor
A technology of fixed resistance and manufacturing method, which is applied in the direction of resistance terminals/electrodes, resistors with lead-out terminals, manufacturing package/shell resistors, etc., which can solve the problems of low repeatability, poor product consistency, and low product accuracy, etc. Achieve the effect of good repeatability, good high frequency characteristics and high product accuracy
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[0047] see figure 1 , this embodiment provides a method for manufacturing a chip fixed resistor, the method for manufacturing a chip fixed resistor includes:
[0048] Step S101 : forming a first metal electrode layer 102 on a predetermined area on the back of a ceramic substrate 101 .
[0049]The ceramic substrate 101 has excellent electrical insulation performance, high thermal conductivity and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. Therefore, the ceramic substrate 101 can be used as a basic material for high-power power electronic circuit structure technology and interconnection technology. In this embodiment, the first metal electrode layer 102 may be formed on a predetermined area on the back of the ceramic substrate 101 by, but not limited to, sputtering, evaporation or screen printing.
[0050] Step S102 : pressing the alloy foil layer 103 on the front surface of the ceramic substrate 101 .
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