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Resin Composition for Encapsulation

A resin composition, epoxy resin technology, applied in lighting devices, other chemical processes, chemical instruments and methods, etc., can solve the problems of decreased brightness, no longer emitting light, weak moisture resistance of organic EL components, etc. Excellent effect of moist heat resistance and moisture permeability resistance

Active Publication Date: 2022-03-15
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the resistance of organic EL elements to moisture is very weak, and there are the following problems: the organic material itself deteriorates under the action of moisture, the brightness decreases, or it no longer emits light, or the interface between the electrode and the organic EL layer is affected by moisture. The lower peeling, or the metal of the electrode is oxidized and becomes high resistance, so the operation of encapsulating the organic EL element is carried out
However, on the other hand, there is a problem that organic EL elements deteriorate due to the heating temperature during thermal curing.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0101] The method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include a method of adding a solvent or the like to the compounding components as needed, and mixing with a kneading roll, a rotary mixer, or the like.

[0102] The resin composition of the present invention can be used for encapsulating electronic components such as semiconductors, solar cells, high-brightness LEDs, LCDs, and EL elements. In particular, it can be suitably used for encapsulation of organic EL elements, specifically, it can be applied to the upper portion and / or surrounding (side portion) of the light-emitting portion of the organic EL element to protect the light-emitting portion of the organic EL element from the outside.

[0103] When applying the resin composition of this invention to an organic EL element, the transparency of the encapsulating layer formed from a resin composition can be measured with a spectrophotometer. From th...

Embodiment

[0122] Hereafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. In addition, in the following description, unless otherwise specified, "part" means "mass part", and "%" means "mass %".

[0123] First, materials used in Examples and Comparative Examples will be described.

[0124] (A) Modified polyolefin resin

[0125] ・T-YP429 (manufactured by Starlight PMC): 2-ethylhexyl acrylate and maleic anhydride modified ethylene-methyl methacrylate copolymer (ethylene unit / methyl methacrylate unit=68% by mass / 32% by mass %, maleic anhydride group concentration is 0.46mmol / g, the number-average molecular weight of modified copolymer is 2300, and the number-average molecular weight of grafted chain is 386, and the content of the 2-ethylhexyl acrylate unit in the grafted chain is 50% by mass)

[0126] ・T-YP430 (manufactured by Starlight PMC): 2-ethylhexyl acrylate and maleic anhydride modified ethylene-methyl methacrylate co...

Embodiment 2

[0165] 2-Ethylhexyl acrylate and 37 parts of maleic anhydride modified ethylene-methyl methacrylate copolymer (T-YP430, 20% toluene solution) were mixed with purified saturated hydrocarbon resin (TFS13 -030, 60% toluene solution) 35 parts, mixed with a high-speed rotary mixer to obtain a uniform mixed solution. Using a high-speed rotary mixer, uniformly mix 27 parts of glycidyl methacrylate modified ethylene-methyl methacrylate copolymer (T-YP432, 20% toluene solution) and anionic polymerization type curing accelerator in the mixed solution (TAP) 0.5 part to obtain a varnish. Using a metal die coater, the obtained varnish was uniformly coated on the release-treated surface of a PET film (thickness 30 μm) treated with a silicone-based release agent, and heat-cured at 130° C. for 60 minutes, thereby A sealing sheet having a resin composition layer thickness of 20 μm was obtained.

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Abstract

The present invention provides a resin composition for encapsulation excellent in adhesiveness, adhesive moisture heat resistance, and workability, and a resin composition sheet for encapsulation obtained therefrom. The present invention provides a resin composition for encapsulation, which is characterized in that it contains (A) polyolefin resin modified by (meth)acrylic acid alkyl ester and acid anhydride, (B) epoxy resin, and (C) sticky resin.

Description

technical field [0001] The present invention relates to a resin composition for encapsulation, a sheet for encapsulation, and the like, and particularly relates to a resin composition for encapsulation, a sheet for encapsulation, and the like that can be suitably used for encapsulation of organic EL elements. Background technique [0002] An organic EL (Electroluminescence, electroluminescence) element is a light-emitting element using an organic substance as a light-emitting material, and is a material that has attracted attention in recent years because it can obtain high-intensity light emission at a low voltage. However, the resistance of organic EL elements to moisture is very weak, and there are the following problems: the organic material itself deteriorates under the action of moisture, the brightness decreases, or it no longer emits light, or the interface between the electrode and the organic EL layer is affected by moisture. The organic EL element was encapsulated...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/08C08L23/26C08L63/00C08L101/12C09K3/10H01L51/50H05B33/04H05B33/10
CPCC09K3/10C08L23/08C08L23/26C08L63/00C08L101/12H05B33/04H05B33/10H10K50/8426C08L23/0869C08L2203/162
Inventor 高瀨舞山本有希本間达也中岛聪马场英治大桥贤
Owner AJINOMOTO CO INC
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