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Method for preparing copper calcium titanate high-dielectric coating layer by plasma spraying technology
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A technology of copper calcium titanate and plasma, which is applied in the direction of coating, metal material coating process, molten spraying, etc., can solve the problems of limited application, and achieve the effects of good durability, stable coating composition and high deposition efficiency
Inactive Publication Date: 2017-12-12
NINGBO RUILONG SURFACE TECH CO LTD
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Problems solved by technology
[0004] Previously, plasma spraying technology was mainly used for surface treatment of bulk material substrates, which limited the application of this technology on the surface of thin film substrates
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[0019] (2) The thickness of the aluminum foil substrate is 150 μm, rinsed with ethanol, and ultrasonically cleaned for 30 minutes, dried and then sandblasted until the surface is evenly roughened;
[0020] (3) The plasma gas argon is 50L / min, the hydrogen is 4L / min, the flow rate of powder carrier gas nitrogen is 8g / min, the powder feeding amount is 45g / min, the power is 85KW, the spraying distance is 80mm, and the substrate preheating temperature is controlled At 120°C, a calcium copper titanate coating was prepared.
Embodiment 2
[0022] (1) Select calcium copper titanate powder with a particle size of 80-120 μm;
[0023] (2) The thickness of the aluminum foil substrate is 150 μm, rinsed with ethanol, and ultrasonically cleaned for 30 minutes, dried and then sandblasted until the surface is evenly roughened;
[0024] (3) The plasma gas argon is 50L / min, the hydrogen is 4L / min, the flow rate of powder carrier gas nitrogen is 8g / min, the powder feeding volume is 45g / min, the power is 85KW, the spraying distance is 100mm, and the substrate preheating temperature is controlled At 120°C, a calcium copper titanate coating was prepared.
Embodiment 3
[0026] (1) Select calcium copper titanate powder with a particle size of 80-120 μm;
[0027] (2) The thickness of the aluminum foil substrate is 150 μm, rinsed with ethanol, and ultrasonically cleaned for 30 minutes, dried and then sandblasted until the surface is evenly roughened;
[0028] (3) The plasma gas argon is 50L / min, the hydrogen is 4L / min, the flow rate of powder carrier gas nitrogen is 8g / min, the powder feeding amount is 45g / min, the power is 85KW, the spraying distance is 120mm, and the substrate preheating temperature is controlled At 120°C, a calcium copper titanate coating was prepared.
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Abstract
The invention provides a method for preparing a coppercalciumtitanate high-dielectriccoating layer by a plasma spraying technology. The method for preparing the coppercalciumtitanate high-dielectriccoating layer comprises the following steps: (1) coppercalciumtitanatepowder is selected; (2) the surface of a substrate aluminum foil to be sprayed is pretreated; and (3) the pretreated aluminum foil substrate is fixed on a steel plate; argon and hydrogen are selected as ion gas; nitrogen is as powder feeding carrier gas; and the plasma spraying is performed on the surface of the substrate through vacuum plasma spraying equipment to prepare the copper calcium titanate high-dielectriccoating layer. The coating layer prepared by the method is compact in structure, low in porosity, high in dielectric constant and excellent in durability, and can be applied to application of a coating layer on the surface of a film basal body.
Description
technical field [0001] The invention relates to a preparation technology of thermal spraying coating, in particular to a method for preparing copper calcium titanate high dielectric ceramic coating on aluminum foil through a plasma spraying system. Background technique [0002] Calcium copper titanate (CaCu 3 Ti 4 o 12 ) is a basic raw material for electronic ceramic materials, and one of the important raw materials that are widely used and used in large quantities in electronic ceramics. The calcium copper titanate compound has a perovskite cubic crystal structure. Recent literature has reported that CaCu 3 Ti 4 o 12 It has an abnormal giant dielectric constant (ε≈104-105) and extremely low loss (tgδ≈0.03), especially in a wide temperature range (100-400K), the dielectric constant value is almost unchanged, reflecting the High thermal stability for dielectric response. And it does not require a special manufacturing process, and the sintering temperature is not high...
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