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Rare earth tin-base alloy for copper alloy hot dip and preparation method of rare earth tin-base alloy

A tin-based alloy, copper alloy technology, applied in hot dip plating process, metal material coating process, coating and other directions, can solve the problems of short circuit of electronic connectors or integrated circuit boards, long residence time at room temperature, etc., to achieve wetting Good properties and adhesion, low cost and simple alloy composition

Inactive Publication Date: 2017-12-15
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Pure tin should not be directly used in the hot-dip plating process. The main reason is that the long residence time at room temperature or high temperature work will easily cause conductive whiskers to form on the surface of the hot-dip tin material, causing short circuits in electronic connectors or integrated circuit boards. It is of great significance to study tin-based alloys for hot-dip copper alloy materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A rare-earth tin-based alloy for hot-dip plating of Cu-Ni-Si series alloy strips, consisting of the following elements by mass fraction: 0.5% Ni, 0.15% Ag, 0.05% RE, the balance being Sn and unavoidable Impurity elements; the RE is a mixture of La, Ce, Pr and Nd in a mass ratio of 45:30:20:5; the purity of the RE is 99.9% based on the sum of the mass fractions of La, Ce, Pr and Nd above;

[0024] The preparation method of the rare earth tin-based alloy comprises the following steps:

[0025] (1) Preparation of the master alloy: Master alloy SnNi5 and master alloy SnAg3.5 are both prepared by the following method: weigh the ingredients according to the mass fraction of each element of the master alloy (take the master alloy SnNi5 as an example, weigh according to the mass ratio of 95:5 Take pure Sn and pure Ni), put it into a water-cooled copper-jacketed vacuum non-consumable melting furnace, evacuate to a pressure of 0.007Pa in the furnace, then fill it with argon to 0...

Embodiment 2

[0029] A rare-earth-tin-based alloy for Cu-Ni-Si series alloy strip hot-plating, consisting of the following elements by mass fraction: 1.0% Ni, 0.2% Ag, 0.25% RE, the balance being Sn and unavoidable Impurity elements; the RE is a mixture of La, Ce, Pr and Nd in a mass ratio of 45:30:20:5; the purity of the RE is 99.9% based on the sum of the mass fractions of La, Ce, Pr and Nd above;

[0030] The preparation method is the same as in Example 1. The performance indicators of the rare earth tin alloy in the example are: standard electrode potential 0.3291V, melting point 198.9°C, tensile strength 77.8MPa, and elongation 45.2%.

Embodiment 3

[0032] A rare-earth tin-based alloy for hot-dip plating of Cu-Ni-Si series alloy strips, consisting of the following elements by mass fraction: 1.5% Ni, 0.3% Ag, 0.5% RE, the balance being Sn and unavoidable Impurity elements; the RE is a mixture of La, Ce, Pr and Nd in a mass ratio of 45:30:20:5; the purity of the RE is 99.9% based on the sum of the mass fractions of La, Ce, Pr and Nd above;

[0033] The preparation method is the same as in Example 1. The performance indicators of the rare earth tin alloy in the example are: standard electrode potential 0.3178V, melting point 208.9°C, tensile strength 90.4MPa, and elongation 36.1%.

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Abstract

The invention relates to a rare earth tin-base alloy for copper alloy hot dip. The rare earth tin-base alloy comprises, by mass, 0.1-2.5% of Ni, 0.1-0.5% of Ag, 0.05-0.35% of RE, the balance Sn and unavoidable impurity elements. The rare earth tin-base alloy for copper alloy hot dip has the advantages that alloy ingredients are relative simple, the cost is low, the thickness of a hot dip layer IMC is low, the trend of thickness enlarging is small, cavities and whisker are not easy to generate, and the rare earth tin-base alloy can be used for processing copper and copper alloy strips, especially CuNiSi series of alloy strips. Copper strip products obtained after the alloy is subjected to hot dip are mainly used for manufacturing various types of electronic connectors, electronic connector assemblies and the like in the fields such as integrated circuits, electronic products, intelligent devices and automobile industries.

Description

technical field [0001] The invention relates to the field of metal coating materials, in particular to a rare earth tin-based alloy for copper alloy hot-plating and a preparation method thereof. Background technique [0002] Tinned copper alloy strips are widely used in high-end fields such as aerospace, military industry, automobiles, communications and electronics. Although my country's copper strip industry continues to develop, tinned copper alloy strips still cannot meet market demand. At present, the research on the structure, performance and production process of the tin-plated layer of copper alloy strips mainly focuses on the research of electro-tin plating. The main advantage of electro-tin plating is that the thickness of the coating metal can be controlled at will, but its production process is cumbersome and the operation requirements are strict. , The price of electroplating equipment is high, and the composition of electroplating solution is complicated. [0...

Claims

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Application Information

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IPC IPC(8): C22C13/00C22C1/03C23C2/08
CPCC22C1/03C22C13/00C23C2/08
Inventor 田保红刘玉亮李武会张毅殷婷王冰洁孙国强田然赵转张晓辉刘勇李全安王顺兴
Owner HENAN UNIV OF SCI & TECH
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