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Resin composition

A technology of resin composition and compound, applied in electrical components, circuits, organic chemistry, etc., can solve problems such as deterioration of organic EL components, and achieve excellent coating properties and excellent solubility in acetone

Inactive Publication Date: 2018-01-02
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, crown ethers and polyethers are decomposed by the acid generated by the photocationic polymerization initiator to generate out gas, and the organic EL device is degraded by the out gas.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0203] Sodium hydride (comprising 55% by weight of mineral oil) (15.4 g, 352.9 mmol) and DMSO (510.6 g) were added to a 2 L four-necked flask equipped with a condenser, a stirrer and a thermometer, and after cooling to 0° C., A solution obtained by dissolving o-phenylphenol (50.6 g, 297.3 mmol) in DMSO (191.0 g) was added dropwise thereto. Thereafter, it was placed in a 60° C. oil bath, and a solution obtained by dissolving 2-chloroethyl vinyl ether (38.2 g, 358.5 mmol) in DMSO (61.4 g) was added dropwise. After stirring the reaction liquid for 6 hours, after cooling to 0 degreeC, water was slowly dripped and quenched, and it transferred to the separatory funnel. The aqueous layer was extracted with ethyl acetate, and saturated brine was added to the organic layer for washing. Thereafter, the organic layer was separated and dehydrated with anhydrous sodium sulfate, and then the solvent was distilled off to obtain a liquid crude product. This was purified by silica gel column...

Embodiment 1

[0208] Put MPV (82 parts by weight), VCZ (17 parts by weight) and photocationic polymerization initiator (1 part by weight) into the rotation and revolution type stirring and defoaming device (model: AR-250, made by Thinky) and stir to obtain the resin Composition (1).

[0209] The obtained resin composition (1) was cast in a mould, and irradiated with ultraviolet light (irradiation dose: 1500mJ / cm2) from a distance of 10cm with a high-pressure mercury lamp of 200W / cm 2 ).

[0210] The viscosity of the obtained resin composition (1) was measured before ultraviolet irradiation, immediately after ultraviolet irradiation, and 30 minutes after ultraviolet irradiation, and the degree of viscosity increase after ultraviolet irradiation was calculated from the following formula.

[0211] Viscosity increase after UV irradiation = Viscosity 30 minutes after UV irradiation / Viscosity immediately after UV irradiation

[0212] Moreover, the resin composition (1) after ultraviolet irrad...

Embodiment 2~7、 comparative example 1~3

[0214] Except having changed to the composition shown in the following table, it carried out similarly to Example 1, and produced the resin composition and hardened|cured material.

[0215]

[0216] By adding 100 mL of acetone to 1 g of the resin compositions obtained in Examples and Comparative Examples, and stirring the acetone solution obtained by using a magnetic stirrer at 25° C. for 1 hour, the transparency of the resin composition was confirmed visually. Solubility was evaluated.

[0217]

[0218] Preparation of UV delayed curing dam material

[0219] 30 parts by weight of (3,4,3',4'-diepoxy) dicyclohexyl, liquid bisphenol F diglycidyl ether (trade name "YL-983U", manufactured by Mitsubishi Chemical Co., Ltd.) 70 Parts by weight, 4-(4-biphenylthio)phenyl-4-biphenylphenylsulfonium tetrakis(pentafluorophenyl)borate 2 parts by weight, 1,3,4,6-tetraglycidyl 2.5 parts by weight of glycoluril (trade name "TG-G", manufactured by Shikoku Chemical Industry Co., Ltd.), 52 p...

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Abstract

Provided is a resin composition capable of being used as a fill material when sealing an organic EL element using a dam-and-fill encapsulation method, wherein the resin composition has superior coating properties and acetone solubility, allows for the timing of thickening and curing to be designated with discretion, and is capable of forming a cured product having a high refractive index, low moisture permeability, and low levels of outgassing. The resin composition of the present invention comprises a compound (A) represented by formula (a), at least one compound (B) selected from among the compound represented by formula (b-1) and the compound represented by formula (b-2), and a photocationic polymerization initiator (C).

Description

technical field [0001] The present invention relates to a resin composition that can be used as a filling material when sealing an organic electroluminescence element by a dam-fill sealing construction method. This application claims priority based on Japanese Patent Application No. 2016-074517 for which it applied in Japan on April 1, 2016, and uses the content here. Background technique [0002] From the perspective of impact resistance, high visual recognition and diversity of luminous colors, organic EL devices including organic electroluminescent (hereinafter also referred to as "organic EL") elements are used as full-color flat panel displays or as substitutes for LEDs. And highly anticipated. According to the different ways of light export, organic EL devices include top emission type and bottom emission type. [0003] However, organic EL elements are more easily affected by moisture than other electronic components, and there is a problem that the oxidation of elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F2/48C08F216/14C08F228/04H01L51/50H05B33/04H05B33/10C07C43/205C07D209/86
CPCC07C43/205C07D209/86C08F2/48C08F216/14C08F228/04H05B33/04H05B33/10Y02P20/55H10K50/84C07C321/30C08F2/50C08F216/1458C08K5/372
Inventor 江川智哉
Owner DAICEL CHEM IND LTD
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