Metal bonding agent, preparation method and diamond grinding wheel
A technology of metal bond and diamond grinding wheel, which is applied in the direction of metal processing equipment, manufacturing tools, abrasives, etc., can solve the problems of increased grinding force, decreased grinding ability of grinding wheel, and poor wettability of diamond, etc., to achieve enhanced bond strength , increase the grinding life, the effect of poor wear resistance
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[0020] In addition, since the base material of the grinding wheel usually adopts a metal base material, during the sintering process, the metal adhesive can be fused together with the metal base material, thereby effectively enhancing the bonding strength between the metal adhesive and the grinding wheel base material. The silver, copper, titanium and indium in the basic components can be respectively silver powder, copper powder, titanium powder and indium powder. Anti-cracking agent can adopt known material that can strengthen the bonding strength between diamond abrasive and bonding agent, among the present invention, anti-cracking agent is selected from titanium carbide (TiC), titanium nitride (TiN), titanium carbonitride At least one of (TiCN), these three materials have the characteristics of high hardness, high melting point, corrosion resistance, etc., and can enhance the bonding strength of diamond abrasives, prevent cracks in the grinding wheel, and are ideal material...
Embodiment 1
[0032] (1) Roughen the surface of the grinding wheel substrate and put it into a mold.
[0033] (2) Mix the metal bond, diamond abrasive and absolute ethanol uniformly in a weight ratio of 6:1:0.5 to obtain a mixture. Wherein, by weight percentage, the metal binder includes the following components: 55% silver, 22% copper, 2.5% titanium, 10% indium, 10% titanium carbide and 0.5% gold.
[0034] (3) Add the mixture in the step (2) to the mold containing the grinding wheel base material, and carry out pressurization, and the pressure is 20Kg / mm 2 , the temperature is controlled at 20-40°C and kept for 5 minutes. After demoulding and drying at 50-80° C. for 1 hour, a grinding wheel blank is obtained.
[0035] (4) Heat and sinter the grinding wheel blank. When heating and sintering, the vacuum degree is controlled at 10 -4 ~10 -8 mbar, sinter at 200°C for 15 minutes, then raise the temperature to 550°C for 10 minutes, then raise the temperature to 700°C for 10 minutes, then ra...
Embodiment 2
[0039] (1) Roughen the surface of the grinding wheel substrate and put it into a mold.
[0040] (2) The metal bond, the diamond abrasive and the viscosity regulator are combined uniformly in a weight ratio of 6:1:0.5 to obtain a mixture. Wherein, by weight percentage, the metal binder includes the following components: 52% silver, 25% copper, 2.5% titanium, 10% indium, 10% titanium carbide and 0.5% graphene.
[0041] (3) Add the mixture in the step (2) to the mold containing the grinding wheel base material, and carry out pressurization, and the pressure is 20Kg / mm 2 , the temperature is controlled at 20-40°C and kept for 5 minutes. After demoulding and drying at 50-80° C. for 1 hour, a grinding wheel blank is obtained.
[0042] (4) Heat and sinter the grinding wheel blank. When heating and sintering, the vacuum degree is controlled at 10 -4 ~10 -8 mbar, sinter at 200°C for 15 minutes, then raise the temperature to 550°C for 10 minutes, then raise the temperature to 700°C...
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