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A kind of lithium tantalate crystal substrate processing method

A processing method, lithium tantalate technology, applied in semiconductor/solid-state device manufacturing, electrical components, polishing compositions containing abrasives, etc., can solve the problems of long processing time, poor surface flatness of lithium tantalate, and client yield Low-level problems, to achieve the effect of reducing surface roughness, improving surface finish, and improving labor productivity

Active Publication Date: 2020-02-21
TDG HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even if there are tiny defects on the polished surface, it will destroy the surface properties of the crystal material, and even lead to changes in the crystal structure, affecting the frequency accuracy and frequency stability of the component
Lithium tantalate single crystal material is a typical hard and brittle material, and has mechanical properties such as cleavage and anisotropy. It is difficult to obtain high plane precision and no damage to the wafer surface during grinding and polishing. Moreover, the polishing liquid used in the polishing process is Ordinary nano-scale polishing liquid not only makes the processing time longer, but also the obtained lithium tantalate has poor surface flatness (generally above 50 nanometers), poor finish, and cannot achieve the mirror effect
Leading to low yield of the client, increasing the production cost of the client

Method used

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  • A kind of lithium tantalate crystal substrate processing method

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Embodiment 1

[0015] Embodiment 1: A kind of lithium tantalate crystal substrate processing method, comprises slicing, chamfering, blackening, grinding, rough polishing and fine polishing steps, adopted diamond polishing fluid in described rough polishing and fine polishing steps, so Diamond micropowder content is 10% in the diamond polishing liquid, and ethylene glycol content is 13%, and glycerin content is 4%, and ethanol ammonia content is 0.2%, and deionized water content is 72.8%; Concrete steps are as follows:

[0016] 1) Slicing: under the condition that the steel wire speed is 600m / min and the temperature is 22°C±2°C, use a slicer to cut the lithium tantalate ingot into wafers with a thickness of about 270 microns to 280 microns;

[0017] 2) Chamfering: Under the conditions of the grinding wheel speed of 600rpm / min and the temperature of 22°C±2°C, use a chamfering machine to chamfer the right angle of the lithium tantalate wafer into a rounded corner of about R0.1;

[0018] 3) Blac...

Embodiment 2

[0023] Embodiment 2: A kind of lithium tantalate crystal substrate processing method, comprises the steps of slicing, chamfering, blackening, grinding, rough polishing and fine polishing, adopted diamond polishing fluid in described rough polishing and fine polishing steps, so Diamond micropowder content is 13% in the diamond polishing liquid, and ethylene glycol content is 10%, and glycerin content is 3.5%, and ethanol ammonia content is 0.3%, and deionized water content is 73.2%; Concrete steps are as follows:

[0024] 1) Slicing: under the condition that the wire speed is 1000m / min and the temperature is 22°C±2°C, use a slicer to cut the lithium tantalate ingot into wafers with a thickness of about 270 microns to 280 microns;

[0025] 2) Chamfering: Under the conditions of the grinding wheel speed of 800rpm / min and the temperature of 22°C±2°C, use a chamfering machine to chamfer the right angle of the lithium tantalate wafer into a rounded corner of about R0.1;

[0026] 3) ...

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Abstract

The invention relates to a method for machining lithium tantalate crystal substrates, which comprises the steps of slicing, chamfering, blackening, grinding, rough polishing and fine polishing. Duringthe rough polishing step and the fine polishing step, a diamond polishing solution is adopted. The diamond polishing solution is composed of diamond micro-powders, ethylene glycol, glycerol, ethanolammonia and deionized water, wherein the pH value of the diamond polishing solution is 9-11. The content of diamond micro-powders is 20-25%, and the content of ethylene glycol is 8-15%. The content ofglycerol is 3-5%, and the content of ethanol ammonia is 0.1-0.3%. The content of deionized water is 60-65%. According to the invention, the surface smoothness of lithium tantalate crystal substratescan be greatly improved. Meanwhile, the surface roughness of lithium tantalate crystal substrates is reduced, and the stress is eliminated. The mirror surface polishing effect is achieved, so that theproduction cost is reduced. The qualified rate of products is improved.

Description

technical field [0001] The invention relates to the field of processing methods for semiconductor devices, in particular to a processing method for lithium tantalate crystal substrates. Background technique [0002] Lithium tantalate is a typical multifunctional single crystal material with a melting point of 1670°C, a Mohs hardness of 5.5, and a density of 7.459g / cm 3 . Its dielectric constant ε 11 / ε 0 is 51.7, ε 33 / ε 0 is 44.5, piezoelectric strain constant d 22 2.4X10 -11 C / N, d 33 is 0.8×10 -11 C / N, coefficient of thermal expansion (a) 16.1×10 -5 / °C, (c) 4.1×10 -8 / °C, typical directions are X, Z, Y36°, Y42°. It has excellent piezoelectric, electro-optical and pyroelectric properties such as large electromechanical coupling coefficient, low loss, high temperature stability and high frequency performance. With the rapid development of mobile communication and information industry, lithium tantalate wafers are more and more widely used in the manufacture of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02C09G1/02
CPCC09G1/02H01L21/02008H01L21/02013H01L21/02024
Inventor 沈浩顾鑫怡徐秋峰归欢焕丁孙杰
Owner TDG HLDG CO LTD