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A kind of composite copper electrode material based on mesoporous silica and its preparation method

A technology of mesoporous silica and copper electrodes, applied in conductive materials, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of high cost, migration of thermistor elements, and short service life. , to achieve the effect of easy repair, lower production cost and good electrical conductivity

Active Publication Date: 2019-02-19
JIANGSU SHIRUI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electrode materials are mainly copper and silver, which not only have high cost, but also have a short service life, and are prone to element migration when used on thermistors

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A composite copper electrode material based on mesoporous silica, comprising the following components in parts by weight: 40 parts of mesoporous silica, 45 parts of stearic acid, 12 parts of polyethylene glycol, polysiloxane 23 parts, 12 parts of polyethersulfone, 34 parts of nano-copper, 10 parts of copper foam, 1 part of copper oxide, 1 part of nano-carbon fiber, 23 parts of maleic acid, 1-4 parts of cationic surfactant, 1 part of linseed oil.

[0018] The cationic surfactant is acrylamidomethylpropanesulfonic acid.

[0019] The preparation method of the above-mentioned composite copper electrode material based on mesoporous silicon dioxide comprises the following steps:

[0020] Step 1, weigh each component as required;

[0021] Step 2, heating the mixed water bath of mesoporous silica, polyethylene glycol and maleic acid to 80°C, drying in vacuum, and set aside;

[0022] Step 3, put stearic acid, polysiloxane, polyethersulfone, nano-copper, copper foam, copper oxi...

Embodiment 2

[0028] A composite copper electrode material based on mesoporous silica, comprising the following components in parts by weight: 55 parts of mesoporous silica, 52 parts of stearic acid, 35 parts of polyethylene glycol, polysiloxane 28 parts, 32 parts of polyethersulfone, 42 parts of nano-copper, 20 parts of copper foam, 6 parts of copper oxide, 5 parts of nano-carbon fiber, 32 parts of maleic acid, 3 parts of cationic surfactant, 4 parts of linseed oil.

[0029] The cationic surfactant is acrylamidomethylpropanesulfonic acid.

[0030] The preparation method of the above-mentioned composite copper electrode material based on mesoporous silicon dioxide comprises the following steps:

[0031] Step 1, weigh each component as required;

[0032] Step 2: After heating the mixed water bath of mesoporous silica, polyethylene glycol and maleic acid to 75°C, vacuum-dry and set aside;

[0033] Step 3, put stearic acid, polysiloxane, polyethersulfone, nano-copper, copper foam, copper oxi...

Embodiment 3

[0039] A composite copper electrode material based on mesoporous silica, comprising the following components in parts by weight: 40-65 parts of mesoporous silica, 45-58 parts of stearic acid, 12-48 parts of polyethylene glycol 23-29 parts of polysiloxane, 12-48 parts of polyethersulfone, 34-58 parts of nano-copper, 10-28 parts of foamed copper, 1-8 parts of copper oxide, 1-8 parts of nano-carbon fiber, maleic acid 23-47 parts, 1-4 parts of cationic surfactant, 1-5 parts of linseed oil.

[0040] The cationic surfactant is acrylamidomethylpropanesulfonic acid.

[0041] The preparation method of the above-mentioned composite copper electrode material based on mesoporous silicon dioxide comprises the following steps:

[0042] Step 1, weigh each component as required;

[0043] Step 2, heating the mixed water bath of mesoporous silica, polyethylene glycol and maleic acid to 80°C, drying in vacuum, and set aside;

[0044] Step 3, put stearic acid, polysiloxane, polyethersulfone, n...

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Abstract

The invention discloses a composite copper electrode material based on mesoporous silica and a preparation method thereof. The material comprises the following components: mesoporous silica, stearic acid, polyethylene glycol, polysiloxane, polyether sulfone, nano-copper, foamy copper, copper oxide, carbon nanofibres, maleic acid, a cationic surface active agent and linseed oil. The preparation method comprises the following steps: mixing mesoporous silica, polyethylene glycol and maleic acid for heating in water bath, and carrying out vacuum drying for standby use; mixing and putting stearic acid, polysiloxane, polyether sulfone, nano-copper, foamy copper, copper oxide and carbon nanofibres into a tubular furnace, carrying out heat preservation after warming, after natural cooling, addingthe cationic surface active agent and linseed oil, and stirring to extrude master batch; and adopting a direct current magnetron sputtering method to complete the preparation of the composite electrode material. According to the composite copper electrode material, mesoporous silica is taken as a carrier, the material is adhered onto the carrier through a magnetron sputtering method, and the material can be reused, high in thermal conductivity and high in adaptive capacity for external environment.

Description

technical field [0001] The invention belongs to the technical field of copper electrode preparation, and in particular relates to a composite copper electrode material based on mesoporous silicon dioxide and a preparation method thereof. Background technique [0002] With the development of science and technology, a series of problems such as energy shortage and environmental degradation require a new type of energy storage system with high environmental protection efficiency. In many new energy storage systems, the commonly used electrode materials are activated carbon, carbon nanotubes, graphene nickel oxide, manganese oxide, cobalt oxide, etc., which have certain defects in conductivity and cycle stability. Therefore, it is necessary to develop a conductive Electrode materials with better performance and cycle stability. The existing electrode materials are mainly copper and silver, which not only have high cost, but also have a short service life, and are prone to eleme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C1/14H01C17/28H01B1/02H01B1/22
CPCH01B1/026H01B1/22H01C1/14H01C17/28
Inventor 汪洋平德顺
Owner JIANGSU SHIRUI ELECTRONICS CO LTD