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Tin-based paste braze solder and preparation method for same

A brazing solder and tin-based technology, which is applied to welding equipment, welding/cutting media/materials, welding media, etc., can solve the problem of short effective use time of tin-based paste brazing solder, increase storage process and use process complexity , Long time to return to room temperature and other issues, to achieve the effect of no need for cleaning, prolonged performance retention time, and less residue

Active Publication Date: 2018-03-02
SHENZHEN FITECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once the viscosity changes, it can no longer be used
In practical applications, various materials that need to be prepared on site have high requirements on storage conditions, and it takes a long time to return to room temperature after thawing, and they need to be prepared on site, and the effective use time of the prepared tin-based paste brazing solder is very short. These have increased the complexity of the storage process and the use process, and there is an urgent need to provide a tin-based cream solder that does not require on-site preparation, can be used immediately after opening, and can maintain effective properties for a longer period of time after opening

Method used

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  • Tin-based paste braze solder and preparation method for same
  • Tin-based paste braze solder and preparation method for same
  • Tin-based paste braze solder and preparation method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1 prepares tin-based paste brazing solder according to the following steps:

[0027] Step ①: Prepare thermosetting epoxy resin adhesive, also referred to as curable adhesive: Weigh 100g of bisphenol A epoxy resin E51, 5g of amine curing agent dicyandiamide, 1g of imidazole curing accelerator, 0.05g of dicyandiamide The foaming agent polyoxyethylene polyoxypropanolamine ether is added to the polytetrafluoroethylene beaker in turn, and the mixture is evenly stirred to form a curable epoxy resin adhesive, referred to as curable adhesive, which is stored at a low temperature of 0-10°C for later use.

[0028] Step ②: Deploying flux glue: Weigh benzyl alcohol, sebacic acid, adipic acid, diphenylguanidine hydrobromide, Add n-butylamine hydrochloride, liquid hydrogenated castor oil, benzotriazole and curable glue, and add the above-mentioned substances into an enamel cup in turn to prepare a flux glue, and store it at a temperature of 0-10°C for later use.

[0029] ...

Embodiment 2

[0030] The preparation procedure of Example 2 is the same as that of Example 1, and the part that is different from Example 1 is: in the step ② of the preparation of Example 2, the components and mass ratios of the thermosetting flux adhesive are prepared according to the following proportions: benzyl alcohol / glutaric acid / adipic acid / diphenylguanidine hydrobromide / dimethylamine hydrochloride / hydrogenated castor oil / hydroquinone / curable gum = 12 / 10 / 6 / 14 / 3 / 4 / 2 The ratio of / 49 is added to the enamel cup in turn to prepare soldering flux, and it is stored in a refrigerator at 0~10°C for later use; Step 3 of Example 2 is used to prepare conductive solder paste: take out the soldering paste in step ② and return it to room temperature before weighing it 1.7g, and then add 8.3g of Si96.5Ag3Cu0.5 tin powder with a particle size of 5~15 µm, and mix evenly to obtain a tin-based paste brazing solder.

[0031] The tin-based paste brazing solder prepared in Examples 1 and 2 ...

Embodiment 3

[0033] The preparation steps of Example 3 are the same as that of Example 1, and the part that is different from Example 1 is: the steps of the preparation of Example 3 ② The components and ratios of the deployment of thermosetting flux adhesives are changed, and the prepared in Example 3 The thermosetting soldering flux in step ② is formulated according to the following ratio: dimethylacetamide / sebacic acid / glutaric acid / diphenylguanidine hydrobromide / cyclohexylamine hydrochloride / hydrogenated castor oil / carbonic acid ring The ratio of hexylamine / curable glue=20 / 19 / 15 / 21 / 4 / 2 / 1 / 18 (mass ratio) is weighed and prepared, mixed and refrigerated for later use; the tin-based paste brazing prepared in step ③ of Example 3 The soldering process is: take out the soldering paste in step ②, return to room temperature and weigh 1.7g, then add 8.3g of Si42Bi57.6Ag0.4 tin powder with a particle size of 5~15 µm, and mix evenly to obtain tin-based Paste brazing solder. Other steps and process...

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Abstract

The invention provides tin-based paste braze solder and a preparation method for the same. The preparation method comprises steps of (1), evenly mixing 100 parts of epoxy resin according to weight, 1to 15 parts of curing agent according to weight, 0.1 to 1.5 parts of curing accelerator according to weight and 0 to 0.15 part of defrother according to weight to form solidifying glue, (2) orderly adding 20 to 23 parts of diluent according to weight, 15 to 63 parts of activator according to weight, 1 to 6 parts of thixotropic agent according to weight and 5 to 50 parts of solidifying glue according to weight and evenly mixing the above to form heat-set weld-aid glue, and (3) forming all-ready tin-based paste braze solder by 90 to 95 parts of tin-based conductive filler, namely tin-based alloysoldering power and 10 to 25 parts of heat-set weld-aid glue. Onsite preparation can be avoided; long performance stability can be achieved when the tin-based paste braze solder is moved from storagetemperature to user temperature; few post-welding residuals are provided; and the tin-based paste braze solder has great mechanical strength and effective and is energy-saving.

Description

【Technical field】 [0001] The present invention relates to solder used for brazing, in particular to tin-based solder characterized by material composition and properties and a preparation method thereof, especially to soldering that can be conveniently soldered for a long time at room temperature and used for packaging inverted LED chips and / Or other tin-based cream solder for integrated circuit chips, commonly known as tin glue. 【Background technique】 [0002] With the rapid development of electronic technology in modern society, the miniaturization and miniaturization of electronic components, as well as the high density and high integration of printed circuit boards have become the inevitable trend of today's high-tech product development. Conductive adhesives used in high-density, highly integrated electronic component packaging usually use matrix resin and conductive fillers, that is, conductive particles, as the main components. Conductive adhesives have very strict...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/3615B23K35/3618
Inventor 徐朴余道轲王思远陈奎
Owner SHENZHEN FITECH
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